LFSCM3GA25EP1-5FFAN1020I

The LFSCM3GA25EP1-5FFAN1020I is a surface-mount FPGA from Lattice Semiconductor Corporation based on the LatticeSC/M family architecture. It combines a high-performance FPGA fabric with large on-chip memory and high I/O density for demanding industrial designs.

Targeted at communications and high-performance embedded systems, this device delivers approximately 25,000 logic elements, roughly 1.97 Mbits of embedded memory, and 476 I/Os in a 1020-ball FCBGA package, providing integration and scalability for complex interface and buffering requirements.

Key Features

• Logic Capacity — Approximately 25,000 logic elements for implementing mid-to-large scale logic functions and custom accelerators.
• Embedded Memory — Approximately 1.97 Mbits of on-chip RAM for packet buffering, FIFOs, and local data storage.
• I/O Density — 476 I/Os to support multiple parallel interfaces, memory buses, and high-pin-count designs.
• Package and Mounting — 1020-BBGA (FCBGA) package; surface-mount mounting for compact board-level integration. Supplier device package listed as 1020-OFcBGA Rev 2 (33×33).
• Industrial Temperature Range — Rated for −40°C to 105°C operation to meet industrial environmental requirements.
• Low-Voltage Core — Voltage supply range 0.95 V to 1.26 V for low-power core operation.
• RoHS Compliant — Meets RoHS environmental requirements.
• LatticeSC/M Family Capabilities — Built on the LatticeSC/M architecture (per datasheet) that provides high-performance fabric, high-speed SERDES and advanced I/O features suited to communication system designs.

Typical Applications

• Networking and Telecom Equipment — Enables packet buffering, protocol bridging and custom packet processing when paired with high-density I/O and embedded memory.
• High-Speed Interfaces — Suited for designs requiring many parallel or serialized links thanks to 476 available I/Os and the LatticeSC/M family’s high-speed I/O architecture.
• Data Center and Infrastructure — Provides programmable logic and on-chip memory for traffic management, aggregation and protocol adaptation tasks.
• Industrial Embedded Systems — Industrial temperature rating and compact FCBGA packaging support deployment in harsh environments and space-constrained boards.

Unique Advantages

• High Integration: Combines ~25,000 logic elements, ~1.97 Mbits of embedded RAM and 476 I/Os in a single FCBGA package to reduce BOM and board complexity.
• Industrial Reliability: Specified operation from −40°C to 105°C for robust performance in industrial environments.
• Compact, High-Pin Package: 1020-BBGA (33×33) footprint provides high connectivity in a compact form factor for dense designs.
• Low-Voltage Operation: 0.95 V to 1.26 V core supply supports power-optimized system designs.
• Standards-Ready Family Architecture: Based on the LatticeSC/M family architecture (datasheet) that includes high-performance fabric and advanced I/O capabilities for communication-oriented applications.
• Regulatory Compliance: RoHS compliant for environmental and assembly compatibility.

Why Choose LFSCM3GA25EP1-5FFAN1020I?

The LFSCM3GA25EP1-5FFAN1020I positions itself as a versatile, industrial-grade FPGA option for designers needing substantial logic capacity, generous embedded memory, and high I/O density in a compact FCBGA package. Its low-voltage core and broad operating temperature range make it suitable for rugged embedded and communications systems.

Designed on the LatticeSC/M family architecture, this device is appropriate for teams building protocol adapters, packet-processing engines, or multi-interface controllers that require on-chip buffering, flexible I/O, and the ability to consolidate functions to reduce board-level complexity and total system cost.

Request a quote or submit an inquiry for LFSCM3GA25EP1-5FFAN1020I to receive pricing, availability, and support for your design requirements.