LFSCM3GA115EP1-5FFN1152C

The LFSCM3GA115EP1-5FFN1152C is a high-density SCM family FPGA from Lattice Semiconductor Corporation built for memory- and interface-intensive systems. It combines a high-performance FPGA fabric with substantial embedded memory and extensive I/O capability to support high-speed serial links and complex protocol implementations.

Designed for communications and networking applications, the device delivers a mix of programmable logic (115,000 logic elements), approximately 7.99 Mbits of on-chip RAM, and up to 660 I/Os in a 1152-BBGA package, offering a compact, integrated platform for demanding digital designs.

Key Features

• High-density logic — 115,000 logic elements suitable for large, complex FPGA designs and system-level integration.
• Embedded memory — Approximately 7.99 Mbits of total on-chip RAM to support data buffering, packet processing, and memory-intensive logic.
• Extensive I/O — 660 I/O pins supporting a wide range of electrical standards including LVCMOS (3.3/2.5/1.8/1.5/1.2 V), LVTTL, SSTL, HSTL, PCI, LVDS and others for flexible system interfacing.
• High-speed SERDES and flexiPCS — 4 to 32 high-speed SERDES channels per device with line rates from 600 Mbps to 3.8 Gbps, integrated pre-emphasis and equalization, and embedded PCS for standards such as GbE, XAUI, PCI Express, SONET and Fibre Channel.
• Advanced clocking — Multiple analog PLLs and DLLs with global and edge clock support (700 MHz global clock; 1 GHz edge clocks) for precise timing and high-performance clock distribution.
• Package and mounting — 1152-BBGA (Supplier package: 1152-FPBGA 35×35) surface-mount package for high pin-count applications.
• Power and supply — Core supply range from 950 mV to 1.26 V, enabling modern low-voltage system designs.
• Commercial temperature grade — Operating range 0 °C to 85 °C suitable for commercial applications.
• Standards and system support — Built-in support for common system-level protocols and features such as IEEE 1149.1 boundary scan, in-system configuration, and embedded logic analysis.

Typical Applications

• High-speed networking equipment — Implement Ethernet, XAUI, SONET, and other network protocols using the device’s SERDES, flexiPCS, and abundant logic resources.
• Protocol bridging and packet processing — Use the large embedded RAM and dense logic fabric for buffering, packet classification, and protocol conversion tasks.
• Storage and interface controllers — Support Fibre Channel and PCI Express endpoints or bridges leveraging the SERDES capabilities and protocol IP.
• Telecom and carrier systems — Deploy in systems that require multiple high-speed serial links, deterministic clocking, and integrated PCS functionality.

Unique Advantages

• Highly integrated platform: Combines 115,000 logic elements, large on-chip RAM, and 660 I/Os in a single 1152-BBGA package to reduce board-level complexity and BOM count.
• Scalable serial connectivity: 4–32 SERDES channels with integrated PCS and signal conditioning let designers scale link counts and data rates without external PHYs.
• Deterministic high-speed timing: Extensive PLL and DLL resources with support for 700 MHz global and 1 GHz edge clocks enable precise timing for high-performance designs.
• Flexible I/O standards: Broad support for single-ended and differential I/O standards enables interfacing with diverse memory, signaling, and legacy interfaces.
• Optimized for memory-heavy logic: Nearly 8 Mbits of embedded RAM and additional distributed RAM options provide the capacity needed for deep buffering and stateful processing.
• Commercial-grade readiness: Specified 0 °C to 85 °C operating range and RoHS compliance for standard commercial deployments.

Why Choose LFSCM3GA115EP1-5FFN1152C?

The LFSCM3GA115EP1-5FFN1152C positions itself as a compact, high-performance FPGA for system designers who need a balance of dense logic, substantial on-chip memory, and extensive high-speed I/O. Its combination of up to 32 SERDES lanes, flexible I/O standards, and advanced clocking resources makes it well suited to networking, telecom, and protocol-bridging applications where integration and deterministic timing matter.

For teams building scalable, memory- and interface-centric systems, this FPGA delivers the programmable resources and serial connectivity to simplify board design, reduce external components, and accelerate time-to-market while operating within standard commercial temperature ranges.

Request a quote or submit a project quote for LFSCM3GA115EP1-5FFN1152C to receive pricing and lead-time information for your design needs.