LFSCM3GA15EP1-5F256C
| Part Description |
SCM Field Programmable Gate Array (FPGA) IC 139 1054720 15000 256-BGA |
|---|---|
| Quantity | 1,493 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 256-FPBGA (17x17) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-BGA | Number of I/O | 139 | Voltage | 950 mV - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 3750 | Number of Logic Elements/Cells | 15000 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 1054720 |
Overview of LFSCM3GA15EP1-5F256C – SCM Field Programmable Gate Array, 15K logic elements, ~1.05 Mbit RAM, 256-BGA
The LFSCM3GA15EP1-5F256C is a commercial-grade SCM-series Field Programmable Gate Array from Lattice Semiconductor Corporation. This device combines a high-density logic fabric with embedded RAM and a large I/O count in a compact 256-pin BGA package suitable for commercial embedded applications.
With 15,000 logic elements, approximately 1.05 Mbits of on-chip RAM and 139 user I/Os, the device is designed for applications that require moderate logic density, substantial local memory, and a high number of external interfaces while operating within a 0 °C to 85 °C temperature range and a 0.95 V to 1.26 V supply window.
Key Features
- Logic Capacity 15,000 logic elements for implementing complex combinational and sequential logic functions.
- Embedded Memory Approximately 1.05 Mbits of total on-chip RAM to support buffering, FIFOs, and local data storage.
- I/O Count & Flexibility 139 I/O pins suitable for multi‑interface systems and high pin‑count peripheral connectivity.
- Package & Mounting 256-FPBGA (17×17) / 256-BGA surface-mount package for compact board-level integration.
- Power Supply Core operating range from 0.95 V to 1.26 V to match low-voltage system rails.
- Operating Temperature & Grade Commercial grade device rated for 0 °C to 85 °C ambient operation.
- Environmental Compliance RoHS compliant.
- Family-Level Architecture Part of the Lattice SC/M family, which provides a high-performance FPGA fabric and family-level features such as block RAM and advanced clocking (as described in the SC/M family data).
Typical Applications
- Commercial Embedded Systems Control and coordination logic in commercial products where a balance of logic resources, embedded memory, and I/O density is required.
- Communications & Connectivity Protocol bridging, interface adaptation, and I/O aggregation that benefit from abundant I/Os and on-chip memory for buffering.
- Data Acquisition & Processing On-device buffering and preprocessing using embedded RAM and logic elements for sensor or peripheral data streams.
- Prototyping & System Integration Platform for evaluating custom logic, proof-of-concept designs, and integrating multiple peripheral interfaces on a single device.
Unique Advantages
- High integration density: Combines 15,000 logic elements with approximately 1.05 Mbits of embedded memory and 139 I/Os, reducing external components and board complexity.
- Compact BGA package: 256-FPBGA (17×17) package enables a small board footprint for space-constrained commercial designs.
- Low-voltage operation: 0.95 V to 1.26 V supply range supports integration into modern low-voltage systems.
- Commercial temperature rating: Designed for 0 °C to 85 °C environments common to many consumer and commercial applications.
- RoHS compliant: Meets environmental compliance requirements for lead-free assemblies.
- Family architecture benefits: Leverages the Lattice SC/M family architecture for established FPGA fabric, embedded memory structures, and clocking resources described in the family data.
Why Choose LFSCM3GA15EP1-5F256C?
The LFSCM3GA15EP1-5F256C positions itself as a capable, commercially rated FPGA option for designs that require a blend of logic density, on-chip memory and a substantial I/O count in a compact BGA package. Its combination of 15,000 logic elements and approximately 1.05 Mbits of embedded RAM supports moderate-to-complex control, buffering and interface tasks without excessive external components.
This device is well suited for engineers building commercial embedded systems, communications modules, or prototype platforms that need reliable, RoHS-compliant FPGA resources with a clear supply-voltage and temperature envelope. The SC/M family architecture provides documented fabric and system-level features for streamlined integration into broader designs.
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