LFX1200C-04F900C

The LFX1200C-04F900C is an ispXPGA® family field programmable gate array from Lattice Semiconductor, designed to deliver a balance of logic capacity, on-chip memory, and high I/O density in a compact BGA package. It provides a programmable fabric with 15,376 logic elements and approximately 0.424 Mbits of embedded memory, making it suited to designs that require significant gate density and on-chip RAM in a surface-mount form factor.

Engineered for commercial-grade applications, this device targets systems where integration of custom logic, interface consolidation, and high pin-count I/O are focal points. Key attributes include a large I/O count, low-voltage core operation, and a 900-ball BGA package for space-efficient board integration.

Key Features

• Core Logic 15,376 logic elements providing programmable fabric density for implementing custom digital logic and glue functions.
• Embedded Memory Approximately 0.424 Mbits of on-chip RAM for local buffering, state storage, and small data tables.
• I/O Density 496 I/Os to support wide parallel interfaces, multiple peripherals, and complex signal routing.
• Gate Count Approximately 1,250,000 gates of logic capacity for substantial functional integration on a single device.
• Package and Mounting 900-ball BBGA (supplier package: 900-FPBGA, 31 × 31 mm) in a surface-mount format for compact board-level integration.
• Power Core voltage supply range of 1.65 V to 1.95 V, allowing integration into low-voltage power domains.
• Operating Temperature Commercial operating range from 0 °C to 85 °C for standard ambient environments.
• Compliance RoHS compliant for materials and process conformity.

Typical Applications

• High-density I/O bridging — Use the device's 496 I/Os to consolidate and translate between multiple parallel and serial interfaces on a single programmable device.
• Custom logic acceleration — Implement application-specific state machines and processing pipelines leveraging 15,376 logic elements and 0.424 Mbits of embedded memory.
• Interface and protocol glue — Integrate protocol adapters, timing control, and signal conditioning where high gate count and numerous I/Os simplify board-level BOM.

Unique Advantages

• Highly integrated logic capacity: 15,376 logic elements and ~1.25 million gates enable substantial functionality on a single FPGA, reducing the need for multiple discrete devices.
• Large I/O complement: 496 I/Os allow direct connection to numerous peripherals and external devices without added expander components.
• Compact BGA footprint: 900-ball BBGA (31 × 31 mm) minimizes PCB area while supporting high pin counts for dense system designs.
• Low-voltage core operation: 1.65 V to 1.95 V supply range supports integration into modern low-voltage power architectures.
• Commercial temperature suitability: Rated for 0 °C to 85 °C operation for standard commercial deployments.
• Regulatory compliance: RoHS compliant to meet environmental-materials requirements.

Why Choose LFX1200C-04F900C?

The LFX1200C-04F900C combines substantial programmable logic resources, on-chip memory, and a very high I/O count in a space-efficient 900-ball BGA package. It is positioned for designers who need to integrate complex custom logic and multiple interfaces within compact commercial-grade systems while operating on a low-voltage core supply.

This ispXPGA® device is appropriate for projects that prioritize on-board integration of interface logic, protocol bridging, and application-specific acceleration. Its specification set supports scalable designs where consolidating functions into a single FPGA reduces component count and streamlines board layout.

Request a quote or submit an inquiry to receive pricing and availability information for the LFX1200C-04F900C. Our team can assist with ordering details and technical documentation to support your design evaluation.