LFSC3GA80E-6FC1152C
| Part Description |
SC Field Programmable Gate Array (FPGA) IC 660 5816320 80000 1152-BCBGA, FCBGA |
|---|---|
| Quantity | 393 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 1152-CFCBGA (35x35) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1152-BCBGA, FCBGA | Number of I/O | 660 | Voltage | 950 mV - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 20000 | Number of Logic Elements/Cells | 80000 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 5816320 |
Overview of LFSC3GA80E-6FC1152C – SC Field Programmable Gate Array (FPGA) IC
The LFSC3GA80E-6FC1152C is a commercial-grade SC-family FPGA from Lattice Semiconductor, delivered in a 1152-ball BCBGA/FCBGA package. The device integrates a large FPGA fabric with high I/O density and significant on-chip memory, making it suitable for complex digital systems that require high channel counts, large programmable logic capacity, and low-voltage operation.
Typical use cases include communications and networking subsystems, high-density I/O aggregation, and embedded logic functions where compact BGA packaging, high logic count, and substantial embedded memory are priorities.
Key Features
- Logic Capacity Provides 80,000 logic elements to implement complex digital functions and custom processing pipelines.
- On-chip Memory Approximately 5.82 Mbits of total on-chip RAM (5,816,320 bits) for FIFOs, frame buffers, and data buffering.
- I/O Density Up to 660 I/O pins available in the 1152-ball BCBGA/FCBGA package for broad interfacing to peripherals and high-density connectors.
- Low-Voltage Core Supply Core supply range from 0.95 V to 1.26 V to support low-power system designs.
- Commercial Temperature Grade Specified for operation from 0 °C to 85 °C for standard commercial applications.
- Package & Mounting 1152-BCBGA (FCBGA) package, supplier package noted as 1152-CFCBGA (35×35); surface-mount mounting type for compact board-level integration.
- RoHS Compliant Material and manufacturing compliant with RoHS requirements.
- Lattice SC/M Family Capabilities As part of the Lattice SC/M family, the architecture supports high-performance FPGA fabric, high-speed SERDES and advanced I/O standards and clocking resources (family-level features).
Typical Applications
- Communications & Networking High I/O count and large embedded RAM support packet buffering, protocol bridging and aggregation functions in networking subsystems.
- High-density Interface Hubs Use the device to consolidate and route many signals between subsystems where a compact BGA package with numerous I/Os is required.
- Embedded Logic & Acceleration Implement custom datapaths, packet processors or control logic that leverage the 80,000 logic elements and on-chip memory.
- Prototyping & System Integration Suitable for system prototypes and product variants where a commercial-grade FPGA with significant programmable resources is needed.
Unique Advantages
- High Logic Density: 80,000 logic elements enable implementation of large, multi-function designs on a single device, reducing component count.
- Substantial On-chip Memory: Approximately 5.82 Mbits of RAM lessen reliance on external memory for buffering and data handling, simplifying board design.
- Extensive I/O Resources: 660 I/Os provide broad interfacing options for high-channel-count systems and dense connector applications.
- Compact BGA Package: 1152-ball BCBGA/FCBGA packaging delivers high pin count in a space-efficient form factor for constrained PCB real estate.
- Low-Voltage Operation: 0.95 V to 1.26 V core supply supports designs targeting lower power consumption at the core level.
- RoHS Compliance: Meets RoHS requirements for environmentally conscious manufacturing and supply chain compatibility.
Why Choose LFSC3GA80E-6FC1152C?
The LFSC3GA80E-6FC1152C positions itself as a high-capacity, high-I/O commercial FPGA option for engineers needing substantial programmable logic and on-chip memory in a compact BGA package. Its combination of 80,000 logic elements, approximately 5.82 Mbits of RAM, and 660 I/Os provides the building blocks for complex communication, interface, and embedded processing designs.
This device is best suited for development teams and product designs that require a scalable FPGA fabric with dense I/O and embedded memory without industrial or automotive temperature grading. Its RoHS-compliant construction and surface-mount BGA packaging simplify modern PCB assembly and regulatory considerations.
If you would like a formal quote or more information about availability and ordering, submit a request for a quote or sales inquiry with the part number LFSC3GA80E-6FC1152C.

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