LFSCM3GA40EP1-5FFN1152I
| Part Description |
SCM Field Programmable Gate Array (FPGA) IC 604 4075520 40000 1152-BBGA |
|---|---|
| Quantity | 1,141 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 1152-FPBGA (35x35) | Grade | Industrial | Operating Temperature | -40°C – 105°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1152-BBGA | Number of I/O | 604 | Voltage | 950 mV - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 10000 | Number of Logic Elements/Cells | 40000 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 4075520 |
Overview of LFSCM3GA40EP1-5FFN1152I – SCM Field Programmable Gate Array (FPGA) IC 604 4075520 40000 1152-BBGA
The LFSCM3GA40EP1-5FFN1152I is a LatticeSC/M family SCM FPGA in a 1152-BBGA package, offering a combination of high logic density, substantial embedded memory, and extensive I/O. It targets communication and high-performance embedded systems that require integrated high-speed interfaces, on-chip memory, and industrial-grade operating range.
Built on the LatticeSC/M architecture, this device combines a high-performance FPGA fabric with memory-intensive resources and advanced I/O capabilities to support demanding networking, telecom, and data processing tasks.
Key Features
- Core Logic Approximately 40,000 logic elements provide the programmable fabric for complex digital designs.
- On-chip Memory Approximately 3.9 Mbits of total RAM bits (4,075,520 bits) for packet buffering, FIFOs and embedded data structures.
- Extensive I/O 604 I/Os support high pin-count interfacing and flexible system-level connectivity.
- High-Speed SERDES & Protocol Support (family) LatticeSC/M family features include high-speed SERDES and flexiPCS with built-in PCS implementations for standards such as GbE, XAUI, PCI Express and various Fibre Channel and SONET interfaces.
- High-Performance I/O (family) PURESPEED™ I/O in the family supports differential I/O up to 2 Gbps DDR and single-ended memory interfaces up to 800 Mbps, with programmable input delay and on-die termination options.
- Clocking Resources (family) Family-level sysCLOCK™ resources include analog PLLs and DLLs suitable for high-frequency system and I/O clocking (700 MHz primary, 1 GHz edge clocks).
- Power and Voltage Core supply range: 0.95 V to 1.26 V, enabling standard low-voltage system architectures.
- Package & Mounting 1152-BBGA (1152-FPBGA, 35×35) surface-mount package for high pin-count board designs.
- Industrial Temperature Grade Rated for operation from -40 °C to 105 °C for harsh-environment deployments.
- RoHS Compliant Manufactured to meet RoHS environmental requirements.
Typical Applications
- Network Infrastructure High logic density, large embedded RAM and family-level SERDES/PCS support make this device suitable for line cards, switches, and routers handling multi-gigabit interfaces.
- Telecommunications Use in telecom equipment that requires protocol handling, packet buffering and high-speed serial links.
- High-Speed Storage & I/O Bridges Ideal where large on-chip memory and extensive I/O are needed to implement bridging between high-bandwidth serial fabrics and parallel interfaces.
- Industrial Control & Processing Industrial temperature rating and abundant logic/memory resources support complex control, signal processing and deterministic I/O tasks.
Unique Advantages
- High integration density: Combining approximately 40,000 logic elements with nearly 3.9 Mbits of on-chip RAM reduces external memory needs and overall BOM.
- Extensive connectivity: 604 I/Os plus family-level high-speed SERDES and PURESPEED I/O options simplify multi-protocol interfacing and high-pin-count designs.
- Robust clocking and I/O features: Family-level PLLs, DLLs and programmable input-delay help meet tight timing and jitter requirements for high-speed links.
- Industrial reliability: Rated -40 °C to 105 °C and supplied in a high-density BBGA package for demanding embedded deployments.
- Standards-oriented IP (family): Embedded PCS and protocol support in the family streamline implementation of common networking standards and reduce development time.
Why Choose LFSCM3GA40EP1-5FFN1152I?
The LFSCM3GA40EP1-5FFN1152I positions itself as a versatile, memory-rich FPGA option for designers building high-performance communication, telecom, and industrial systems. Its combination of substantial logic resources, multi-megabit on-chip RAM, and broad I/O capability enables compact, high-functionality designs while minimizing external components.
This industrial-grade device is well suited for projects that require sustained operation across a wide temperature range and need integrated high-speed interface support from the LatticeSC/M family. It offers a balanced platform for teams seeking scalability, protocol-ready features and reduced system complexity.
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