LFSCM3GA15EP1-6F900C

The LFSCM3GA15EP1-6F900C is an SCM Field Programmable Gate Array from Lattice Semiconductor Corporation designed for mid-density, memory-intensive embedded and communications applications. This device delivers 15,000 logic elements, approximately 1.05 Mbits of on-chip RAM, and 300 I/O pins in a 900-ball BGA package, offering a compact, high-integration solution for designs that require significant logic and local memory in a surface-mount form factor.

Key Features

• Logic Capacity  15,000 logic elements suitable for mid-range FPGA functions and custom logic implementation.
• Embedded Memory  Total on-chip RAM of 1,054,720 bits (approximately 1.05 Mbits) to support data buffering, FIFOs, and local storage without external memory.
• I/O Density  300 general-purpose I/Os to accommodate high pin-count interfaces and multiple external peripherals.
• Package & Mounting  900-BBGA package (supplier device package: 900-FPBGA 31 × 31) with surface mount capability for compact board layouts.
• Supply Voltage  Operates from 0.95 V to 1.26 V, enabling integration into systems with low-voltage core rails.
• Operating Temperature  Commercial-grade operation from 0 °C to 85 °C for standard ambient deployments.
• Compliance  RoHS compliant.
• LatticeSC/M Family Capabilities  The LatticeSC/M family (as documented in the product datasheet) provides high-performance FPGA fabric, high-speed SERDES and flexiPCS options, extensive clocking resources including PLLs and DLLs, and memory-rich architectures—features available across the family for designers to leverage.

Typical Applications

• Communication and Networking Equipment  High I/O density and on-chip memory make the device suitable for protocol bridging, packet handling, and interface adaptation in network systems.
• Embedded Systems  Local RAM and abundant logic elements support control/datapath logic, sensor aggregation, and on-board preprocessing tasks.
• High-Density I/O Interfaces  300 I/Os enable multi-channel data acquisition, board-level aggregation, and complex peripheral connectivity.
• Memory-Intensive Logic  Approximately 1.05 Mbits of embedded memory is useful for buffering, FIFOs, and other data-intensive functions inside the FPGA fabric.

Unique Advantages

• Balanced Integration:  Combines 15,000 logic elements with substantial on-chip RAM to reduce reliance on external memory and simplify BOM.
• High I/O Count:  300 I/Os provide flexibility for dense interface designs, reducing the need for external I/O expanders.
• Compact Packaging:  900-ball BGA (31 × 31) enables a high-pin-count solution in a space-efficient surface-mount format.
• Low-Voltage Core Support:  Core supply range of 0.95 V to 1.26 V supports modern low-voltage system architectures.
• Commercial-Grade Temperature:  Rated 0 °C to 85 °C for standard commercial applications where this operating range is required.
• Standards-Backed Family Features:  Access to LatticeSC/M family architecture and documented capabilities (clocking, SERDES, memory structures) helps streamline system-level design choices.

Why Choose LFSCM3GA15EP1-6F900C?

The LFSCM3GA15EP1-6F900C positions itself as a mid-density, memory-capable FPGA that balances logic capacity, embedded RAM and high I/O count in a compact 900-BBGA package. It is well-suited for designers building communication equipment, embedded controllers, and I/O-rich systems who need integrated memory and a substantial number of I/Os without moving to larger, higher-cost devices.

Built on the LatticeSC/M family platform, this device benefits from documented family-level features and architecture while offering a clear specification set—making it a practical choice for teams that require predictable performance, reduced external BOM, and a commercially rated operating temperature range.

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