LFSCM3GA115EP1-6FCN1152I

The LFSCM3GA115EP1-6FCN1152I is a LatticeSC/M family SCM Field Programmable Gate Array (FPGA) provided in a 1152-ball FCBGA package. It combines a high-density FPGA fabric with extensive I/O and on-chip memory to address communication, networking and embedded system designs.

Designed for industrial-grade applications, this device delivers 115,000 logic elements, high I/O count and substantial embedded memory for complex logic, protocol processing and data buffering while operating across a wide voltage and temperature range.

Key Features

• High-density logic: 115,000 logic elements (LUT4-based fabric) for implementing large, complex designs and system-level integration.
• Large embedded memory: Approximately 7.99 Mbits of on-chip RAM to support frame buffering, packet processing and memory-intensive logic.
• Extensive I/O: 660 I/Os to support wide parallel interfaces, multiple serial links and diverse peripheral connections.
• High-speed transceivers (family feature): Family-level support for 4 to 32 high-speed SERDES and flexiPCS™ with multi-gigabit performance and embedded PCS implementations for common protocols.
• Clocking and timing (family feature): Advanced sysCLOCK network with multiple PLLs and DLLs supporting high-frequency global and edge clocks for low-latency timing regimes.
• Low-voltage core operation: Voltage supply range from 0.95 V to 1.26 V for core power domains.
• Industrial grade temperature: Specified for −40°C to 105°C operation suitable for industrial environments.
• Package and mounting: Surface-mount 1152-BBGA / 1152-FCBGA (35×35 mm) package for high I/O density in a compact footprint.
• Regulatory status: RoHS compliant.

Typical Applications

• Communications infrastructure: Protocol processing, packet buffering and line-card logic leveraging high logic density, large embedded memory and family SERDES support.
• High-speed networking: Multi-gigabit interface implementations and bridging between high-pin-count parallel buses and serial links using abundant I/O and embedded transceiver features.
• Data buffering and packet processing: Memory-intensive designs that require on-chip RAM for FIFOs, frame buffering and real-time data manipulation.
• Industrial embedded systems: Control and I/O aggregation in industrial environments benefitting from industrial temperature rating and surface-mount FCBGA packaging.

Unique Advantages

• High logic capacity: 115,000 logic elements enable implementation of complex state machines, protocol stacks and custom accelerators without external CPLDs.
• Substantial on-chip memory: Approximately 7.99 Mbits of embedded RAM reduces external memory dependency and simplifies board-level design for buffering and packet handling.
• Broad I/O count: 660 I/Os provide flexibility for dense parallel buses, multiple peripheral interfaces and breakout options on a single device.
• Voltage flexibility: Core supply range of 0.95 V to 1.26 V aligns with modern low-voltage system rails for power-optimized designs.
• Industrial temperature support: Rated for −40°C to 105°C operation, enabling deployment in demanding industrial environments.
• Compact, high-density package: 1152-ball FCBGA (35×35 mm) consolidates high pin count into a manageable PCB footprint for space-constrained systems.

Why Choose LFSCM3GA115EP1-6FCN1152I?

This LFSCM3GA115EP1-6FCN1152I device positions itself as a high-capacity, memory-rich FPGA solution for designers targeting communications, networking and industrial embedded systems. Its combination of 115,000 logic elements, nearly 8 Mbits of on-chip RAM and 660 I/Os provides the resources required for complex protocol processing, data buffering and multi-interface implementations.

The device’s industrial temperature rating, RoHS compliance and compact 1152-FCBGA package offer a practical balance of performance, integration and manufacturability for production designs that require robustness and long-term availability within the LatticeSC/M family ecosystem.

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