LFSCM3GA25EP1-5F900I

The LFSCM3GA25EP1-5F900I is a field programmable gate array (FPGA) in the Lattice SC/M family designed for industrial applications. It delivers 25,000 logic elements, approximately 1.97 Mbits of on-chip RAM and 378 I/O pins in a 900‑ball BGA package, providing a compact, high‑density programmable fabric for system integration.

As a member of the LatticeSC/M family, this device targets communications, networking and industrial control designs that need substantial logic density, abundant I/O and embedded memory in a surface‑mount package with a wide operating temperature range.

Key Features

• Logic Capacity  25,000 logic elements and 6,250 logic blocks provide hardware resources for mid‑range FPGA implementations and custom digital functions.
• Embedded Memory  Total on‑chip RAM of 1,966,080 bits (approximately 1.97 Mbits) to support buffering, FIFOs and frame storage.
• I/O Density  378 available I/O pins allow extensive peripheral interfacing, parallel buses and multi‑lane connectivity in a single device.
• Packaging & Mounting  900‑BBGA (supplier package: 900‑FPBGA, 31×31 mm) for high pin count, surface‑mount assembly and compact board layouts.
• Power Supply Range  Core voltage support from 950 mV to 1.26 V to match system power rails and enable flexible power architectures.
• Industrial Temperature Grade  Specified for −40 °C to 105 °C operation for reliability in industrial and harsh environments.
• RoHS Compliant  Meets RoHS requirements for lead‑free assembly and regulatory compliance.
• LatticeSC/M Family Capabilities  The family includes high‑performance FPGA fabric, high‑speed SERDES and advanced clocking and memory features useful for communication and system‑level integration (family features described in datasheet).

Typical Applications

• Networking & Communications  High I/O count and embedded memory enable packet buffering, protocol bridging and interface bridging in networking equipment and telecom modules.
• Industrial Control  Industrial temperature rating and flexible I/O make the device suitable for motor control, automation gateways and sensor aggregation.
• Data Acquisition & Processing  On‑chip RAM and dense logic allow pre‑processing, framing and DMA buffering for sensor and instrument front ends.
• High‑Density I/O Systems  Large pin count supports multi‑channel I/O, interface consolidation and custom board‑level glue logic.

Unique Advantages

• Balanced Logic and Memory:  25,000 logic elements paired with approximately 1.97 Mbits of RAM supports moderate‑complexity designs that need both compute and storage on‑chip.
• High I/O Count:  378 I/Os reduce external multiplexing and simplify board routing for multi‑interface applications.
• Industrial Reliability:  Rated for −40 °C to 105 °C, the device is specified for sustained operation in industrial temperature environments.
• Compact, High‑Pin Package:  900‑BBGA (31×31 mm) delivers high pin count in a compact form factor for space‑constrained designs.
• Flexible Power Options:  Support for core voltages from 0.95 V to 1.26 V enables integration with a range of system power rails.
• RoHS Compliance:  Meets environmental assembly requirements for modern manufacturing processes.

Why Choose LFSCM3GA25EP1-5F900I?

The LFSCM3GA25EP1-5F900I positions itself as a versatile mid‑range FPGA for industrial and communications applications that require a strong balance of logic resources, embedded memory and I/O capacity. Its industrial temperature rating, compact 900‑ball BGA and RoHS compliance make it a practical choice for robust, production‑grade systems.

Designers looking to consolidate interfaces, implement protocol processing or add custom logic and buffering will find the device’s mix of logic elements, nearly 2 Mbits of on‑chip RAM and large I/O count well suited to reduce board complexity and BOM count while providing long‑term scalability within the LatticeSC/M family.

Request a quote or submit a pricing inquiry to receive availability and lead‑time information for LFSCM3GA25EP1-5F900I.