LFSCM3GA115EP1-5FFN1152I

IC FPGA 660 I/O 1152FBGA
Part Description

SCM Field Programmable Gate Array (FPGA) IC 660 7987200 115000 1152-BBGA

Quantity 246 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package1152-FPBGA (35x35)GradeIndustrialOperating Temperature-40°C – 105°C
Package / Case1152-BBGANumber of I/O660Voltage950 mV - 1.26 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs28750Number of Logic Elements/Cells115000
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits7987200

Overview of LFSCM3GA115EP1-5FFN1152I – SCM Field Programmable Gate Array (1152-BBGA)

The LFSCM3GA115EP1-5FFN1152I is a high-density field programmable gate array (FPGA) from Lattice Semiconductor’s SC/M family. It combines a high-performance FPGA fabric with extensive I/O, substantial embedded memory, and system-level clocking and SERDES features designed for complex digital and communication applications.

With 115,000 logic elements, approximately 7.99 Mbits of embedded RAM and 660 I/Os in a 1152-ball BGA package, this industrial-grade device targets high-performance networking, communications infrastructure, and advanced embedded systems that require large logic capacity and flexible high-speed interfaces.

Key Features

  • High-density FPGA Core  115,000 logic elements (LUT4-based fabric) supporting complex logic and routing requirements for large designs.
  • Embedded Memory  Approximately 7.99 Mbits of on-chip RAM to support large data buffering, packet processing, or FPGA-implemented memory structures.
  • Extensive I/O  660 I/O pins provide broad system connectivity and interface options for parallel and serial subsystems.
  • High-speed SERDES & flexiPCS (family feature)  SC/M family devices include support for 4 to 32 high-speed SERDES channels and embedded PCS options for serial protocols and link layers used in communications systems.
  • Advanced I/O Performance  PURESPEED™ I/O architecture (family feature) supports differential interfaces up to 2 Gbps DDR and a wide set of electrical standards for flexible memory and interface signaling.
  • Clocking and Timing  Rich sysCLOCK™ resources in the family include multiple PLLs and DLLs with broad frequency ranges, enabling precise clock management and high-frequency global and edge clocks.
  • Package & Mounting  1152-BBGA package (supplier package: 1152-FPBGA, 35×35 mm) configured for surface-mount assembly in compact, high-pin-count designs.
  • Industrial Temperature Range  Rated for operation from −40°C to 105°C to meet industrial environmental needs.
  • Low-voltage Core Supply  Operates from 0.95 V to 1.26 V core supply, suitable for modern low-voltage system architectures.
  • Compliance  RoHS compliant.

Typical Applications

  • Networking & Telecom Infrastructure  Large logic capacity, high-speed SERDES support, and abundant I/O make the device suitable for switch, router, and line-card designs that require packet processing and protocol handling.
  • High-speed Serial Interfaces  Use in systems implementing serial link protocols and physical-layer subsystems where embedded PCS and SERDES capability are required.
  • Embedded System Acceleration  Implement custom processing blocks, offload compute kernels, or create hardware accelerators leveraging the large logic array and on-chip RAM.

Unique Advantages

  • Large Logic & Memory Capacity:  115,000 logic elements and approximately 7.99 Mbits of embedded RAM allow integration of substantial functionality on-chip, reducing external components.
  • Rich I/O Count:  660 I/Os provide flexibility for complex board-level connectivity and multiple parallel interfaces without sacrificing pin availability.
  • Industrial Reliability:  Rated for −40°C to 105°C operation, supporting deployment in industrial environments.
  • Compact High-pin Package:  1152-ball BGA (35×35 mm) delivers high I/O density in a compact footprint suitable for space-constrained system boards.
  • Low-voltage Core Operation:  0.95–1.26 V supply range aligns with modern low-voltage power rails, enabling efficient integration into current power budgets.
  • Standards-oriented SERDES & PCS (family-level):  Embedded PCS and SERDES support common communication standards, simplifying implementation of high-speed links.

Why Choose LFSCM3GA115EP1-5FFN1152I?

LFSCM3GA115EP1-5FFN1152I is positioned for designs that require substantial logic density, significant on-chip memory, and wide connectivity in an industrial-grade package. Its combination of 115,000 logic elements, roughly 7.99 Mbits of embedded RAM, and 660 I/Os provides the integration and scalability needed for advanced networking, high-speed interface, and embedded acceleration applications.

Selecting this FPGA brings the benefits of the SC/M family’s system-level features—robust clocking, high-performance I/O architectures, and SERDES/PCS capability—backed by RoHS compliance and industrial temperature rating for long-term deployment in demanding environments.

Request a quote for LFSCM3GA115EP1-5FFN1152I or submit an RFQ to get pricing and availability information for your project needs.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 1983


    Headquarters: Hillsboro, Oregon, USA


    Employees: 1,000+


    Revenue: $627.7 Million


    Certifications and Memberships: ISO9001:2015, ISO14001:2015, IATF16949:2016


    Featured Products
    Latest News
    keyboard_arrow_up