LFSC3GA80E-5FFN1152I

The LFSC3GA80E-5FFN1152I is a field programmable gate array (FPGA) IC from the Lattice SC family that combines a high-performance FPGA fabric, high-speed serial transceivers and substantial on-chip memory. It targets communications and network systems, high-density interface applications and memory‑intensive embedded designs.

With approximately 80,000 logic elements, around 5.82 Mbits of embedded RAM and 660 I/Os in a 1152‑BBGA package, this device delivers a balance of integration, I/O density and timing resources for complex system designs. The device supports industrial temperature operation and RoHS compliance for deployment in demanding environments.

Key Features

• Programmable Logic Capacity  Approximately 80,000 logic elements and 20,000 logic array blocks, providing substantial fabric resources for complex logic and custom processing.
• Embedded Memory  Total on-chip RAM of 5,816,320 bits (approximately 5.82 Mbits) with sysMEM block RAM and distributed RAM options for buffer and state storage.
• I/O Density and Standards  Up to 660 I/Os in the 1152‑BBGA package. PURESPEED™ I/O supports differential and single‑ended interfaces and the datasheet lists broad electrical standard support (LVCMOS, LVDS variants, SSTL, HSTL, PCI, LVPECL and others).
• High‑Speed SERDES and flexiPCS  SC/M family devices include 4–32 high-speed SERDES per device with flexiPCS. SERDES performance ranges cited in the family data include 600 Mbps to 3.8 Gbps with embedded PCS for standards such as GbE, XAUI, PCI Express and Fibre Channel.
• Clocking and Timing  Series-level clock resources include multiple analog PLLs and DLLs, supporting high-frequency global clocks and I/O edge clocks (family clocking network described in the datasheet up to hundreds of MHz to 1 GHz range).
• Package, Power and Temperature  1152‑BBGA (supplier package 1152‑FPBGA, 35×35); surface mount. Supply voltage range 0.95 V to 1.26 V. Industrial operating temperature −40 °C to 105 °C. RoHS compliant.

Typical Applications

• High‑speed Communications & Networking  Uses high‑speed SERDES and embedded PCS to implement PHY and protocol bridging functions for network equipment and line cards.
• Serial Interface Aggregation  660 I/Os and flexible I/O standards enable aggregation and protocol conversion for multiple high‑bandwidth serial links.
• Memory‑Intensive Embedded Systems  Approximately 5.82 Mbits of embedded RAM and dedicated block RAM features support buffering, packet processing and complex state machines.
• Industrial Control and Instrumentation  Industrial temperature rating and broad I/O support make the device suitable for control systems requiring robust operation across temperature extremes.

Unique Advantages

• High integration in a single device: Combines large programmable logic capacity, multi‑megabit embedded memory and high I/O density to reduce system BOM and board area.
• Flexible high‑speed connectivity: Family SERDES and flexiPCS capabilities enable implementation of a wide range of serial protocols without external PHYs for many use cases.
• Rich I/O standard support: Support for multiple electrical interfaces enables direct connection to a broad set of peripherals and memory interfaces.
• Deterministic clocking resources: Multiple PLLs and DLLs and a comprehensive clock network provide the timing flexibility needed for mixed‑rate systems and precise interface timing.
• Industrial temperature performance: Rated for −40 °C to 105 °C, suitable for deployment in industrial environments requiring extended temperature operation.

Why Choose LFSC3GA80E-5FFN1152I?

The LFSC3GA80E-5FFN1152I offers a balanced platform of logic capacity, embedded memory and high‑density I/O in a single 1152‑BBGA package. As part of the Lattice SC/M family, it brings series‑level architecture and system features—such as configurable clocking, SERDES with embedded PCS and robust I/O options—that simplify integration for communications, networking and memory‑heavy applications.

Design teams seeking a scalable, high‑function FPGA with industrial temperature support and a low‑voltage core supply will find this device suitable for projects that require high I/O count, significant on‑chip RAM and flexible high‑speed serial interfaces.

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