LFSCM3GA25EP1-7FFA1020C

The LFSCM3GA25EP1-7FFA1020C is a LatticeSC/M family FPGA delivering a high-performance programmable fabric with abundant I/O and on-chip memory for communication and system-integration designs. This surface-mount, commercial-grade device combines logic, embedded RAM, and advanced I/O features to address networking, protocol bridging, and high-speed interface applications.

With 25,000 logic elements, approximately 1.97 Mbits of embedded memory, and 476 user I/Os in a 1020-BBGA (33×33 FCBGA) package, the device targets designs that require dense integration, multi-protocol interfaces, and deterministic clocking at low core voltages (0.95–1.26 V).

Key Features

• Programmable Logic Capacity — 25,000 logic elements suitable for mid-range FPGA designs and custom hardware acceleration.
• Embedded Memory — Approximately 1.97 Mbits of on-chip RAM to support large buffering and local data storage for packet processing and streaming applications.
• High I/O Count — 476 user I/Os to support complex multi-channel interfaces and broad peripheral connectivity in a single device.
• High-Speed SERDES and Protocol Support — Series-level features include 4–32 high-speed SERDES channels with data rates from 600 Mbps to 3.8 Gbps and embedded PCS support for standards such as GbE, XAUI, PCI Express, SONET and Fibre Channel.
• Advanced I/O Performance — I/O architecture supports differential and single-ended memory interfaces, programmable input delay and per-pin adaptive logic for robust timing across interfaces.
• Clocking and Timing — Extensive clock network with high-frequency support including multi-PLLs and DLLs for up to 700 MHz global clocks and 1 GHz edge clocks (series-level capability).
• Package and Mounting — 1020-BBGA (FCBGA) package, Supplier Device Package: 1020-OFcBGA Rev 2 (33×33), surface-mount for high pin-count, compact board designs.
• Power and Temperature — Low-voltage core operation from 0.95 V to 1.26 V and commercial-grade operating temperature range of 0 °C to 85 °C.
• RoHS Compliant — Meets RoHS environmental requirements for lead-free assembly.

Typical Applications

• Network Infrastructure: Implement switching, packet buffering and protocol adaptation using the device’s embedded memory and high-speed SERDES channels.
• High-Speed Interface Bridges: Bridge between serial protocols (PCIe, XAUI, GigE) and parallel system fabrics using programmable logic and embedded PCS support.
• Telecom and Datacom Equipment: Use the device’s deterministic clocking and SERDES performance for line cards, aggregation modules and PHY interfaces.
• Protocol Offload and Acceleration: Offload processing tasks to FPGA logic and local RAM for reduced system latency and simplified host CPUs.

Unique Advantages

• Balanced Integration: Combines 25,000 logic elements, approximately 1.97 Mbits of embedded RAM and 476 I/Os in a single package to reduce board-level BOM and simplify routing.
• Multi-Protocol Serial Interfaces: High-speed SERDES and embedded PCS cores enable direct implementation of common networking protocols without external PHYs in many use cases.
• Deterministic Clocking: Extensive PLL/DLL resources and high-frequency clock options support timing-critical designs and multi-clock domains.
• Compact, High-Pin Package: 1020-BBGA FCBGA (33×33) provides high I/O density for space-constrained, high-functionality boards.
• Low-Voltage Operation: Core voltage range of 0.95 V to 1.26 V supports modern low-power system designs and power-optimized supply rails.
• RoHS Compliance: Enables lead-free manufacturing processes and supports modern environmental requirements.

Why Choose LFSCM3GA25EP1-7FFA1020C?

The LFSCM3GA25EP1-7FFA1020C delivers a practical balance of programmable logic, sizable on-chip memory and extensive I/O capability for mid-range FPGA applications. Its combination of SERDES-enabled serial interfaces, dense I/O, and comprehensive clocking resources make it well suited for network-centric designs, protocol translation, and subsystem acceleration where integration and deterministic timing are priorities.

Designed for commercial-grade systems operating at standard board-level temperatures and low core voltages, this device provides a scalable, RoHS-compliant building block backed by the LatticeSC/M family architecture for designers focused on performance, integration and long-term platform flexibility.

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