LFSCM3GA40EP1-6FFN1152C

IC FPGA 604 I/O 1152FBGA
Part Description

SCM Field Programmable Gate Array (FPGA) IC 604 4075520 40000 1152-BBGA

Quantity 1,542 Available (as of May 6, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package1152-FPBGA (35x35)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1152-BBGANumber of I/O604Voltage950 mV - 1.26 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs10000Number of Logic Elements/Cells40000
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits4075520

Overview of LFSCM3GA40EP1-6FFN1152C – SCM Field Programmable Gate Array (FPGA) IC, 604 I/O, 40,000 Logic Elements, 1152-BBGA

The LFSCM3GA40EP1-6FFN1152C is a LatticeSC/M family Field Programmable Gate Array (FPGA) supplied in a 1152-ball BGA package for surface-mount assemblies. It combines a high-density logic fabric with large embedded memory and high I/O count, making it suitable for communication and memory‑intensive system designs.

Key device-level specifications include 40,000 logic elements, approximately 4.08 Mbits of embedded RAM, 604 user I/Os, a 1152-ball FPBGA (35 × 35 mm) package, and a core voltage range of 0.95 V to 1.26 V. The device is RoHS compliant and specified for commercial temperature operation (0 °C to 85 °C).

Key Features

  • Logic Capacity  Provides 40,000 logic elements, suitable for medium-to-high complexity FPGA designs.
  • Embedded Memory  Approximately 4.08 Mbits of on-chip RAM to support buffers, FIFOs and local data storage.
  • High I/O Density  604 user I/Os enable extensive external connectivity for multi-channel interfaces and large bus fabrics.
  • Package and Mounting  1152-ball BGA (supplier package: 1152-FPBGA, 35 × 35 mm) for high pin-count, surface-mount system integration.
  • Core Voltage Range  Operates from 0.95 V to 1.26 V to match system power rails and low-voltage designs.
  • Operating Grade  Commercial temperature range from 0 °C to 85 °C for standard embedded and networking applications.
  • Standards and Family Capabilities  As part of the LatticeSC/M family, the device benefits from family-level features including high-performance FPGA fabric, high-speed SERDES with embedded PCS, advanced I/O standards and extensive clocking resources (as documented in the family datasheet).
  • Regulatory Compliance  RoHS compliant for lead-free manufacturing and global supply chain requirements.

Typical Applications

  • High‑Speed Networking Equipment  Supports communication system requirements through the LatticeSC/M family’s SERDES and PCS capabilities, paired with high I/O count and substantial on-chip memory for packet buffering and protocol handling.
  • Telecom and Carrier Line Cards  Large logic capacity and embedded memory accommodate complex signal processing, protocol engines and interface aggregation on line cards and expansion modules.
  • Storage and Data Path Controllers  On-chip memory and high I/O density enable implementation of data buffering, interface bridging and controller logic for storage subsystems.
  • Backplane and Switch Fabric Interfaces  Multiple high-speed channels and extensive GPIO support make the device suitable for backplane bridging, crossbar control and switch management functions.

Unique Advantages

  • High Logic Density:  40,000 logic elements provide ample capacity for complex glue logic, protocol handling and moderate DSP.
  • Substantial Embedded Memory:  Approximately 4.08 Mbits of RAM reduces external memory dependence for buffering and packet queues, simplifying board-level design.
  • Exceptional I/O Count:  604 user I/Os deliver flexible connectivity to peripherals, memory devices and multi-lane interfaces without extensive multiplexing.
  • Compact, High‑Pin‑Count Package:  1152-ball FPBGA (35 × 35 mm) enables high-density routing in compact system footprints.
  • Commercial Thermal Range:  Rated for 0 °C to 85 °C operation to meet standard embedded and networking product requirements.
  • RoHS Compliant:  Supports lead‑free assembly processes and global environmental requirements.

Why Choose LFSCM3GA40EP1-6FFN1152C?

This FPGA delivers a balanced combination of logic capacity, embedded memory and a very high I/O count in a single, surface-mount 1152-ball BGA package. It is positioned for designers building communication-oriented and memory-intensive systems who require a commercially rated, RoHS-compliant device with a compact footprint and low-voltage core operation.

As a member of the LatticeSC/M family, the device benefits from the family’s documented fabric, I/O and SERDES capabilities, making it a practical choice for mid‑to‑high complexity applications where integration and I/O density reduce board-level BOM and design complexity.

Request a quote or submit an inquiry to receive pricing, availability and ordering information for the LFSCM3GA40EP1-6FFN1152C. Our team can assist with lead times and volume options to support your design schedule.

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