LFSCM3GA80EP1-7FFN1152C

The LFSCM3GA80EP1-7FFN1152C is a commercial-grade FPGA from the LatticeSC/M family that combines a high-performance programmable fabric with extensive embedded memory and a large number of I/Os. This device delivers 80,000 logic elements, approximately 5.82 Mbits of on-chip RAM, and 660 I/Os in a 1152-BBGA package for applications that require dense logic, high I/O count, and significant embedded memory.

Designed for communication and system-integration roles, the device leverages family-level high-speed SERDES, advanced I/O capabilities and a precision clocking network to support complex protocol handling, data buffering and system-level control.

Key Features

• Programmable Fabric  Approximately 80,000 logic elements provide a large, flexible logic resource for implementing complex state machines, protocol engines and custom datapaths.
• Embedded Memory  Approximately 5.82 Mbits of on-chip RAM (total RAM bits: 5,816,320) for FIFOs, frame buffers and on-chip data storage; supports true dual-port, pseudo dual-port and single-port configurations at family-level block RAM performance.
• High I/O Count  660 user I/Os support extensive parallel interfaces, multi-bank connections and high-pin-count system designs.
• High-Speed SERDES and flexiPCS (family)  LatticeSC/M family devices include 4 to 32 high-speed SERDES channels (family-level); typical channel performance ranges from 600 Mbps to 3.8 Gbps and includes built-in pre-emphasis, equalization and embedded PCS options for common serial protocols.
• PURESPEED™ I/O (family)  High-performance I/Os support differential DDR up to 2 Gbps and single-ended memory interfaces up to 800 Mbps, with programmable input delay, adaptive input logic and programmable on-die termination for robust timing and signal integrity.
• Precision Clocking  Family-level sysCLOCK network provides up to eight analog PLLs (15 MHz–1 GHz), twelve DLLs (100 MHz–700 MHz), 700 MHz primary clocks and 1 GHz I/O-connected edge clocks for low-jitter, multi-domain clocking.
• Power and Supply  Device core voltage supply range is 0.95 V to 1.26 V, enabling low-voltage operation within the specified range.
• Package and Mounting  1152-BBGA package (supplier package: 1152-FPBGA, 35 × 35 mm) with surface mount technology for high-density board designs.
• Operating Conditions and Compliance  Commercial temperature grade: 0 °C to 85 °C. RoHS compliant.
• System-Level Support (family)  Includes IEEE 1149.1 Boundary Scan, ispTRACY™ internal logic analyzer capability, IEEE 1532 in-system configuration and options for low-cost SPI flash configuration and onboard oscillator usage.

Typical Applications

• High-Speed Networking  Implements protocol processing, frame buffering and line-rate interfacing using the device’s high-speed SERDES (family-level) and abundant on-chip RAM.
• Protocol Bridging and Interface Aggregation  Large I/O count and flexible I/O standards support multi-protocol bridges, protocol conversion and aggregation functions in communication equipment.
• Data Path and Packet Processing  On-chip memory and dense logic elements enable packet buffering, stateful processing and custom packet-handling pipelines.
• High-Performance Embedded Systems  Use the FPGA fabric and system-level features for embedded controllers, hardware accelerators and interface controllers that require extensive I/O and memory resources.

Unique Advantages

• High integration density:  80,000 logic elements plus approximately 5.82 Mbits of embedded RAM reduce external component count and simplify board-level design.
• Large I/O resource:  660 I/Os let you connect many high-speed interfaces and parallel peripherals without multiplexing compromises.
• Flexible high-speed serial capability (family):  SERDES and embedded PCS implementations at the family level enable integration of common serial links and protocol stacks, reducing development time for serial interfaces.
• Advanced clocking and timing:  Multiple PLLs and DLLs with high-frequency support allow precise multi-domain clocking and low-jitter system timing for demanding interfaces.
• Commercial-grade temperature and RoHS compliance:  0 °C to 85 °C operating range and RoHS compliance support mainstream commercial products and regulatory needs.
• High-density BGA packaging:  1152-BBGA (35 × 35 mm) delivers a compact, high-pin-count solution for space-constrained, high-I/O PCBs.

Why Choose LFSCM3GA80EP1-7FFN1152C?

The LFSCM3GA80EP1-7FFN1152C positions itself as a high-density, memory-rich FPGA suited to communication and embedded system designs that require substantial logic, on-chip RAM and many I/Os. Its LatticeSC/M family heritage brings high-speed serial capability, advanced I/O features and extensive clocking resources to support complex protocol and data-path implementations.

This device is a fit for engineering teams building communication equipment, protocol bridges, data-path accelerators and high-performance embedded controllers who need a commercially graded, RoHS-compliant FPGA with substantial on-chip memory and I/O capacity. The integrated system features reduce external components and help accelerate development cycle time.

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