LFSC3GA80E-6FC1152C

IC FPGA 660 I/O 1152FCBGA
Part Description

SC Field Programmable Gate Array (FPGA) IC 660 5816320 80000 1152-BCBGA, FCBGA

Quantity 393 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package1152-CFCBGA (35x35)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1152-BCBGA, FCBGANumber of I/O660Voltage950 mV - 1.26 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs20000Number of Logic Elements/Cells80000
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits5816320

Overview of LFSC3GA80E-6FC1152C – SC Field Programmable Gate Array (FPGA) IC

The LFSC3GA80E-6FC1152C is a commercial-grade SC-family FPGA from Lattice Semiconductor, delivered in a 1152-ball BCBGA/FCBGA package. The device integrates a large FPGA fabric with high I/O density and significant on-chip memory, making it suitable for complex digital systems that require high channel counts, large programmable logic capacity, and low-voltage operation.

Typical use cases include communications and networking subsystems, high-density I/O aggregation, and embedded logic functions where compact BGA packaging, high logic count, and substantial embedded memory are priorities.

Key Features

  • Logic Capacity  Provides 80,000 logic elements to implement complex digital functions and custom processing pipelines.
  • On-chip Memory  Approximately 5.82 Mbits of total on-chip RAM (5,816,320 bits) for FIFOs, frame buffers, and data buffering.
  • I/O Density  Up to 660 I/O pins available in the 1152-ball BCBGA/FCBGA package for broad interfacing to peripherals and high-density connectors.
  • Low-Voltage Core Supply  Core supply range from 0.95 V to 1.26 V to support low-power system designs.
  • Commercial Temperature Grade  Specified for operation from 0 °C to 85 °C for standard commercial applications.
  • Package & Mounting  1152-BCBGA (FCBGA) package, supplier package noted as 1152-CFCBGA (35×35); surface-mount mounting type for compact board-level integration.
  • RoHS Compliant  Material and manufacturing compliant with RoHS requirements.
  • Lattice SC/M Family Capabilities  As part of the Lattice SC/M family, the architecture supports high-performance FPGA fabric, high-speed SERDES and advanced I/O standards and clocking resources (family-level features).

Typical Applications

  • Communications & Networking  High I/O count and large embedded RAM support packet buffering, protocol bridging and aggregation functions in networking subsystems.
  • High-density Interface Hubs  Use the device to consolidate and route many signals between subsystems where a compact BGA package with numerous I/Os is required.
  • Embedded Logic & Acceleration  Implement custom datapaths, packet processors or control logic that leverage the 80,000 logic elements and on-chip memory.
  • Prototyping & System Integration  Suitable for system prototypes and product variants where a commercial-grade FPGA with significant programmable resources is needed.

Unique Advantages

  • High Logic Density:  80,000 logic elements enable implementation of large, multi-function designs on a single device, reducing component count.
  • Substantial On-chip Memory:  Approximately 5.82 Mbits of RAM lessen reliance on external memory for buffering and data handling, simplifying board design.
  • Extensive I/O Resources:  660 I/Os provide broad interfacing options for high-channel-count systems and dense connector applications.
  • Compact BGA Package:  1152-ball BCBGA/FCBGA packaging delivers high pin count in a space-efficient form factor for constrained PCB real estate.
  • Low-Voltage Operation:  0.95 V to 1.26 V core supply supports designs targeting lower power consumption at the core level.
  • RoHS Compliance:  Meets RoHS requirements for environmentally conscious manufacturing and supply chain compatibility.

Why Choose LFSC3GA80E-6FC1152C?

The LFSC3GA80E-6FC1152C positions itself as a high-capacity, high-I/O commercial FPGA option for engineers needing substantial programmable logic and on-chip memory in a compact BGA package. Its combination of 80,000 logic elements, approximately 5.82 Mbits of RAM, and 660 I/Os provides the building blocks for complex communication, interface, and embedded processing designs.

This device is best suited for development teams and product designs that require a scalable FPGA fabric with dense I/O and embedded memory without industrial or automotive temperature grading. Its RoHS-compliant construction and surface-mount BGA packaging simplify modern PCB assembly and regulatory considerations.

If you would like a formal quote or more information about availability and ordering, submit a request for a quote or sales inquiry with the part number LFSC3GA80E-6FC1152C.

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