LFX1200EB-05F900C

The LFX1200EB-05F900C is an ispXPGA® family field programmable gate array (FPGA) IC designed for commercial-grade embedded logic applications. It provides a mid-to-high integration FPGA fabric with 15,376 logic elements and approximately 0.424 Mbits of on-chip RAM to support custom logic, data buffering, and glue-logic functions.

With 496 available I/O pins and a compact 900-ball BGA package (900-FPBGA, 31 × 31 mm), this device is targeted at designs that require high I/O density, significant gate count (1,250,000 gates), and flexible supply and thermal envelopes for commercial environments.

Key Features

• Core Logic 15,376 logic elements (logic cells) and an overall gate count of 1,250,000 to implement complex custom logic functions and control paths.
• Embedded Memory Approximately 0.424 Mbits (423,936 bits) of on-chip RAM suitable for packet buffering, local parameter storage, and temporary data staging.
• I/O Capacity 496 available I/O pins to support high-pin-count interfaces and multiple parallel or serial connections from a single device.
• Power and Supply Operates from a 2.3 V to 3.6 V supply range to accommodate a variety of system power rails.
• Package and Mounting 900-ball BGA footprint (900-FPBGA, 31 × 31 mm) with surface-mount mounting for compact, board-level integration.
• Operating Range Commercial-grade operating temperature from 0 °C to 85 °C, suitable for controlled-environment electronic products.
• Regulatory RoHS-compliant material status for lead-free assembly and regulatory alignment in applicable regions.

Typical Applications

• High-density I/O bridging — Use the 496 I/O pins to consolidate multiple peripheral interfaces or cross-connect high-pin-count subsystems on a single FPGA.
• Custom logic and protocol acceleration — Deploy the 15,376 logic elements and 1,250,000-gate capacity to implement protocol conversion, packet handling, or hardware-accelerated control logic.
• Embedded buffering and data staging — Leverage approximately 0.424 Mbits of on-chip RAM for FIFO buffering, temporary storage, and data alignment in real-time data paths.

Unique Advantages

• High logic density: 15,376 logic elements provide ample resources for mid-scale logic implementations without requiring multiple devices, reducing system complexity.
• Substantial I/O count: 496 I/Os enable direct connection to many peripherals and interfaces, minimizing the need for external I/O expanders.
• Compact BGA packaging: The 900-ball FPBGA (31 × 31 mm) delivers high pin density in a board-space-efficient form factor for space-constrained designs.
• Flexible power operation: A 2.3 V to 3.6 V supply range allows integration with a variety of system power architectures.
• Commercial suitability: Rated for 0 °C to 85 °C operation and RoHS compliance, aligning with general-purpose electronics and controlled-environment products.

Why Choose LFX1200EB-05F900C?

The LFX1200EB-05F900C positions itself as a capable, mid-to-high density ispXPGA® FPGA offering a balance of logic capacity, embedded memory, and extensive I/O in a compact 900-ball BGA package. It is well suited for engineers designing commercial electronic systems that need substantial programmable logic, on-chip RAM for buffering, and many external connections without multiple discrete components.

Designed for commercial applications, this device provides a stable feature set—logic, memory, I/O, and package density—that supports scalable designs and reduces board-level complexity while remaining RoHS-compliant for modern assembly processes.

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