LFSCM3GA115EP1-6FFN1152C

The LFSCM3GA115EP1-6FFN1152C is a high-performance FPGA from the Lattice SC/M family, offering a dense logic fabric, large embedded memory, and extensive I/O in a compact 1152-ball BGA package. It is designed for applications that require significant on-chip logic, high I/O counts and advanced SERDES/I/O capabilities provided by the SC/M series architecture.

This device targets commercial-temperature designs and provides a combination of logic capacity, embedded RAM, multi-gigabit SERDES capability (series-level), and flexible I/O standards for networking, communication, and system integration tasks.

Key Features

• Logic Capacity – 115,000 logic elements suitable for complex digital designs and large-scale logic integration.
• Embedded Memory – Approximately 7.99 Mbits of on-chip RAM to support memory-intensive functions, FIFO buffering and embedded data processing.
• I/O Density – 660 user I/Os, enabling broad peripheral connectivity and high pin-count system interfaces in a single device.
• High-Speed SERDES & I/O (Series Capabilities) – SC/M family devices support 4 to 32 high-speed SERDES channels with performance up to multi-gigabit rates and advanced PCS features as defined for the series.
• Clocking and Timing (Series Capabilities) – Series architecture includes high-performance PLLs and DLLs with GHz-class edge clocks and extensive clocking resources to support demanding timing requirements.
• Package & Mounting – 1152-ball BGA (supplier package: 1152-FPBGA 35×35), surface-mount for automated assembly and compact board designs.
• Power Supply – Operates from 0.95 V to 1.26 V, supporting low-voltage system designs.
• Commercial Temperature Grade – Rated for 0 °C to 85 °C operation for standard commercial applications.
• RoHS Compliant – Meets standard lead-free and environmental compliance requirements.

Typical Applications

• High-Speed Networking – Implement multi-protocol interfaces and packet processing using the device’s high logic count, large embedded RAM and series SERDES capability.
• Protocol Bridging and Interface Engines – Use the abundant I/O and embedded memory to build robust protocol converters, DMA engines and front-end interface logic.
• Embedded System Controllers – Integrate complex control logic, memory buffers and peripheral interfaces for communications equipment and system controllers.
• Data Buffering and Packet Processing – Leverage nearly 8 Mbits of on-chip RAM and plentiful logic to implement FIFOs, packet queues and local data processing blocks.

Unique Advantages

• High Integration: Combines 115,000 logic elements, nearly 8 Mbits of embedded RAM and 660 I/Os in a single 1152-BBGA package to reduce BOM and board area.
• Flexible I/O and SERDES Support: Series-level high-speed SERDES and programmable I/O options enable implementation of a variety of serial and parallel interfaces without external PHYs.
• Low-Voltage Operation: 0.95 V to 1.26 V supply range supports low-power system designs and modern power rails.
• Commercial Temperature Fit: Specified 0 °C to 85 °C operation for mainstream commercial and enterprise applications.
• Manufacturing-Friendly Package: 1152-ball FPBGA (35×35) surface-mount package supports high-density board layouts and standard assembly processes.
• Standards-Conscious Series Architecture: SC/M family features such as embedded sysMEM and advanced clocking resources are available across the series to accelerate system-level design.

Why Choose LFSCM3GA115EP1-6FFN1152C?

The LFSCM3GA115EP1-6FFN1152C positions itself as a solution for designers who need a high-logic, memory-rich FPGA with substantial I/O and advanced series-level high-speed interface capabilities. Its combination of 115,000 logic elements, approximately 7.99 Mbits of embedded RAM and 660 I/Os in a 1152-BBGA package offers a compact, integrated platform for communication, networking and embedded processing applications.

For teams building commercial-temperature systems that demand dense logic, on-chip memory and flexible interface options, this device provides a scalable and manufacturable foundation backed by the Lattice SC/M family architecture.

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