LFX1200C-03F900C

The LFX1200C-03F900C is an ispXPGA® field programmable gate array (FPGA) IC from Lattice Semiconductor Corporation designed for commercial embedded applications. It provides 15,376 logic elements in a compact 900‑ball BGA package and is targeted at designs requiring high I/O density and on‑chip memory within a 1.65 V to 1.95 V supply range.

Typical uses include commercial embedded control, interface implementation, and custom logic integration where a balance of logic density, I/O count and compact packaging is required. The device operates across a 0 °C to 85 °C commercial temperature range and is supplied in a surface‑mount 900‑FPBGA (31×31) package.

Key Features

• Logic Capacity 15,376 logic elements provide substantial programmable fabric for combinational and sequential logic implementation.
• Embedded Memory Approximately 0.42 Mbits of on‑chip RAM (423,936 total bits) for data buffering, FIFOs and small memory structures.
• I/O Density 496 general‑purpose I/O pins support high‑pin‑count interfaces and complex connectivity requirements.
• Gate Count Approximately 1,250,000 gates for a wide range of logic and glue‑logic applications.
• Power and Supply Operates from a 1.65 V to 1.95 V supply range to match low‑voltage system domains.
• Package and Mounting 900‑BBGA (900‑FPBGA, 31×31) surface‑mount package for space‑efficient board integration.
• Operating Range & Grade Commercial grade operation from 0 °C to 85 °C suitable for consumer and commercial embedded products.

Typical Applications

• Commercial Embedded Control — Implement custom control logic and finite state machines for consumer and commercial products that require moderate logic and memory resources.
• Interface and Protocol Bridging — Bridge or adapt multiple high‑pin interfaces and handle protocol translation using the device's large I/O capacity.
• Prototyping and OEM Integration — Integrate customer‑specific logic and rapidly iterate designs where a reprogrammable FPGA eases development.
• Display and Peripheral Control — Manage multi‑signal peripheral interfaces and simple display controllers leveraging available I/O and on‑chip RAM.

Unique Advantages

• High Logic Density: 15,376 logic elements enable implementation of sizeable custom logic without external CPLDs or discrete glue logic.
• Substantial I/O Count: 496 I/O pins reduce the need for external multiplexing and simplify board routing for complex interfaces.
• On‑Chip Memory: Approximately 0.42 Mbits of embedded RAM supports buffering and temporary data storage directly on the FPGA fabric.
• Compact BGA Packaging: 900‑BBGA (31×31) delivers a small PCB footprint for space‑constrained commercial designs.
• Low‑Voltage Operation: 1.65 V to 1.95 V supply compatibility aligns with low‑voltage system domains.
• Commercial Temperature Grade: Rated for 0 °C to 85 °C to match consumer and commercial application environments.

Why Choose LFX1200C-03F900C?

The LFX1200C-03F900C offers a balanced combination of logic density, embedded memory, and extensive I/O in a compact 900‑ball BGA package, making it well suited to commercial embedded designs that require flexible, reprogrammable logic. Its operating voltage range and commercial temperature grade align with a broad set of consumer and commercial product requirements.

As a member of the ispXPGA family from Lattice Semiconductor Corporation, this device provides a programmable platform that helps consolidate functions, reduce component count, and accelerate development cycles for OEMs and design teams focused on compact, I/O‑rich solutions.

Request a quote or contact sales to check pricing and availability for the LFX1200C-03F900C and to discuss suitability for your next design.