LFSC3GA80E-6FFN1152I

The LFSC3GA80E-6FFN1152I is an SC-family Field Programmable Gate Array from Lattice Semiconductor designed for high-density, memory-intensive applications. It combines 80,000 logic elements with approximately 5.82 Mbits of embedded RAM and up to 660 I/Os, providing a compact, high-connectivity platform for communication, networking, and industrial systems.

This device is packaged in a 1152-BBGA (supplier package 1152-FPBGA, 35×35) and supports industrial operating temperatures, making it suitable for robust deployments requiring extensive I/O, embedded memory, and reconfigurable logic.

Key Features

• Logic Capacity  80,000 logic elements provide a high-density FPGA fabric for complex logic, protocol handling, and custom accelerators.
• Embedded Memory  Approximately 5.82 Mbits of on-chip RAM (total RAM bits 5,816,320) for large buffers, FIFOs, and memory-intensive processing.
• I/O Density  Up to 660 I/Os to support dense board-level connectivity and parallel interfaces.
• High-Speed SerDes and PCS (family-level capabilities)  SC-family devices offer 4 to 32 high-speed SERDES channels with performance from 600 Mbps to 3.8 Gbps and embedded PCS implementations for standards such as GbE, XAUI, and PCI Express.
• Flexible I/O Standards (family-level capabilities)  Extensive electrical standard support including multiple LVTTL/LVCMOS levels, SSTL/HSTL, LVDS variants, and programmable on-die termination for adaptable system interfacing.
• Clocking and Timing (family-level capabilities)  Advanced clock resources including multiple PLLs and DLLs with primary fabric clocks up to 700 MHz and I/O-connected edge clocks to 1 GHz for high-performance timing requirements.
• Power and Supply  Core supply operation from 0.95 V to 1.26 V to match modern low-voltage power domains.
• Package & Mounting  1152-BBGA (1152-FPBGA, 35×35) surface-mount package optimized for high-pin-count, compact board layouts.
• Industrial Temperature Grade  Rated for operation from −40 °C to 105 °C for deployment in industrial environments.
• RoHS Compliant  Meets RoHS environmental requirements for restricted hazardous substances.

Typical Applications

• High-Speed Networking  Implementation of serial interfaces, packet processing, and protocol bridging using high-speed SERDES and embedded PCS support.
• Memory-Intensive Processing  Buffering, packet queuing, and DSP front-ends that benefit from approximately 5.82 Mbits of on-chip RAM and dedicated FIFO logic.
• Industrial Control & I/O Aggregation  Dense I/O count and industrial temperature rating make the device well suited for multi-channel sensor interfaces and control systems.
• Custom Acceleration & Prototyping  Large logic capacity enables hardware acceleration of algorithms, protocol offload, and system-level integration for development and deployment.

Unique Advantages

• High logic density: 80,000 logic elements allow complex designs and multi-function integration on a single device, reducing BOM and board area.
• Substantial on-chip memory: Approximately 5.82 Mbits of embedded RAM supports large buffers and data paths without external memory dependency.
• Extensive I/O connectivity: 660 I/Os enable direct interfacing to a wide range of peripherals and parallel buses for flexible system topologies.
• Industrial robustness: −40 °C to 105 °C operating range and surface-mount BBGA package support reliable operation in demanding environments.
• Low-voltage core operation: 0.95 V to 1.26 V supply compatibility aligns with modern low-power system designs.
• Family-level high-speed communications: SC-family SERDES and embedded PCS options provide proven building blocks for multi-gigabit links and protocol support.

Why Choose LFSC3GA80E-6FFN1152I?

This Lattice SC-series FPGA delivers a balance of high logic density, significant embedded memory, and very large I/O capacity within a compact 1152-BBGA package. Its operating voltage range and industrial temperature rating make it a practical choice for systems that require durable, high-performance programmable logic with substantial on-chip resources.

Choose the LFSC3GA80E-6FFN1152I for designs that demand integrated memory, extensive interfacing, and scalable logic capacity—especially in networking, industrial, and memory-heavy applications where consolidation of functions into a single FPGA reduces system complexity and board-level integration effort.

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