LFSCM3GA115EP1-6FFN1152I

The LFSCM3GA115EP1-6FFN1152I is a LatticeSC/M family FPGA in a 1152‑ball BGA package designed for high‑density, memory‑intensive designs. It combines a high‑performance FPGA fabric with extensive I/O and embedded memory, targeting communication, networking and industrial embedded systems that require large logic capacity and flexible interface support.

This industrial‑grade, surface‑mount device offers 115,000 logic elements, approximately 7.99 Mbits of on‑chip RAM and 660 I/Os, delivering a scalable platform for complex digital systems operating across a wide supply and temperature range.

Key Features

• Core Fabric: 115,000 logic elements implemented with four‑input LUT architecture (LUT4), providing high logic density for complex state machines and datapaths.
• Embedded Memory: Approximately 7.99 Mbits of total on‑chip RAM, suitable for buffering, FIFOs and memory‑intensive processing.
• I/O Capability: 660 I/Os with high performance PURESPEED™ I/O technology (family feature), supporting a wide range of single‑ended and differential standards for system interfacing.
• High‑Speed Serial: LatticeSC/M family SERDES and flexiPCS™ capabilities (4 to 32 lanes per device in the family) support a variety of serialized protocols and high data‑rate links.
• Clocking and Timing: Family features include analog PLLs and DLLs for flexible clock generation and high‑speed edge clocks, enabling robust multi‑clock designs (see family datasheet for details).
• Package & Mounting: 1152‑BBGA (supplier package: 1152‑FPBGA, 35×35) in a surface‑mount form factor for high pin‑count board integration.
• Power & Operating Range: Voltage supply range from 0.95 V to 1.26 V and industrial operating temperature from −40 °C to 105 °C.
• Compliance: RoHS compliant and supplied as an industrial‑grade FPGA for rugged applications.

Typical Applications

• High‑speed networking: Implement packet processing, PHY/PCS interfaces and protocol bridging where large logic capacity and SERDES support are required.
• Telecommunications infrastructure: Use for line cards, backplane bridging and protocol converters that leverage abundant I/O and embedded memory for buffering and packet handling.
• Data transport and storage interfaces: Deploy for Fibre Channel, PCI Express or RapidIO endpoints and bridges where high logic density and memory resources accelerate data paths.
• Industrial embedded systems: Integrate into control and monitoring platforms that demand industrial temperature range and high‑pin‑count connectivity.

Unique Advantages

• Large logic capacity: 115,000 logic elements support complex SoC‑class functions without immediate need for external programmable logic.
• Substantial on‑chip memory: Approximately 7.99 Mbits of embedded RAM enables deep buffering, FIFOs and on‑chip data storage to simplify board‑level memory architectures.
• Extensive I/O count: 660 I/Os reduce the requirement for external multiplexing or additional interface chips, simplifying PCB routing and system integration.
• Family SERDES and PCS support: LatticeSC/M family SERDES and flexiPCS™ capabilities enable implementation of a wide range of serial protocols for networking and transport applications.
• Industrial reliability: Rated for −40 °C to 105 °C operation and supplied RoHS compliant for deployment in temperature‑sensitive and regulated environments.
• Compact high‑pin‑count package: 1152‑BBGA (35×35 FPBGA) provides high signal density in a compact footprint for space‑constrained boards.

Why Choose LFSCM3GA115EP1-6FFN1152I?

This LatticeSC/M FPGA model positions itself for designs requiring a balance of high logic density, significant embedded memory and a large number of I/Os within an industrial temperature envelope. Its family feature set—covering advanced clocking, SERDES and flexible I/O standards—aligns with network, telecom and industrial embedded applications that need integrated, programmable hardware acceleration.

Choose LFSCM3GA115EP1-6FFN1152I when you need a robust, high‑capacity FPGA platform that scales with complex system requirements while simplifying board‑level design through plentiful on‑chip resources and a compact, high‑pin‑count package.

Request a quote or submit an inquiry to start the procurement process for LFSCM3GA115EP1-6FFN1152I and evaluate how this FPGA fits into your next high‑performance design.