LFSCM3GA115EP1-5FFN1152I
| Part Description |
SCM Field Programmable Gate Array (FPGA) IC 660 7987200 115000 1152-BBGA |
|---|---|
| Quantity | 246 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 1152-FPBGA (35x35) | Grade | Industrial | Operating Temperature | -40°C – 105°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1152-BBGA | Number of I/O | 660 | Voltage | 950 mV - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 28750 | Number of Logic Elements/Cells | 115000 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 7987200 |
Overview of LFSCM3GA115EP1-5FFN1152I – SCM Field Programmable Gate Array (1152-BBGA)
The LFSCM3GA115EP1-5FFN1152I is a high-density field programmable gate array (FPGA) from Lattice Semiconductor’s SC/M family. It combines a high-performance FPGA fabric with extensive I/O, substantial embedded memory, and system-level clocking and SERDES features designed for complex digital and communication applications.
With 115,000 logic elements, approximately 7.99 Mbits of embedded RAM and 660 I/Os in a 1152-ball BGA package, this industrial-grade device targets high-performance networking, communications infrastructure, and advanced embedded systems that require large logic capacity and flexible high-speed interfaces.
Key Features
- High-density FPGA Core 115,000 logic elements (LUT4-based fabric) supporting complex logic and routing requirements for large designs.
- Embedded Memory Approximately 7.99 Mbits of on-chip RAM to support large data buffering, packet processing, or FPGA-implemented memory structures.
- Extensive I/O 660 I/O pins provide broad system connectivity and interface options for parallel and serial subsystems.
- High-speed SERDES & flexiPCS (family feature) SC/M family devices include support for 4 to 32 high-speed SERDES channels and embedded PCS options for serial protocols and link layers used in communications systems.
- Advanced I/O Performance PURESPEED™ I/O architecture (family feature) supports differential interfaces up to 2 Gbps DDR and a wide set of electrical standards for flexible memory and interface signaling.
- Clocking and Timing Rich sysCLOCK™ resources in the family include multiple PLLs and DLLs with broad frequency ranges, enabling precise clock management and high-frequency global and edge clocks.
- Package & Mounting 1152-BBGA package (supplier package: 1152-FPBGA, 35×35 mm) configured for surface-mount assembly in compact, high-pin-count designs.
- Industrial Temperature Range Rated for operation from −40°C to 105°C to meet industrial environmental needs.
- Low-voltage Core Supply Operates from 0.95 V to 1.26 V core supply, suitable for modern low-voltage system architectures.
- Compliance RoHS compliant.
Typical Applications
- Networking & Telecom Infrastructure Large logic capacity, high-speed SERDES support, and abundant I/O make the device suitable for switch, router, and line-card designs that require packet processing and protocol handling.
- High-speed Serial Interfaces Use in systems implementing serial link protocols and physical-layer subsystems where embedded PCS and SERDES capability are required.
- Embedded System Acceleration Implement custom processing blocks, offload compute kernels, or create hardware accelerators leveraging the large logic array and on-chip RAM.
Unique Advantages
- Large Logic & Memory Capacity: 115,000 logic elements and approximately 7.99 Mbits of embedded RAM allow integration of substantial functionality on-chip, reducing external components.
- Rich I/O Count: 660 I/Os provide flexibility for complex board-level connectivity and multiple parallel interfaces without sacrificing pin availability.
- Industrial Reliability: Rated for −40°C to 105°C operation, supporting deployment in industrial environments.
- Compact High-pin Package: 1152-ball BGA (35×35 mm) delivers high I/O density in a compact footprint suitable for space-constrained system boards.
- Low-voltage Core Operation: 0.95–1.26 V supply range aligns with modern low-voltage power rails, enabling efficient integration into current power budgets.
- Standards-oriented SERDES & PCS (family-level): Embedded PCS and SERDES support common communication standards, simplifying implementation of high-speed links.
Why Choose LFSCM3GA115EP1-5FFN1152I?
LFSCM3GA115EP1-5FFN1152I is positioned for designs that require substantial logic density, significant on-chip memory, and wide connectivity in an industrial-grade package. Its combination of 115,000 logic elements, roughly 7.99 Mbits of embedded RAM, and 660 I/Os provides the integration and scalability needed for advanced networking, high-speed interface, and embedded acceleration applications.
Selecting this FPGA brings the benefits of the SC/M family’s system-level features—robust clocking, high-performance I/O architectures, and SERDES/PCS capability—backed by RoHS compliance and industrial temperature rating for long-term deployment in demanding environments.
Request a quote for LFSCM3GA115EP1-5FFN1152I or submit an RFQ to get pricing and availability information for your project needs.

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