LFX1200EB-04FE680I

IC FPGA 496 I/O 680FPSBGA
Part Description

ispXPGA® Field Programmable Gate Array (FPGA) IC 496 423936 15376 680-LBGA

Quantity 1,541 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package680-FPSBGA (40x40)GradeIndustrialOperating Temperature-40°C – 105°C
Package / Case680-LBGANumber of I/O496Voltage2.3 V - 3.6 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs3844Number of Logic Elements/Cells15376
Number of Gates1250000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits423936

Overview of LFX1200EB-04FE680I – ispXPGA® Field Programmable Gate Array (FPGA) IC 680‑LBGA

The LFX1200EB-04FE680I is an ispXPGA® FPGA in a 680‑LBGA package designed for industrial applications that require moderate logic density, abundant I/O and on‑chip memory. Its architecture provides programmable logic resources and embedded memory suitable for control, interface and custom logic functions in industrial and embedded systems.

Key on‑chip resources include 15,376 logic elements, approximately 0.424 Mbits of embedded RAM, and 496 user I/O pins. The device supports a 2.3 V to 3.6 V supply range and an industrial operating temperature range from -40 °C to 105 °C.

Key Features

  • Logic Capacity 15,376 logic elements and a gate equivalent of 1,250,000 provide programmable resources for custom digital functions.
  • Configurable Logic Blocks 3,844 CLBs for mapping logic functions and building complex state machines and datapaths.
  • Embedded Memory Approximately 0.424 Mbits of on‑chip RAM to support FIFOs, buffers and small embedded data stores without external SDRAM.
  • I/O and Packaging 496 user I/O pins in a 680‑LBGA format (supplier package: 680‑FPSBGA, 40×40) for dense connectivity to peripherals and external devices.
  • Power Supply Flexible supply range from 2.3 V to 3.6 V accommodates common I/O standards and simplifies board power design.
  • Industrial Temperature Range Rated for operation from -40 °C to 105 °C for use in temperature‑sensitive industrial environments.
  • Mounting and Compliance Surface‑mount package and RoHS compliance for modern manufacturing and environmental requirements.

Typical Applications

  • Industrial Control — Implement custom sequencing, motor control logic, and protocol conversion with on‑chip logic and memory suited to harsh environments.
  • Embedded Interfaces — Aggregate and manage multiple parallel and serial interfaces using the device’s high I/O count and programmable logic.
  • Communication Gateways — Create protocol bridging and data buffering functions leveraging embedded RAM and plentiful logic resources.
  • Custom Logic Acceleration — Offload deterministic processing tasks from microcontrollers to dedicated programmable logic for latency‑sensitive operations.

Unique Advantages

  • Substantial Programmable Resources: 15,376 logic elements deliver the capacity needed for medium‑complexity FPGA designs without exceeding board area constraints.
  • High I/O Density: 496 user I/Os reduce the need for external multiplexers and interface chips, simplifying BOM and PCB routing.
  • Embedded Memory On‑Board: Approximately 0.424 Mbits of RAM supports local buffering and state storage, minimizing external memory requirements.
  • Industrial Reliability: Rated for -40 °C to 105 °C operation to meet the environmental demands of industrial and outdoor deployments.
  • Flexible Power Range: 2.3 V to 3.6 V supply flexibility helps integrate the FPGA into mixed‑voltage systems and simplifies I/O interfacing.
  • RoHS‑Compliant Surface Mount Package: 680‑LBGA packaging supports high‑density designs while meeting environmental compliance standards.

Why Choose LFX1200EB-04FE680I?

The LFX1200EB-04FE680I brings a balanced combination of logic capacity, embedded memory and extensive I/O in a single industrial‑rated package. It’s well suited to engineers building mid‑range FPGA solutions where deterministic custom logic, multiple peripheral interfaces and temperature resilience are required.

Designers will find this ispXPGA® device appropriate for compact, high‑connectivity applications that benefit from on‑chip RAM and a flexible supply range, reducing the need for additional components and simplifying system integration.

Request a quote or contact sales to discuss availability, lead times and pricing for the LFX1200EB-04FE680I.

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