LFSCM3GA40EP1-7FFN1152C

IC FPGA 604 I/O 1152FBGA
Part Description

SCM Field Programmable Gate Array (FPGA) IC 604 4075520 40000 1152-BBGA

Quantity 543 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package1152-FPBGA (35x35)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1152-BBGANumber of I/O604Voltage950 mV - 1.26 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs10000Number of Logic Elements/Cells40000
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits4075520

Overview of LFSCM3GA40EP1-7FFN1152C – SCM Field Programmable Gate Array (FPGA) IC 604 4075520 40000 1152-BBGA

The LFSCM3GA40EP1-7FFN1152C is a commercial-grade FPGA from Lattice Semiconductor’s SC/M family, delivering a high-performance programmable fabric with large on-chip memory and dense I/O. Its architecture targets communication and system-level applications that require abundant logic, embedded RAM and high I/O connectivity.

With 40,000 logic elements, approximately 4.08 Mbits of embedded memory, and 604 I/Os in a compact 1152-ball BGA package, this device is designed to integrate compute, memory and high-speed interfaces into space- and power-efficient designs.

Key Features

  • High-performance FPGA fabric — Contains 40,000 logic elements suitable for complex programmable logic implementations.
  • Embedded memory — Approximately 4.08 Mbits of on-chip RAM (4,075,520 bits) for local storage, buffering and FIFO implementations.
  • High I/O count — 604 general-purpose I/Os to support wide parallel buses, interfaces and multi-channel systems.
  • High-speed serial interfaces (family feature) — SC/M family devices support 4 to 32 high-speed SERDES with flexiPCS and signaling performance useful for serial protocols and link endpoints.
  • Clocking and timing — Family-level clock resources include high-frequency global and edge clocks (700 MHz global, 1 GHz edge) plus multiple PLLs and DLLs for flexible clock management.
  • Programmable I/O standards (family feature) — Supports a broad set of electrical standards and programmable on-die termination options for interfacing to memory and high-speed transceivers.
  • Power supply range — Core supply operates between 0.95 V and 1.26 V, enabling low-voltage system integration.
  • Package — 1152-ball BGA (supplier package: 1152-FPBGA, 35 × 35 mm) for high-pin-count, compact board implementations.
  • Operating temperature — Commercial grade: 0 °C to 85 °C.
  • Regulatory — RoHS compliant.

Typical Applications

  • Network and telecom equipment — Implements protocol processing, packet buffering and high-speed serial links where embedded memory and SERDES support are required.
  • High-speed interface bridging — Acts as a protocol translator or interface hub using the large I/O count and programmable I/O standards.
  • Memory-intensive logic — On-chip RAM and block RAM resources support buffering, FIFOs and local data storage for streaming or packetized data flows.
  • System integration and prototyping — Dense logic and I/O in a single device reduce component count when integrating controllers, custom accelerators or glue logic.

Unique Advantages

  • Large logic capacity: 40,000 logic elements enable complex, multi-function FPGA designs without immediate need for additional devices.
  • Substantial embedded memory: Approximately 4.08 Mbits of on-chip RAM supports buffer- and memory-heavy functions, lowering external memory dependency.
  • High I/O density: 604 I/Os accommodate wide data buses, multiple peripherals, and numerous interface channels from a single package.
  • High-pin-count BGA in a compact footprint: 1152-ball FPBGA (35 × 35 mm) provides abundant connectivity while keeping board area efficient.
  • Flexible clocking and SERDES options (family capabilities): Advanced clock resources and high-speed serial transceivers enable deterministic timing and high-bandwidth links for communication designs.
  • Low-voltage operation: Core voltage range of 0.95 V to 1.26 V supports modern low-power system architectures.

Why Choose LFSCM3GA40EP1-7FFN1152C?

This LFSCM3GA40EP1-7FFN1152C FPGA combines significant logic capacity, embedded memory and high I/O density in a commercial-grade, RoHS-compliant package—making it well suited for communication, interface and system-integration designs that demand on-chip resources and flexible I/O. The device leverages SC/M family features such as SERDES, programmable I/O standards and advanced clocking to address complex timing and link requirements.

Designers seeking a single-device solution to consolidate logic, memory and multi-protocol interfaces will find this FPGA a practical choice for scalable prototypes and production systems within the specified commercial temperature and voltage ranges.

Request a quote or submit an inquiry to obtain pricing and availability for LFSCM3GA40EP1-7FFN1152C. Provide your quantity and delivery needs to receive a timely response.

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