LFSCM3GA15EP1-6FN900I

IC FPGA 300 I/O 900FBGA
Part Description

SCM Field Programmable Gate Array (FPGA) IC 300 1054720 15000 900-BBGA

Quantity 824 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package900-FPBGA (31x31)GradeIndustrialOperating Temperature-40°C – 105°C
Package / Case900-BBGANumber of I/O300Voltage950 mV - 1.26 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs3750Number of Logic Elements/Cells15000
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits1054720

Overview of LFSCM3GA15EP1-6FN900I – SCM Field Programmable Gate Array (FPGA) IC, 15,000 Logic Elements, 300 I/Os, 900-BBGA

The LFSCM3GA15EP1-6FN900I is an industrial-grade FPGA from Lattice Semiconductor's SC/M family. It combines a high-performance FPGA fabric with abundant on-chip memory and a high I/O count to address communication networking and industrial system applications.

Designed for designs that require dense logic, substantial embedded memory, and multi-standard high-speed interfaces, this device delivers integration and flexibility while supporting operation across a wide industrial temperature range.

Key Features

  • Core Logic  Approximately 15,000 logic elements for implementing custom digital functions and moderate-complexity designs.
  • Embedded Memory  Approximately 1.05 Mbits of on-chip RAM (1,054,720 bits) to support FIFOs, buffering, and local data storage.
  • I/O Density  300 I/Os provide broad external interface capability for peripherals, buses, and system interconnects.
  • High‑Speed Serial Capability (family feature)  Lattice SC/M family devices include 4 to 32 high-speed SERDES with performance ranging from 600 Mbps to 3.8 Gbps for multi-gigabit link implementations.
  • I/O Standards & Signal Integrity (family feature)  Family-level support for a wide set of standards including LVCMOS, LVTTL, SSTL, HSTL, PCI/PCI‑X, LVDS variants and programmable on-die termination options to support diverse interface requirements.
  • Clocking & Timing (family feature)  Extensive clocking resources including analog PLLs and DLLs for flexible frequency synthesis, edge clocks and dynamic clock select capabilities suitable for complex clock networks.
  • Package & Mounting  900-ball BGA package (supplier device package: 900-FPBGA, 31×31) in a surface-mount form factor for compact board integration.
  • Power & Supply  Core supply range from 0.95 V to 1.26 V to match system power domains.
  • Industrial Temperature Grade  Rated for operation from −40 °C to 105 °C, enabling deployment in industrial environments.
  • Compliance  RoHS compliant for regulatory and environmental adherence.
  • System-Level Support (family feature)  Family-level features include IEEE 1149.1 boundary scan, ispTRACY internal logic analyzer, and IEEE 1532 in-system configuration to aid development and production test.

Typical Applications

  • Communication Systems  High-speed SERDES and flexible I/O support make this FPGA suitable for protocol bridging, line cards, and network interface functions.
  • Industrial Control  Industrial temperature rating and robust I/O count enable motor control, motion systems, and factory automation logic functions.
  • Memory-Intensive Subsystems  Approximately 1.05 Mbits of embedded RAM supports buffering, packet processing, and FIFO-based data handling.
  • High-Density I/O Interfaces  With 300 I/Os, the device is well-suited for multi-interface gateway, sensor aggregation, and complex peripheral control.

Unique Advantages

  • Integrated Logic and Memory: Combining ~15,000 logic elements with ~1.05 Mbits of embedded RAM reduces external memory needs and simplifies board design.
  • High I/O Count: 300 I/Os provide flexible connectivity options to minimize multiplexing and external interface logic.
  • High-Speed Serial Capability: Family support for multi‑Gbps SERDES enables integration of high-bandwidth links without discrete transceivers.
  • Industrial Reliability: Rated for −40 °C to 105 °C operation to support deployments in demanding environments.
  • Compact Ball-Grid Packaging: 900-ball BGA (900-FPBGA, 31×31) delivers high pin count in a board-friendly surface-mount footprint.
  • Design and Test Support: Family-level system features such as IEEE 1149.1 and ispTRACY ease debugging, in-system configuration, and production testing.

Why Choose LFSCM3GA15EP1-6FN900I?

The LFSCM3GA15EP1-6FN900I positions itself as a balanced, industrial-grade FPGA option that blends a substantial logic fabric, on-chip memory, and high I/O density in a compact BGA package. It targets applications that require mid-range logic capacity with robust connectivity and on-chip storage while supporting industrial temperature operation.

Backed by Lattice Semiconductor's SC/M family-level features—such as high-speed serial support, comprehensive clocking resources, and system-level debug/configuration capabilities—this device is suitable for teams building communication infrastructure, industrial automation equipment, and other systems that demand integrated performance and reliable operation.

Request a quote or submit an inquiry to get pricing and availability for LFSCM3GA15EP1-6FN900I and to discuss how this FPGA can fit your next design.

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