LFSCM3GA40EP1-5FFN1152I

IC FPGA 604 I/O 1152FBGA
Part Description

SCM Field Programmable Gate Array (FPGA) IC 604 4075520 40000 1152-BBGA

Quantity 1,141 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package1152-FPBGA (35x35)GradeIndustrialOperating Temperature-40°C – 105°C
Package / Case1152-BBGANumber of I/O604Voltage950 mV - 1.26 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs10000Number of Logic Elements/Cells40000
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits4075520

Overview of LFSCM3GA40EP1-5FFN1152I – SCM Field Programmable Gate Array (FPGA) IC 604 4075520 40000 1152-BBGA

The LFSCM3GA40EP1-5FFN1152I is a LatticeSC/M family SCM FPGA in a 1152-BBGA package, offering a combination of high logic density, substantial embedded memory, and extensive I/O. It targets communication and high-performance embedded systems that require integrated high-speed interfaces, on-chip memory, and industrial-grade operating range.

Built on the LatticeSC/M architecture, this device combines a high-performance FPGA fabric with memory-intensive resources and advanced I/O capabilities to support demanding networking, telecom, and data processing tasks.

Key Features

  • Core Logic  Approximately 40,000 logic elements provide the programmable fabric for complex digital designs.
  • On-chip Memory  Approximately 3.9 Mbits of total RAM bits (4,075,520 bits) for packet buffering, FIFOs and embedded data structures.
  • Extensive I/O  604 I/Os support high pin-count interfacing and flexible system-level connectivity.
  • High-Speed SERDES & Protocol Support (family)  LatticeSC/M family features include high-speed SERDES and flexiPCS with built-in PCS implementations for standards such as GbE, XAUI, PCI Express and various Fibre Channel and SONET interfaces.
  • High-Performance I/O (family)  PURESPEED™ I/O in the family supports differential I/O up to 2 Gbps DDR and single-ended memory interfaces up to 800 Mbps, with programmable input delay and on-die termination options.
  • Clocking Resources (family)  Family-level sysCLOCK™ resources include analog PLLs and DLLs suitable for high-frequency system and I/O clocking (700 MHz primary, 1 GHz edge clocks).
  • Power and Voltage  Core supply range: 0.95 V to 1.26 V, enabling standard low-voltage system architectures.
  • Package & Mounting  1152-BBGA (1152-FPBGA, 35×35) surface-mount package for high pin-count board designs.
  • Industrial Temperature Grade  Rated for operation from -40 °C to 105 °C for harsh-environment deployments.
  • RoHS Compliant  Manufactured to meet RoHS environmental requirements.

Typical Applications

  • Network Infrastructure  High logic density, large embedded RAM and family-level SERDES/PCS support make this device suitable for line cards, switches, and routers handling multi-gigabit interfaces.
  • Telecommunications  Use in telecom equipment that requires protocol handling, packet buffering and high-speed serial links.
  • High-Speed Storage & I/O Bridges  Ideal where large on-chip memory and extensive I/O are needed to implement bridging between high-bandwidth serial fabrics and parallel interfaces.
  • Industrial Control & Processing  Industrial temperature rating and abundant logic/memory resources support complex control, signal processing and deterministic I/O tasks.

Unique Advantages

  • High integration density: Combining approximately 40,000 logic elements with nearly 3.9 Mbits of on-chip RAM reduces external memory needs and overall BOM.
  • Extensive connectivity: 604 I/Os plus family-level high-speed SERDES and PURESPEED I/O options simplify multi-protocol interfacing and high-pin-count designs.
  • Robust clocking and I/O features: Family-level PLLs, DLLs and programmable input-delay help meet tight timing and jitter requirements for high-speed links.
  • Industrial reliability: Rated -40 °C to 105 °C and supplied in a high-density BBGA package for demanding embedded deployments.
  • Standards-oriented IP (family): Embedded PCS and protocol support in the family streamline implementation of common networking standards and reduce development time.

Why Choose LFSCM3GA40EP1-5FFN1152I?

The LFSCM3GA40EP1-5FFN1152I positions itself as a versatile, memory-rich FPGA option for designers building high-performance communication, telecom, and industrial systems. Its combination of substantial logic resources, multi-megabit on-chip RAM, and broad I/O capability enables compact, high-functionality designs while minimizing external components.

This industrial-grade device is well suited for projects that require sustained operation across a wide temperature range and need integrated high-speed interface support from the LatticeSC/M family. It offers a balanced platform for teams seeking scalability, protocol-ready features and reduced system complexity.

Request a quote or submit an inquiry to obtain pricing, lead time and availability for LFSCM3GA40EP1-5FFN1152I.

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