LFSCM3GA25EP1-6F900I

The LFSCM3GA25EP1-6F900I is an industrial-grade SCM Field Programmable Gate Array (FPGA) from Lattice Semiconductor. It delivers a mid-range logic capacity with 25,000 logic elements, substantial embedded memory, and a high I/O count in a compact 900-ball flip-chip BGA package.

Designed for demanding embedded and communications applications, this device combines on-chip memory and dense I/O to support protocol bridging, high-density interface aggregation, and general-purpose FPGA tasks where industrial temperature range and low-voltage operation are required.

Key Features

• Core Logic  25,000 logic elements provide programmable fabric for custom logic, protocol handling, and system glue functionality.
• Embedded Memory  Approximately 1.97 Mbits of on-chip RAM suitable for buffers, FIFOs, and small local data stores.
• I/O Density  378 I/Os enable high-pin-count interfacing for multi-channel designs, sensor aggregation, and parallel buses.
• Low-Voltage Core Supply  Core supply range from 0.95 V to 1.26 V supports modern low-voltage power domains.
• Industrial Temperature Range  Rated for −40 °C to 105 °C operation for reliable use in extended-environment and industrial applications.
• Package & Mounting  900-ball flip-chip BGA (900-FPBGA, 31 × 31 mm) in a surface-mount form factor for high pin density in compact footprints.
• Standards and Family-Level Features  Built on the LatticeSC/M family architecture, which provides family-level features such as high-performance FPGA fabric, high-speed SERDES, PURESPEED I/O technology, and system-level support (for example, IEEE 1149.1 boundary scan and IEEE 1532 in-system configuration).
• RoHS Compliant  Device is RoHS compliant for environmental and regulatory considerations.

Typical Applications

• Communications Equipment  Protocol handling, interface bridging and high-speed I/O aggregation leveraging the part’s logic capacity and large I/O count.
• Industrial Control  Deterministic control, sensor aggregation, and real-time preprocessing where extended temperature range is required.
• Networking & Infrastructure  Switch fabrics, packet buffering, and peripheral interface logic that benefit from on-chip RAM and dense I/O connectivity.
• Embedded Systems  Custom peripheral integration, protocol converters, and system glue logic in compact board layouts enabled by the 900-BBGA package.

Unique Advantages

• Balanced Logic and Memory:  25,000 logic elements paired with approximately 1.97 Mbits of embedded RAM provides a practical balance for mid-range system functions without external memory for many use cases.
• High I/O Count for Dense Interfaces:  378 I/Os make the device well-suited for designs requiring many parallel interfaces or channelized I/O.
• Industrial Robustness:  −40 °C to 105 °C operating range supports deployment in harsh and industrial environments.
• Compact, High-Pin Package:  The 900-FPBGA (31 × 31 mm) package delivers high connectivity in a surface-mount form factor that suits space-constrained boards.
• Low-Voltage Core Compatibility:  Core voltage range of 0.95–1.26 V aligns with contemporary low-power system domains.
• Family-Level High-Speed I/O and SERDES:  Leveraging the LatticeSC/M family architecture gives access to advanced I/O technologies such as PURESPEED and high-speed SERDES at the family level.

Why Choose LFSCM3GA25EP1-6F900I?

The LFSCM3GA25EP1-6F900I positions itself as a versatile, industrial-grade FPGA offering a pragmatic mix of logic density, embedded memory, and a very high I/O count in a compact 900-ball FPBGA package. Its low-voltage core operation and extended temperature rating make it suitable for embedded and communications designs that must operate reliably in demanding environments.

This device is well suited for engineers and system designers building mid-range FPGA-based solutions—especially where on-chip memory, numerous I/Os, and board-level density are key selection factors. Built on the LatticeSC/M family architecture, it benefits from family-level system features and configuration options that streamline system integration.

Request a quote to begin evaluation or submit a procurement inquiry to obtain pricing, lead times, and additional technical support for integration into your design.