LFSCM3GA15EP1-6FN900I
| Part Description |
SCM Field Programmable Gate Array (FPGA) IC 300 1054720 15000 900-BBGA |
|---|---|
| Quantity | 824 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 900-FPBGA (31x31) | Grade | Industrial | Operating Temperature | -40°C – 105°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 900-BBGA | Number of I/O | 300 | Voltage | 950 mV - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 3750 | Number of Logic Elements/Cells | 15000 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 1054720 |
Overview of LFSCM3GA15EP1-6FN900I – SCM Field Programmable Gate Array (FPGA) IC, 15,000 Logic Elements, 300 I/Os, 900-BBGA
The LFSCM3GA15EP1-6FN900I is an industrial-grade FPGA from Lattice Semiconductor's SC/M family. It combines a high-performance FPGA fabric with abundant on-chip memory and a high I/O count to address communication networking and industrial system applications.
Designed for designs that require dense logic, substantial embedded memory, and multi-standard high-speed interfaces, this device delivers integration and flexibility while supporting operation across a wide industrial temperature range.
Key Features
- Core Logic Approximately 15,000 logic elements for implementing custom digital functions and moderate-complexity designs.
- Embedded Memory Approximately 1.05 Mbits of on-chip RAM (1,054,720 bits) to support FIFOs, buffering, and local data storage.
- I/O Density 300 I/Os provide broad external interface capability for peripherals, buses, and system interconnects.
- High‑Speed Serial Capability (family feature) Lattice SC/M family devices include 4 to 32 high-speed SERDES with performance ranging from 600 Mbps to 3.8 Gbps for multi-gigabit link implementations.
- I/O Standards & Signal Integrity (family feature) Family-level support for a wide set of standards including LVCMOS, LVTTL, SSTL, HSTL, PCI/PCI‑X, LVDS variants and programmable on-die termination options to support diverse interface requirements.
- Clocking & Timing (family feature) Extensive clocking resources including analog PLLs and DLLs for flexible frequency synthesis, edge clocks and dynamic clock select capabilities suitable for complex clock networks.
- Package & Mounting 900-ball BGA package (supplier device package: 900-FPBGA, 31×31) in a surface-mount form factor for compact board integration.
- Power & Supply Core supply range from 0.95 V to 1.26 V to match system power domains.
- Industrial Temperature Grade Rated for operation from −40 °C to 105 °C, enabling deployment in industrial environments.
- Compliance RoHS compliant for regulatory and environmental adherence.
- System-Level Support (family feature) Family-level features include IEEE 1149.1 boundary scan, ispTRACY internal logic analyzer, and IEEE 1532 in-system configuration to aid development and production test.
Typical Applications
- Communication Systems High-speed SERDES and flexible I/O support make this FPGA suitable for protocol bridging, line cards, and network interface functions.
- Industrial Control Industrial temperature rating and robust I/O count enable motor control, motion systems, and factory automation logic functions.
- Memory-Intensive Subsystems Approximately 1.05 Mbits of embedded RAM supports buffering, packet processing, and FIFO-based data handling.
- High-Density I/O Interfaces With 300 I/Os, the device is well-suited for multi-interface gateway, sensor aggregation, and complex peripheral control.
Unique Advantages
- Integrated Logic and Memory: Combining ~15,000 logic elements with ~1.05 Mbits of embedded RAM reduces external memory needs and simplifies board design.
- High I/O Count: 300 I/Os provide flexible connectivity options to minimize multiplexing and external interface logic.
- High-Speed Serial Capability: Family support for multi‑Gbps SERDES enables integration of high-bandwidth links without discrete transceivers.
- Industrial Reliability: Rated for −40 °C to 105 °C operation to support deployments in demanding environments.
- Compact Ball-Grid Packaging: 900-ball BGA (900-FPBGA, 31×31) delivers high pin count in a board-friendly surface-mount footprint.
- Design and Test Support: Family-level system features such as IEEE 1149.1 and ispTRACY ease debugging, in-system configuration, and production testing.
Why Choose LFSCM3GA15EP1-6FN900I?
The LFSCM3GA15EP1-6FN900I positions itself as a balanced, industrial-grade FPGA option that blends a substantial logic fabric, on-chip memory, and high I/O density in a compact BGA package. It targets applications that require mid-range logic capacity with robust connectivity and on-chip storage while supporting industrial temperature operation.
Backed by Lattice Semiconductor's SC/M family-level features—such as high-speed serial support, comprehensive clocking resources, and system-level debug/configuration capabilities—this device is suitable for teams building communication infrastructure, industrial automation equipment, and other systems that demand integrated performance and reliable operation.
Request a quote or submit an inquiry to get pricing and availability for LFSCM3GA15EP1-6FN900I and to discuss how this FPGA can fit your next design.