LFSCM3GA15EP1-6FN256C

The LFSCM3GA15EP1-6FN256C is a surface-mount FPGA IC built on the LatticeSC/M family architecture. It provides a mid-range FPGA fabric with 15,000 logic elements and approximately 1.05 Mbits of embedded RAM, targeted at designs that require substantial on-chip memory and a high count of I/Os.

Designed for communication, networking and embedded applications, this device combines dense logic capacity with a 139-pin I/O complement and a compact 256-FPBGA (17×17) package for board-level integration in commercial-temperature systems.

Key Features

• Logic Capacity  15,000 logic elements suitable for mid-range FPGA designs and control/processing tasks.
• Embedded Memory  Approximately 1.05 Mbits of on-chip RAM to support buffering, FIFOs and memory-intensive functions.
• High I/O Count  139 user I/Os to support dense peripheral interfaces, parallel buses and multiple external connections.
• Package & Mounting  256-BGA (256-FPBGA, 17×17) package in a surface-mount form factor for compact board implementation.
• Supply Voltage  Core voltage range 0.95 V to 1.26 V to match modern low-voltage system rails.
• Operating Temperature  Commercial grade operation from 0 °C to 85 °C for standard embedded and networking environments.
• Regulatory Status  RoHS compliant.
• Family-Level Capabilities (LatticeSC/M)  Series documentation describes a high-performance fabric with extensive clocking, high-speed SERDES and flexible I/O features suitable for communication and networking systems (see LatticeSC/M family datasheet for full details).

Typical Applications

• Network and Communication Modules  Provides on-chip logic and embedded memory for packet buffering, protocol adaptation and interface bridging in network equipment.
• Embedded System Controllers  Mid-range logic capacity and abundant I/Os enable custom control, peripheral aggregation and real-time processing for embedded appliances.
• High-density I/O Interfaces  139 I/Os support complex multi-bus front ends, parallel sensors, and display or camera interfaces.
• Memory-Intensive FPGA Functions  Approximately 1.05 Mbits of embedded RAM suits FIFO, buffering and local data storage needs in streaming and packetized data flows.

Unique Advantages

• Balanced Mid-Range Capacity: 15,000 logic elements offer a strong balance between logic density and cost for mid-tier FPGA designs.
• Significant On-Chip Memory: Approximately 1.05 Mbits of embedded RAM reduces external memory dependency for buffering and temporary storage.
• High Pin Count I/O: 139 I/Os simplify integration with multiple peripherals and parallel interfaces without resorting to external expanders.
• Compact, Board-Friendly Package: 256-FPBGA (17×17) supports high-density routing and compact PCB layouts for space-constrained designs.
• Low-Voltage Operation: Core supply range of 0.95 V to 1.26 V aligns with modern low-voltage system design practices.
• RoHS Compliance: Environmentally compliant manufacturing and materials for commercial product builds.

Why Choose LFSCM3GA15EP1-6FN256C?

LFSCM3GA15EP1-6FN256C positions itself as a practical choice for engineers who need a mid-range FPGA with generous embedded memory and a high I/O count in a compact BGA package. Its specification set—15,000 logic elements, approximately 1.05 Mbits of RAM, 139 I/Os, and a 256-FPBGA footprint—makes it well suited to communication, embedded control and I/O-dense applications operating in commercial temperature ranges.

When paired with the system-level features described in the LatticeSC/M family documentation, this device offers a capable platform for designs that require integration of logic, memory and multiple interfaces while preserving board space and supporting low-voltage core supplies.

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