LFSCM3GA40EP1-7FFN1152C
| Part Description |
SCM Field Programmable Gate Array (FPGA) IC 604 4075520 40000 1152-BBGA |
|---|---|
| Quantity | 543 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 1152-FPBGA (35x35) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1152-BBGA | Number of I/O | 604 | Voltage | 950 mV - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 10000 | Number of Logic Elements/Cells | 40000 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 4075520 |
Overview of LFSCM3GA40EP1-7FFN1152C – SCM Field Programmable Gate Array (FPGA) IC 604 4075520 40000 1152-BBGA
The LFSCM3GA40EP1-7FFN1152C is a commercial-grade FPGA from Lattice Semiconductor’s SC/M family, delivering a high-performance programmable fabric with large on-chip memory and dense I/O. Its architecture targets communication and system-level applications that require abundant logic, embedded RAM and high I/O connectivity.
With 40,000 logic elements, approximately 4.08 Mbits of embedded memory, and 604 I/Os in a compact 1152-ball BGA package, this device is designed to integrate compute, memory and high-speed interfaces into space- and power-efficient designs.
Key Features
- High-performance FPGA fabric — Contains 40,000 logic elements suitable for complex programmable logic implementations.
- Embedded memory — Approximately 4.08 Mbits of on-chip RAM (4,075,520 bits) for local storage, buffering and FIFO implementations.
- High I/O count — 604 general-purpose I/Os to support wide parallel buses, interfaces and multi-channel systems.
- High-speed serial interfaces (family feature) — SC/M family devices support 4 to 32 high-speed SERDES with flexiPCS and signaling performance useful for serial protocols and link endpoints.
- Clocking and timing — Family-level clock resources include high-frequency global and edge clocks (700 MHz global, 1 GHz edge) plus multiple PLLs and DLLs for flexible clock management.
- Programmable I/O standards (family feature) — Supports a broad set of electrical standards and programmable on-die termination options for interfacing to memory and high-speed transceivers.
- Power supply range — Core supply operates between 0.95 V and 1.26 V, enabling low-voltage system integration.
- Package — 1152-ball BGA (supplier package: 1152-FPBGA, 35 × 35 mm) for high-pin-count, compact board implementations.
- Operating temperature — Commercial grade: 0 °C to 85 °C.
- Regulatory — RoHS compliant.
Typical Applications
- Network and telecom equipment — Implements protocol processing, packet buffering and high-speed serial links where embedded memory and SERDES support are required.
- High-speed interface bridging — Acts as a protocol translator or interface hub using the large I/O count and programmable I/O standards.
- Memory-intensive logic — On-chip RAM and block RAM resources support buffering, FIFOs and local data storage for streaming or packetized data flows.
- System integration and prototyping — Dense logic and I/O in a single device reduce component count when integrating controllers, custom accelerators or glue logic.
Unique Advantages
- Large logic capacity: 40,000 logic elements enable complex, multi-function FPGA designs without immediate need for additional devices.
- Substantial embedded memory: Approximately 4.08 Mbits of on-chip RAM supports buffer- and memory-heavy functions, lowering external memory dependency.
- High I/O density: 604 I/Os accommodate wide data buses, multiple peripherals, and numerous interface channels from a single package.
- High-pin-count BGA in a compact footprint: 1152-ball FPBGA (35 × 35 mm) provides abundant connectivity while keeping board area efficient.
- Flexible clocking and SERDES options (family capabilities): Advanced clock resources and high-speed serial transceivers enable deterministic timing and high-bandwidth links for communication designs.
- Low-voltage operation: Core voltage range of 0.95 V to 1.26 V supports modern low-power system architectures.
Why Choose LFSCM3GA40EP1-7FFN1152C?
This LFSCM3GA40EP1-7FFN1152C FPGA combines significant logic capacity, embedded memory and high I/O density in a commercial-grade, RoHS-compliant package—making it well suited for communication, interface and system-integration designs that demand on-chip resources and flexible I/O. The device leverages SC/M family features such as SERDES, programmable I/O standards and advanced clocking to address complex timing and link requirements.
Designers seeking a single-device solution to consolidate logic, memory and multi-protocol interfaces will find this FPGA a practical choice for scalable prototypes and production systems within the specified commercial temperature and voltage ranges.
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Date Founded: 1983
Headquarters: Hillsboro, Oregon, USA
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