LFSCM3GA25EP1-6FN900C

The LFSCM3GA25EP1-6FN900C is a member of the LatticeSC/M family of SCM FPGAs. It pairs a mid-range programmable fabric with a high I/O count and substantial on-chip memory to address communication, networking and embedded system designs that require dense interfacing and memory resources.

This commercial‑grade, surface‑mount FPGA provides 25,000 logic elements, approximately 1.97 Mbits of embedded RAM, and 378 user I/Os in a 900‑ball BBGA (900‑FPBGA, 31 × 31) package, operating from 0 °C to 85 °C with a core supply range of 0.95 V to 1.26 V. The device is RoHS compliant.

Key Features

• Programmable Logic 25,000 logic elements provide a flexible fabric for implementing custom logic, state machines and datapaths.
• Embedded Memory Approximately 1.97 Mbits of on‑chip RAM to support buffering, FIFOs and memory‑intensive logic functions.
• High I/O Density 378 user I/Os enable broad peripheral connectivity and multi‑lane interfaces for complex system integration.
• Package & Mounting 900‑BBGA (900‑FPBGA, 31 × 31) surface‑mount package for high pin count designs in a compact footprint.
• Power & Temperature Core voltage supply range 0.95 V to 1.26 V and commercial operating temperature range of 0 °C to 85 °C.
• Regulatory RoHS compliant to support environmentally conscious product designs.
• LatticeSC/M Family Capabilities Family‑level features include high‑performance FPGA fabric, extensive clocking resources and high‑speed I/O architecture (as defined by the LatticeSC/M series).

Typical Applications

• Communications & Networking Use the device for protocol handling, packet buffering and interface aggregation where substantial I/O and on‑chip memory are required.
• High‑density Interface Aggregation Consolidate multiple peripheral lanes and sensor channels using the 378 available I/Os for board‑level consolidation.
• Memory‑intensive Logic Implement FIFOs, buffers and data‑stream processing that benefit from approximately 1.97 Mbits of embedded RAM.
• Custom Embedded Systems & Prototyping Apply the FPGA for custom digital logic, control functions and prototype evaluation requiring a mid‑range logic capacity and extensive I/O.

Unique Advantages

• Balanced Logic and Memory: 25,000 logic elements combined with ~1.97 Mbits of embedded RAM supports complex state machines and data buffering without external memory for many designs.
• High Pin Count Connectivity: 378 I/Os allow flexible interfacing to multiple peripherals, ADCs/DACs, sensors and high‑speed lanes on a single device.
• Space‑efficient Packaging: The 900‑BBGA (31 × 31) package delivers a high‑density pinout in a compact surface‑mount form factor.
• Low‑voltage Core Operation: Core supply from 0.95 V to 1.26 V supports designs targeting lower power domains and modern system architectures.
• Commercial‑Grade Reliability: Rated for 0 °C to 85 °C operation and RoHS compliant for mainstream commercial applications.

Why Choose LFSCM3GA25EP1-6FN900C?

The LFSCM3GA25EP1-6FN900C is positioned for designs that require a mid‑range programmable fabric with ample I/O and embedded memory for communication, interface aggregation and memory‑centric logic. Its combination of 25,000 logic elements, approximately 1.97 Mbits of on‑chip RAM and 378 I/Os in a 900‑ball BBGA package provides a balanced platform for system consolidation and custom logic implementation.

This commercial‑grade FPGA is suited to engineers and teams building networking, communications and embedded systems who need predictable electrical characteristics (0.95 V–1.26 V core) and a defined operating temperature window (0 °C–85 °C), backed by the LatticeSC/M family feature set.

Request a quote or submit a purchasing inquiry to get pricing, lead time and availability for LFSCM3GA25EP1-6FN900C. Our team can provide volume pricing and delivery options to support your design schedule.