LFSCM3GA25EP1-7F900C

The LFSCM3GA25EP1-7F900C is a commercial-grade FPGA from Lattice Semiconductor’s SC/M family, delivered in a high-density 900-ball BGA package (900-FPBGA, 31×31). This device combines a high-performance programmable fabric with a large I/O count and substantial on-chip embedded memory for system-level integration.

Targeted at designs that require dense logic, broad I/O bandwidth and embedded memory, the device is well suited to communication-focused and memory-intensive applications where integration and predictable supply/temperature ranges (0 °C to 85 °C, 0.95–1.26 V supply) are important.

Key Features

• Logic Capacity  25,000 logic elements (cells) provide significant on-chip programmable logic for control, processing and glue-logic functions.
• On‑Chip Memory  Approximately 1.97 Mbits of total RAM bits for system buffering, FIFOs and local data storage.
• High I/O Count  378 I/Os to support dense peripheral connectivity, multi‑lane interfaces and broad system integration.
• Package & Mounting  900-ball BGA (900-BBGA / 900-FPBGA, 31×31) surface-mount package for high pin-count board designs.
• Power & Temperature  Operates from 0.95 V to 1.26 V supply rails and specified for commercial temperature operation from 0 °C to 85 °C.
• Compliance  RoHS compliant, supporting environmental and regulatory requirements for commercial deployments.
• Family-Level Capabilities  As part of the Lattice SC/M family, the architecture includes a high-performance fabric, advanced clocking resources, system-level support features (IEEE 1149.1 boundary scan and IEEE 1532 in-system configuration) and MACO-enabled IP blocks for structured integration.

Typical Applications

• High-Speed Communications Equipment  Leverage the SC/M family’s SERDES and embedded PCS capabilities together with the device’s high I/O count for PHY/PCS, protocol bridging and line interface tasks.
• Memory-Intensive Data Paths  Use the approximately 1.97 Mbits of on-chip RAM for packet buffering, FIFOs and low-latency data staging in networking and interconnect systems.
• System Integration & Glue Logic  Implement control logic, protocol adaptation and timing-critical interfacing where a dense logic element count and many I/Os reduce external components and board-level complexity.
• Embedded System Prototyping  Deploy as a reprogrammable platform for validating interfaces, timing and system-level functions before committing to hardened IP or ASICs.

Unique Advantages

• High logic-to-memory balance: 25,000 logic elements coupled with ~1.97 Mbits of RAM supports complex processing with substantial local storage.
• Extensive I/O reach: 378 I/Os enable direct interfacing to multiple peripherals and parallel channels, reducing the need for external I/O expanders.
• Compact, high‑pin package: 900-BBGA (31×31) provides dense routing and high signal count in a space-efficient form factor for system-level boards.
• Commercial temperature and voltage support: Defined 0 °C–85 °C operating range and 0.95–1.26 V supply compatibility simplify power sequencing and thermal planning for commercial products.
• RoHS compliant: Meets common environmental requirements for commercial manufacturing and shipment.
• SC/M family ecosystem: Built on a family architecture that includes system-level support features and pre‑engineered IP blocks to accelerate development and integration.

Why Choose LFSCM3GA25EP1-7F900C?

The LFSCM3GA25EP1-7F900C delivers a balanced combination of programmable logic, embedded memory and a very high I/O count in a commercial-grade, RoHS-compliant 900-ball BGA package. Its operating voltage and temperature ranges, together with family-level system features, make it a practical choice for communication-focused, memory-intensive and integration-heavy designs where consolidation of functions on a single FPGA reduces board complexity and BOM.

This device is suited for engineers and procurement teams designing medium- to high-density systems that require reprogrammability, substantial local memory and extensive I/O routing while leveraging the Lattice SC/M family capabilities for system-level support.

Request a quote or submit a product inquiry to evaluate LFSCM3GA25EP1-7F900C for your next design.