LFSCM3GA15EP1-5F900I

The LFSCM3GA15EP1-5F900I is an industrial‑grade SCM family FPGA designed for complex, high‑density embedded logic applications. This device integrates approximately 15,000 logic elements, roughly 1.05 Mbits of on‑chip RAM, and 300 I/Os in a 900‑ball BGA footprint to support dense system integration and flexible I/O partitioning.

Built on the Lattice SC/M architecture, the device targets communications, industrial control, and high‑performance embedded systems where a combination of logic capacity, embedded memory, and a high I/O count are required. The device supports low‑voltage core operation and extended temperature range for robust field deployment.

Key Features

• Logic Capacity  Approximately 15,000 logic elements to implement complex combinational and sequential logic functions.
• Embedded Memory  Approximately 1.05 Mbits of on‑chip RAM (total RAM bits: 1,054,720) for block and distributed memory needs.
• I/O Density  300 user I/Os provide extensive external connectivity for interfaces, sensors, memory buses and peripherals.
• Package & Mounting  900‑BBGA (supplier device package: 900‑FPBGA 31×31) in a surface‑mount package suitable for high‑pin count board designs.
• Industrial Temperature Range  Rated for −40 °C to 105 °C operation to meet demanding environmental requirements.
• Core Voltage  Low‑voltage core operation from 0.95 V to 1.26 V to align with modern power budgets and multi‑rail systems.
• Family‑level Performance (Lattice SC/M)  The Lattice SC/M family includes high‑performance FPGA fabric and features such as multi‑GHz capable SERDES, precision clocking with PLLs and DLLs, and configurable I/O standards (as described in the SC/M family data).
• Compliance  RoHS compliant for lead‑free assembly and global regulatory alignment.

Typical Applications

• High‑density networking modules  Use the device’s large logic array and abundant I/O to implement packet processing, protocol bridging, and interface aggregation.
• Industrial control systems  Combine deterministic logic, embedded RAM, and extended‑temperature rating for motor control, PLC expansion, and real‑time I/O handling.
• Embedded system acceleration  Offload compute‑intensive or timing‑sensitive functions (custom datapaths, peripheral bridging) using on‑chip logic and memory.
• High‑pin count board designs  The 900‑ball BGA package supports dense interconnect needs in compact, multi‑function modules and carriers.

Unique Advantages

• Balanced integration: Combines significant logic capacity, sizable embedded RAM, and a high I/O count in one device to reduce external components and simplify system architecture.
• Industrial robustness: Specified for −40 °C to 105 °C operation and RoHS compliance to meet industrial deployment requirements.
• Low‑voltage core operation: 0.95–1.26 V supply supports energy‑conscious designs and modern multi‑rail power schemes.
• High pin‑count packaging: 900‑BBGA (31×31) provides ample I/O routing and signal density for complex board layouts.
• Family ecosystem: Leverages Lattice SC/M family architecture and documented features for consistent design practices across similar capacity devices.

Why Choose LFSCM3GA15EP1-5F900I?

The LFSCM3GA15EP1-5F900I positions itself as a capable, industrial‑grade FPGA option where a mix of logic capacity, embedded memory and a high number of I/Os are required. Its low‑voltage operation and extended temperature rating make it suitable for deployed systems that need long‑term reliability and efficient power usage.

This part is particularly well suited for engineers designing networking modules, industrial controllers, and embedded accelerators who require a compact, high‑pin‑count package and proven SC/M family architecture to streamline development and deployment.

Request a quote or submit a pricing request to evaluate LFSCM3GA15EP1-5F900I for your next design project.