LFSC3GA80E-6FFN1152C

The LFSC3GA80E-6FFN1152C is a Lattice SC family Field Programmable Gate Array (FPGA) supplied in a 1152‑ball BGA package. It combines a high‑density programmable fabric with large on‑chip memory and a high I/O count, targeting applications that require complex logic integration and heavy data buffering.

Engineered for commercial‑grade systems, this device is suitable for networking, communications, and high‑density embedded designs where performance and integration reduce system bill‑of‑materials and board complexity.

Key Features

• High‑density logic — 80,000 logic elements provide capacity for sizeable custom logic, protocol handling, and packet processing functions.
• Embedded memory — Approximately 5.82 Mbits of on‑chip RAM supports FIFOs, packet buffering, and other memory‑intensive functions.
• Extensive I/O — 660 user I/Os allow dense external connectivity for interfaces, parallel buses, and multi‑lane I/O requirements.
• Core voltage range — Supports a supply range of 0.95 V to 1.26 V to match system power rails and FPGA core requirements.
• Package and mounting — Supplied in a 1152‑BBGA (listed as 1152‑FPBGA, 35 × 35 mm) surface‑mount package for compact, high‑pin‑count board designs.
• Commercial temperature grade — Rated for 0 °C to 85 °C operation for standard commercial environments.
• RoHS compliant — Conforms to RoHS environmental requirements for lead‑free assembly.
• Built on Lattice SC family architecture — Leverages the LatticeSC/M family feature set as described in the device family datasheet, including high‑performance fabric, advanced I/O capabilities, and large embedded RAM resources.

Typical Applications

• Networking & Telecom — Implement packet processing, protocol bridging, and interface aggregation in switches, routers, and telecom equipment.
• Data Path Acceleration — Offload deterministic dataplane functions and buffering in storage, NICs, and network appliances.
• High‑density I/O systems — Serve as a central logic hub for multi‑lane interfaces, complex front‑panel connectivity, and high‑pin‑count I/O subsystems.
• Embedded platforms & prototyping — Provide a scalable logic and memory resource for system architects developing complex SoC glue logic, custom accelerators, or pre‑production prototypes.

Unique Advantages

• High integration density: 80,000 logic elements and ~5.82 Mbits of embedded RAM reduce the need for external components and simplify board layout.
• Large I/O count: 660 I/Os enable direct interfacing to multiple peripherals and high‑bandwidth buses without extensive multiplexing.
• Compact, high‑pin‑count packaging: The 1152‑ball BGA (35 × 35 mm) footprint delivers dense routing capability in a single package for space‑constrained designs.
• Commercial‑grade reliability: Rated for 0 °C to 85 °C operation and RoHS compliant for standard commercial deployments.
• Flexible power envelope: Core operation across 0.95 V–1.26 V supports a range of system power architectures.

Why Choose LFSC3GA80E-6FFN1152C?

The LFSC3GA80E-6FFN1152C positions itself as a high‑capacity, memory‑rich FPGA option within the Lattice SC family. Its combination of 80,000 logic elements, substantial embedded RAM, and a 660‑pin I/O complement suits designs that need heavy logic and buffering in a single, compact package.

This device is well suited for engineering teams building commercial networking, data path, and embedded systems where integration, I/O density, and on‑chip memory reduce system complexity and BOM. Choosing this part aligns with designs that demand scalable logic resources and a proven FPGA family architecture.

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