LFSCM3GA40EP1-6FFN1152C
| Part Description |
SCM Field Programmable Gate Array (FPGA) IC 604 4075520 40000 1152-BBGA |
|---|---|
| Quantity | 1,542 Available (as of May 6, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 1152-FPBGA (35x35) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1152-BBGA | Number of I/O | 604 | Voltage | 950 mV - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 10000 | Number of Logic Elements/Cells | 40000 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 4075520 |
Overview of LFSCM3GA40EP1-6FFN1152C – SCM Field Programmable Gate Array (FPGA) IC, 604 I/O, 40,000 Logic Elements, 1152-BBGA
The LFSCM3GA40EP1-6FFN1152C is a LatticeSC/M family Field Programmable Gate Array (FPGA) supplied in a 1152-ball BGA package for surface-mount assemblies. It combines a high-density logic fabric with large embedded memory and high I/O count, making it suitable for communication and memory‑intensive system designs.
Key device-level specifications include 40,000 logic elements, approximately 4.08 Mbits of embedded RAM, 604 user I/Os, a 1152-ball FPBGA (35 × 35 mm) package, and a core voltage range of 0.95 V to 1.26 V. The device is RoHS compliant and specified for commercial temperature operation (0 °C to 85 °C).
Key Features
- Logic Capacity Provides 40,000 logic elements, suitable for medium-to-high complexity FPGA designs.
- Embedded Memory Approximately 4.08 Mbits of on-chip RAM to support buffers, FIFOs and local data storage.
- High I/O Density 604 user I/Os enable extensive external connectivity for multi-channel interfaces and large bus fabrics.
- Package and Mounting 1152-ball BGA (supplier package: 1152-FPBGA, 35 × 35 mm) for high pin-count, surface-mount system integration.
- Core Voltage Range Operates from 0.95 V to 1.26 V to match system power rails and low-voltage designs.
- Operating Grade Commercial temperature range from 0 °C to 85 °C for standard embedded and networking applications.
- Standards and Family Capabilities As part of the LatticeSC/M family, the device benefits from family-level features including high-performance FPGA fabric, high-speed SERDES with embedded PCS, advanced I/O standards and extensive clocking resources (as documented in the family datasheet).
- Regulatory Compliance RoHS compliant for lead-free manufacturing and global supply chain requirements.
Typical Applications
- High‑Speed Networking Equipment Supports communication system requirements through the LatticeSC/M family’s SERDES and PCS capabilities, paired with high I/O count and substantial on-chip memory for packet buffering and protocol handling.
- Telecom and Carrier Line Cards Large logic capacity and embedded memory accommodate complex signal processing, protocol engines and interface aggregation on line cards and expansion modules.
- Storage and Data Path Controllers On-chip memory and high I/O density enable implementation of data buffering, interface bridging and controller logic for storage subsystems.
- Backplane and Switch Fabric Interfaces Multiple high-speed channels and extensive GPIO support make the device suitable for backplane bridging, crossbar control and switch management functions.
Unique Advantages
- High Logic Density: 40,000 logic elements provide ample capacity for complex glue logic, protocol handling and moderate DSP.
- Substantial Embedded Memory: Approximately 4.08 Mbits of RAM reduces external memory dependence for buffering and packet queues, simplifying board-level design.
- Exceptional I/O Count: 604 user I/Os deliver flexible connectivity to peripherals, memory devices and multi-lane interfaces without extensive multiplexing.
- Compact, High‑Pin‑Count Package: 1152-ball FPBGA (35 × 35 mm) enables high-density routing in compact system footprints.
- Commercial Thermal Range: Rated for 0 °C to 85 °C operation to meet standard embedded and networking product requirements.
- RoHS Compliant: Supports lead‑free assembly processes and global environmental requirements.
Why Choose LFSCM3GA40EP1-6FFN1152C?
This FPGA delivers a balanced combination of logic capacity, embedded memory and a very high I/O count in a single, surface-mount 1152-ball BGA package. It is positioned for designers building communication-oriented and memory-intensive systems who require a commercially rated, RoHS-compliant device with a compact footprint and low-voltage core operation.
As a member of the LatticeSC/M family, the device benefits from the family’s documented fabric, I/O and SERDES capabilities, making it a practical choice for mid‑to‑high complexity applications where integration and I/O density reduce board-level BOM and design complexity.
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