LFSCM3GA40EP1-5FFN1152C

IC FPGA 604 I/O 1152FBGA
Part Description

SCM Field Programmable Gate Array (FPGA) IC 604 4075520 40000 1152-BBGA

Quantity 103 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package1152-FPBGA (35x35)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1152-BBGANumber of I/O604Voltage950 mV - 1.26 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs10000Number of Logic Elements/Cells40000
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits4075520

Overview of LFSCM3GA40EP1-5FFN1152C – SCM FPGA, 604 I/Os, ~4.08 Mbits RAM, 40k logic elements

The LFSCM3GA40EP1-5FFN1152C is a commercial-grade SCM Field Programmable Gate Array (FPGA) in a 1152-ball BGA package designed for high-density, memory‑intensive system designs. It combines a large FPGA fabric with extensive I/O and embedded memory to support communication, networking, and complex control applications.

Built on the Lattice SC/M family architecture, this device targets applications that require a balance of logic capacity, on-chip RAM, and high I/O counts while operating within a 0 °C to 85 °C commercial temperature range and a 0.95 V to 1.26 V supply window.

Key Features

  • Core Logic  40,000 logic elements provide substantial programmable fabric for complex logic, control and processing functions.
  • Embedded Memory  Approximately 4.08 Mbits of on-chip RAM (4,075,520 bits) supports data buffering, large FIFOs and memory‑intensive algorithms.
  • High I/O Count  604 I/Os accommodate dense board-level connectivity for parallel interfaces, sensor buses and high-pin-count peripherals.
  • High‑Speed SERDES & flexiPCS (family feature)  Family-level support for 4 to 32 high-speed SERDES channels with flexiPCS enables a range of serial protocols and multi‑Gbps links.
  • Advanced I/O Performance (family feature)  PURESPEED I/O architecture with programmable input delay and broad electrical standard support for robust DDR and single‑ended interfaces.
  • Clocking and Timing (family feature)  Multiple analog PLLs and DLLs in the SC/M family provide flexible clock generation and alignment for high-frequency system clocks and edge sampling.
  • Power and Supply  Operates from a supply range of 0.95 V to 1.26 V to match system power-rail options and optimize dynamic power.
  • Package & Mounting  1152-BBGA (supplier package: 1152-FPBGA, 35 × 35 mm) in a surface-mount form factor for high-pin-count, space-efficient board designs.
  • Commercial Grade & Compliance  Commercial temperature grade (0 °C to 85 °C) and RoHS compliant for standard commercial applications.

Typical Applications

  • Networking & Communication Equipment  Use the device’s high I/O count, embedded memory and family-level SERDES features to implement protocol bridging, packet buffering and multi‑lane serial links.
  • Data Aggregation & Switching  On-chip RAM and abundant logic elements enable large FIFOs, traffic management and custom switching logic for mid‑range data planes.
  • High‑Channel I/O Systems  604 I/Os support dense sensor arrays, multi‑port interfaces and FPGA‑based I/O expansion in instrumentation or industrial control (commercial-grade).
  • Prototyping & System Integration  Programmable fabric and rich clocking support make the part suitable for validating high‑performance interfaces and custom accelerator functions.

Unique Advantages

  • High logic capacity: 40,000 logic elements deliver room for complex state machines, datapaths and control logic without immediate migration to larger devices.
  • Memory-rich architecture: Approximately 4.08 Mbits of embedded RAM reduce external memory requirements for buffering and FIFO-intensive designs.
  • Extensive board connectivity: 604 I/Os enable high pin-count designs and flexible routing of parallel and serial interfaces.
  • Family-level high-speed serial support: SC/M family SERDES and flexiPCS capabilities provide a path to integrate multi‑Gbps serial links when required by the system.
  • Commercial cost and availability balance: Surface-mount 1152-BBGA packaging and commercial temperature grade offer a practical combination for volume, cost-sensitive systems.

Why Choose LFSCM3GA40EP1-5FFN1152C?

This LFSCM3GA40EP1-5FFN1152C FPGA positions itself as a memory‑and-I/O‑centric solution within the Lattice SC/M family, delivering 40,000 logic elements, approximately 4.08 Mbits of embedded RAM and 604 I/Os in a high-density 1152‑ball package. It is suited to designers who need substantial on-chip memory and broad I/O while operating within standard commercial temperature and supply ranges.

Choose this device when your design requires integrated memory resources, high I/O counts and the flexibility of a programmable fabric, backed by the SC/M family feature set for clocking and serial connectivity at the device or family level.

Request a quote or submit an inquiry for availability and pricing to evaluate LFSCM3GA40EP1-5FFN1152C for your next design.

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