LFSCM3GA115EP1-5FCN1152I

The LFSCM3GA115EP1-5FCN1152I is a Lattice Semiconductor SCM family FPGA offering a high-performance FPGA fabric with extensive I/O and embedded memory in a 1152-ball FCBGA package. Designed for industrial-grade applications, it targets communication and embedded system designs that require large logic capacity, abundant I/O, and on-chip RAM.

Its architecture integrates high-speed SERDES and advanced I/O features from the LatticeSC/M family alongside substantial embedded memory and a precision clocking network, delivering a highly configurable platform for network interfaces, high-speed data paths, and system-level integration.

Key Features

• Logic Capacity  115,000 logic elements (LUT4-based architecture) for complex digital designs and high integration density.
• I/O Density  660 I/Os to support wide parallel interfaces, multiple peripherals, and dense connectivity in constrained board layouts.
• Embedded Memory  Approximately 7.99 Mbits of on-chip RAM (total RAM bits: 7,987,200) for large buffers, FIFOs, and data storage without external memory.
• High-Performance SERDES (family capability)  The LatticeSC/M family supports 4 to 32 high-speed SERDES with flexiPCS, providing serial link performance from 600 Mbps up to 3.8 Gbps for a range of serial protocols.
• High-Speed PURESPEED™ I/O (family capability)  Supports differential I/O up to 2 Gbps DDR and single-ended memory interfaces up to 800 Mbps, with per-pin input delay (INDEL) and adaptive input logic for robust timing alignment.
• Clocking and Timing  Family-level features include multiple analog PLLs and DLLs, support for primary 700 MHz and secondary 325 MHz clock networks, and 1 GHz edge clocks for high-frequency designs.
• Package & Mounting  1152-ball FCBGA package (35 × 35 mm) with surface-mount mounting for high pin-count, high-density board designs.
• Power and Temperature  Core supply range 0.95 V to 1.26 V and industrial operating temperature range −40 °C to 105 °C for deployment in demanding environments.
• Standards and I/O Support (family capability)  Supports a wide set of electrical standards including LVCMOS, LVTTL, SSTL, HSTL, PCI/PCI-X, LVDS variants, LVPECL, RSDS and programmable on-die termination options.
• RoHS Compliant  Meets RoHS environmental requirements.

Typical Applications

• Network Equipment  Implements high-speed serial links, packet buffering, and protocol processing for networking and telecom systems using on-chip SERDES and embedded RAM.
• High-Speed Serial Interfaces  Enables designers to build XAUI/PCIe/Serial RapidIO-style links and other multi-gigabit interfaces supported by the family-level PCS and SERDES capabilities.
• Embedded Systems and Platforms  Acts as a central programmable fabric for system control, peripheral aggregation, and custom logic in industrial embedded platforms.
• Memory-Intensive Designs  Supports large FIFOs, packet buffers, and frame storage leveraging approximately 7.99 Mbits of embedded memory and dedicated block-RAM logic.

Unique Advantages

• High logic and I/O density: 115,000 logic elements and 660 I/Os enable consolidation of multiple functions into a single device, reducing BOM and board complexity.
• Large on-chip memory: Approximately 7.99 Mbits of embedded RAM allows high-throughput buffering and data handling without immediate dependence on external memory.
• Industrial temperature range: Qualified for operation from −40 °C to 105 °C, suitable for a wide range of industrial environments.
• Flexible high-speed connectivity (series-level): Family SERDES and flexiPCS options support multiple serial protocols and multi-gigabit data lanes for scalable interface design.
• Precise clocking options (series-level): Multiple PLLs and DLLs and high-frequency clock networks support demanding timing requirements and complex clock domain management.
• Compact high-pin-count package: 1152-FCBGA (35 × 35 mm) provides the pin density needed for I/O-heavy designs while keeping board footprint manageable.

Why Choose LFSCM3GA115EP1-5FCN1152I?

The LFSCM3GA115EP1-5FCN1152I combines large logic capacity, extensive I/O, and substantial on-chip memory in an industrial-grade FPGA package. It is positioned for designs that require integration of high-density logic, multi-gigabit interfaces, and significant embedded RAM in a single device.

This device suits development teams building communication systems, high-performance embedded platforms, and industrial equipment where scalability, robust clocking, and flexible I/O options are required. Backed by the LatticeSC/M family architecture, it provides a solid platform for long-term, scalable designs with series-level support for SERDES, advanced I/O, and clock management.

Request a quote or submit a pricing inquiry to evaluate LFSCM3GA115EP1-5FCN1152I for your next design and receive availability and lead-time information.