LFX1200EB-04F900C

The LFX1200EB-04F900C is an ispXPGA® Field Programmable Gate Array from Lattice Semiconductor Corporation. It provides on-chip programmable logic resources and high I/O density for custom digital functions, prototyping, and system integration where configurable logic and interface flexibility are required.

Designed for commercial-grade applications, this FPGA combines a substantial logic element count with embedded RAM and a wide I/O complement in a compact 680-ball LBGA package.

Key Features

• Core Logic  Approximately 15,376 logic elements provide the programmable resources needed for implementing custom digital functions and control logic.
• Logic Array Blocks  3,844 logic array blocks (LABs) for structured logic partitioning and design organization.
• Embedded Memory  Approximately 0.42 Mbits of on-chip RAM (423,936 total RAM bits) to support FIFOs, buffers, and small data stores without external memory.
• I/O Count  496 I/O pins to support wide parallel interfaces and multiple peripheral connections.
• Gate Density  Approximately 1,250,000 gates for implementing dense combinational and sequential logic.
• Power Supply  Operates from a 2.3 V to 3.6 V supply range to accommodate common system power rails.
• Package  680-LBGA (supplier package: 680-FPSBGA, 40 × 40 mm) providing a high-pin-count surface-mount solution for compact board designs.
• Mounting & Grade  Surface-mount device rated for commercial temperature operation (0 °C to 85 °C).
• Environmental  RoHS compliant to meet common regulatory and manufacturing process requirements.

Typical Applications

• Custom Digital Prototyping  Implement and iterate custom logic functions and hardware proofs-of-concept using the device’s programmable resources.
• I/O Expansion and Bridging  High I/O count suits the device to bridging, bus translation, and interface aggregation tasks on embedded boards.
• Embedded Control and Glue Logic  Use the FPGA to centralize control logic, peripheral interfacing, and deterministic timing functions within a system.
• Parallel Data Processing  On-chip logic and embedded RAM enable parallel processing tasks, buffering, and small-data manipulation close to the I/O.

Unique Advantages

• High Logic Capacity:  Approximately 15,376 logic elements and 1,250,000 gates provide ample capacity for medium-complexity FPGA designs.
• Substantial On-Chip Memory:  Around 0.42 Mbits of embedded RAM reduces dependence on external memory for buffering and small data structures.
• Very High I/O Count:  496 I/Os enable broad connectivity for multi-peripheral systems and wide parallel interfaces, reducing external interface components.
• Flexible Power Range:  2.3 V to 3.6 V operation supports integration into a variety of commercial power architectures.
• Compact, High-Pin-Count Package:  680-LBGA (680-FPSBGA, 40 × 40 mm) delivers high integration density in a surface-mount form factor suitable for space-constrained boards.
• Commercial Temperature Grade:  Rated 0 °C to 85 °C for reliable operation in general-purpose commercial environments.

Why Choose LFX1200EB-04F900C?

The LFX1200EB-04F900C positions itself as a versatile, commercial-grade ispXPGA FPGA offering a balance of logic density, on-chip memory, and expansive I/O in a compact LBGA package. It is well-suited to designers and teams implementing medium-complexity custom logic, I/O-rich interfaces, and embedded control tasks where on-chip resources and a small board footprint are priorities.

With a broad supply voltage window and RoHS compliance, this device supports a range of commercial system designs and can streamline BOM and board-level integration by consolidating logic and interface functions into a single programmable device.

Request a quote or submit an inquiry to check availability and pricing for the LFX1200EB-04F900C. Our team can provide procurement details and help with volume or delivery questions.