LFSCM3GA80EP1-6FCN1152C

The LFSCM3GA80EP1-6FCN1152C is a Lattice SCM family Field Programmable Gate Array (FPGA) optimized for communication and memory‑intensive system designs. It combines a high‑performance FPGA fabric with large embedded memory and a high I/O count for dense, connected applications.

This surface‑mount FCBGA device targets commercial‑grade applications that require substantial on‑chip logic (80,000 logic elements), approximately 5.8 Mbits of embedded memory, and extensive I/O connectivity (660 I/Os) in a 1152‑ball flip‑chip BGA package.

Key Features

• Core Fabric and Logic Capacity 80,000 logic elements provide substantial programmable logic for complex control, data path, and processing functions.
• Embedded Memory Approximately 5.8 Mbits of on‑chip RAM supports large buffering, packet staging, and memory‑intensive algorithms.
• High I/O Count 660 I/Os enable dense connectivity for multi‑lane interfaces, parallel memory buses, and broad peripheral integration.
• High‑Speed SERDES and flexiPCS (family capability) The SCM family includes support for high‑speed serial transceivers and flexiPCS functionality—built for standards such as GbE, XAUI, PCI Express and Fibre Channel as defined by the family data.
• I/O Standards and Signal Conditioning (family capability) Family features include wide electrical standard support (LVCMOS, SSTL, LVDS variants, LVPECL, PCI), programmable on‑die termination options, and per‑pin input delay alignment to assist robust high‑speed interfacing.
• Clocking and Timing (family capability) The family provides extensive clock resources including analog PLLs and DLLs, with broad frequency ranges to support high‑performance clocking, phase alignment and glitch‑free dynamic clock selection.
• Power and Voltage Core supply range from 0.95 V to 1.26 V enables operation within the device’s specified low‑voltage range for system power planning.
• Package and Mounting 1152‑ball FCBGA (35 × 35 mm) surface‑mount package provides a high pin‑count footprint for compact, board‑level integration.
• Commercial Temperature Grade Rated for 0 °C to 85 °C operation for commercial applications.
• RoHS Compliant Conforms to RoHS requirements for environmental compliance.

Typical Applications

• Networking & Communication Systems — Implementation of switch, router and protocol processing functions that leverage the family’s high‑speed SERDES and embedded memory.
• High‑Speed Serial Interfaces — Multi‑lane link aggregation, protocol bridging and PHY/PCS integration using the device’s extensive I/O and family SERDES capabilities.
• Memory‑Intensive Data Paths — Packet buffering, FIFOs and data staging using approximately 5.8 Mbits of embedded RAM and dedicated block RAM features from the SCM family.
• Custom Logic & System Control — Offload and accelerate control, preprocessing or glue‑logic functions within communications, industrial automation, and embedded platforms.

Unique Advantages

• High integration density: 80,000 logic elements and substantial embedded memory reduce external component count and simplify board design.
• Extensive connectivity: 660 I/Os in a single package deliver the pin count needed for multi‑lane links, parallel interfaces and mixed‑signal integration.
• Designed for high‑speed links (family capability): Family SERDES and flexiPCS support enable implementation of common communication standards and low‑latency serial links.
• Flexible clocking and timing: Family PLL/DLL resources provide a wide operating range for precise clock management and high‑frequency I/O timing.
• Compact, board‑level package: 1152‑ball FCBGA (35 × 35 mm) delivers high pin density in a surface‑mount form factor suitable for space‑constrained designs.
• Commercial readiness: Rated 0 °C to 85 °C and RoHS compliant for mainstream product deployments.

Why Choose LFSCM3GA80EP1-6FCN1152C?

The LFSCM3GA80EP1-6FCN1152C brings together a high‑capacity programmable fabric, large on‑chip memory and a very high I/O count in a single commercial‑grade FCBGA package. It is well suited to designers building communication‑centric, memory‑intensive or highly connected systems that require integrated resources to reduce BOM and board complexity.

Backed by the SCM family architecture, this device provides the building blocks for scalable designs—combining configurable logic, embedded RAM and family‑level support for high‑speed serial links and advanced I/O standards to support long‑term product development and system flexibility.

Request a quote or submit an inquiry to evaluate LFSCM3GA80EP1-6FCN1152C for your next design and to receive pricing and availability information.