LFSCM3GA115EP1-5FCN1152C

The LFSCM3GA115EP1-5FCN1152C is a LatticeSCM family field programmable gate array (FPGA) optimized for high-density, memory- and I/O-intensive system designs. This surface-mount FCBGA package integrates 115,000 logic elements, approximately 8.0 Mbits of embedded memory, and up to 660 I/Os to support complex communication, networking and data-path applications. Designed for commercial-temperature operation and low-voltage systems, it delivers a blend of performance and integration for mid- to high-end FPGA projects.

Key Features

• High-density logic – 115,000 logic elements to implement large, complex designs and consolidate multiple functions into a single device.
• On-chip memory – Approximately 8.0 Mbits of embedded RAM to support packet buffering, FIFO structures and memory-intensive algorithms.
• Rich I/O count – Up to 660 I/Os to enable broad peripheral connectivity and high pin-count system interfaces.
• High-speed I/O and SERDES (SCM family) – SCM family devices include 4 to 32 high-speed SERDES channels and flexiPCS capabilities with channel performance from 600 Mbps to 3.8 Gbps and built-in pre-emphasis and equalization for robust serial links.
• Advanced I/O features – PURESPEED™ I/O architecture supports differential I/O up to 2 Gbps DDR, a 144-tap programmable input delay per I/O and dynamic per-bit adaptive input logic for improved timing margin and signal alignment.
• Clocking resources – Extensive sysCLOCK™ network with multiple PLLs and DLLs supporting high-frequency global and edge clocks (family-level support up to 700 MHz global, 1 GHz edge clocks) for demanding timing domains.
• Compact package – 1152-ball FCBGA (35 × 35 mm) surface-mount package for high-pin-count boards and dense system integration.
• Low-voltage support – Device supply range from 0.95 V to 1.26 V to match low-voltage system rails.
• Commercial temperature grade – Rated for 0 °C to 85 °C operation for standard commercial applications.
• RoHS compliant – Meets RoHS environmental requirements for lead-free assembly.

Typical Applications

• Networking & Communications – Implement high-speed packet processing, SERDES-based link aggregation and protocol bridging where large logic density and abundant I/O are required.
• Data Path & Storage Interfaces – Use the on-chip memory and high-performance I/O to build buffers, FIFOs and custom memory interfaces for storage controllers and data concentrators.
• Packet/Telecom Processing – Leverage embedded memory and clocking resources to implement framing, queuing and timing-critical telecom functions.
• System Integration & Bridge Functions – Consolidate multiple glue-logic, interface translation and peripheral control functions into a single FPGA to reduce BOM and board complexity.

Unique Advantages

• High integration density: 115,000 logic elements and ~8.0 Mbits of embedded RAM reduce the need for external glue logic and memory, simplifying PCB design.
• Broad I/O capability: 660 I/Os and family-level SERDES support enable a wide range of parallel and serial interfaces without external transceivers.
• Low-voltage system compatibility: 0.95–1.26 V supply range aligns with modern low-voltage power domains to help reduce power consumption at system level.
• Commercial-temperature usability: 0 °C to 85 °C rating supports standard commercial deployments without the complexity of extended-temperature components.
• Surface-mount FCBGA packaging: 1152-ball (35 × 35 mm) FCBGA offers high pin count in a compact footprint for dense board designs.
• RoHS compliant: Environmentally compliant lead-free manufacturing readiness for modern assembly processes.

Why Choose LFSCM3GA115EP1-5FCN1152C?

The LFSCM3GA115EP1-5FCN1152C positions itself as a high-capacity, memory-rich FPGA option for designers who need substantial logic resources, extensive I/O, and embedded RAM within a single package. Its low-voltage operation and commercial temperature rating make it suitable for a wide range of communications, data-path and system integration projects where consolidation, deterministic timing and board-level integration are priorities.

For teams targeting scalable designs with robust clocking and high-speed serial capabilities (as provided across the LatticeSCM family), this device offers a solid foundation—combining large logic count, plentiful I/O and on-chip memory to reduce external components and accelerate system implementation.

Request a quote or submit a parts inquiry for LFSCM3GA115EP1-5FCN1152C to evaluate its fit for your next design.