LFSCM3GA40EP1-5FF1020C
| Part Description |
SCM Field Programmable Gate Array (FPGA) IC 562 4075520 40000 1020-BBGA, FCBGA |
|---|---|
| Quantity | 1,684 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 1020-OFCBGA (33x33) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1020-BBGA, FCBGA | Number of I/O | 562 | Voltage | 950 mV - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 10000 | Number of Logic Elements/Cells | 40000 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 4075520 |
Overview of LFSCM3GA40EP1-5FF1020C – SCM Field Programmable Gate Array (FPGA), 40,000 logic elements, ~4.08 Mbits RAM, 562 I/Os, 1020-BBGA
The LFSCM3GA40EP1-5FF1020C is an SCM-series Field Programmable Gate Array (FPGA) from Lattice Semiconductor designed for high-performance, memory-intensive applications. It combines 40,000 logic elements with approximately 4.08 Mbits of on-chip RAM and a high I/O count—562 pins—to support complex system integration in commercial-grade designs.
Packaged in a 1020-BBGA (33 × 33) surface-mount package and operating from a core supply of 0.95 V to 1.26 V over a commercial temperature range (0 °C to 85 °C), this device targets networking, communications and embedded systems that require large logic density, significant embedded memory and extensive I/O connectivity.
Key Features
- Core Density 40,000 logic elements (logic cells) provide substantial programmable fabric for implementing complex digital logic and system-level functions.
- Embedded Memory Total on-chip RAM of 4,075,520 bits (approximately 4.08 Mbits) supports memory-intensive designs and data buffering.
- High I/O Count 562 I/Os enable broad external connectivity for high-pin-count interfaces and multi-channel designs.
- Family-Level High-Speed Interfaces As part of the LatticeSC/M family, the architecture includes high-speed SERDES and PURESPEED™ I/O capabilities and embedded PCS options for common communication standards (as described in the SC/M family datasheet).
- Clocking and Timing Family-level features include multiple analog PLLs and DLLs and extensive clock networks to support high-frequency system clocks and precise timing control.
- Package and Mounting 1020-BBGA FCBGA package (supplier device package: 1020-OFCBGA, 33×33) designed for surface-mount assembly in high-pin-count applications.
- Power and Supply Core voltage supply range from 0.95 V to 1.26 V to match system power domains.
- Commercial Grade Rated for operation from 0 °C to 85 °C and RoHS compliant.
Typical Applications
- High‑speed networking and communications Large logic capacity, high I/O count and family-level SERDES/PCS support make this device suitable for network interface, protocol bridging and packet-processing functions.
- Embedded system acceleration Dense logic and on-chip memory enable hardware acceleration of compute tasks, protocol engines and custom peripherals within embedded platforms.
- Storage and interface controllers Significant embedded RAM and flexible I/O help implement buffering, protocol conversion and interface logic for storage and high-bandwidth I/O subsystems.
Unique Advantages
- High integration density: 40,000 logic elements and ~4.08 Mbits of embedded RAM reduce external components and simplify system architecture.
- Extensive I/O resources: 562 I/Os support multiple parallel interfaces and high pin-count daughterboard or backplane connections.
- Family architecture advantages: LatticeSC/M family features such as high-speed SERDES, PURESPEED I/O and advanced clocking provide proven building blocks for communications and networking applications.
- Compact, manufacturable package: 1020-BBGA FCBGA offers a high-pin-count surface-mount solution suitable for dense board layouts.
- Commercial ready: RoHS compliant and specified for 0 °C to 85 °C operation to meet standard commercial deployment requirements.
Why Choose LFSCM3GA40EP1-5FF1020C?
The LFSCM3GA40EP1-5FF1020C positions itself as a high-density, memory-capable FPGA option within the LatticeSC/M family, balancing large logic resources, significant on-chip RAM and a broad I/O set for demanding commercial applications. Its family-level feature set and package density make it well suited for designers who need to integrate protocol logic, buffering and substantial I/O connectivity in a compact FPGA solution.
This device is appropriate for engineering teams building communication equipment, embedded accelerators or interface controllers that require a scalable, well-supported FPGA architecture with commercial temperature qualification and RoHS compliance.
Request a quote or submit an inquiry to obtain pricing, availability and lead-time information for LFSCM3GA40EP1-5FF1020C.

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