LFSCM3GA40EP1-6FF1020C

The LFSCM3GA40EP1-6FF1020C is a LatticeSC/M family FPGA in a 1020-BBGA (FCBGA) package, optimized for communication and memory‑intensive system designs. It combines a high‑performance programmable fabric with extensive I/O and embedded RAM to address networking, interface bridging, and system‑level integration requirements.

Built on the LatticeSC/M architecture, this commercial‑grade device provides a balance of logic density, on‑chip memory, and advanced I/O options while operating at low core voltages and standard commercial temperature ranges.

Key Features

• Logic Capacity 40,000 logic elements (cells) for implementing complex combinational and sequential logic.
• Embedded Memory Total RAM: 4,075,520 bits (approximately 4.08 Mbits) of on‑chip memory for large FIFOs, frame buffers, and data paths.
• I/O Density 562 user I/Os to support wide parallel interfaces, multiple peripheral buses, and high channel counts.
• High‑Speed I/O and SERDES (Family Features) LatticeSC/M family features include high‑speed SERDES and flexiPCS options with performance ranging from 600 Mbps to 3.8 Gbps, with built‑in pre‑emphasis and equalization for robust serial links.
• Clocking and Timing (Family Features) Advanced clocking resources in the family include analog PLLs and DLLs, supporting wide frequency ranges and edge‑clocked I/O for demanding timing applications.
• Power and Voltage Core supply range: 950 mV to 1.26 V to support low‑voltage system architectures.
• Package and Mounting 1020‑BBGA (FCBGA) surface‑mount package, supplier device package 1020‑OFCBGA (33 × 33 mm) for high pin count systems.
• Commercial Grade & RoHS Compliant Rated for 0 °C to 85 °C operating temperature and RoHS compliant for standard commercial applications.

Typical Applications

• Communication Network Equipment Leverages the SC/M family’s high‑speed SERDES and embedded memory to implement line cards, protocol bridging, and packet buffering.
• High‑Speed Interface Bridging Large I/O count and on‑chip RAM enable implementation of multi‑lane interfaces and protocol converters.
• Memory‑Intensive Logic Approximately 4.08 Mbits of embedded RAM support deep FIFOs, packet buffering, and real‑time data staging.
• Embedded System Integration Dense logic and extensive I/O allow consolidation of peripheral control, data aggregation, and custom hardware accelerators.

Unique Advantages

• High Logic Density: 40,000 logic elements provide the capacity to implement substantial custom logic and state machines on a single device.
• Substantial On‑Chip Memory: Approximately 4.08 Mbits of embedded RAM reduce external memory dependence and simplify board design for buffering and packet processing.
• Very High I/O Count: 562 I/Os support broad connectivity—parallel buses, multiple interfaces, and dense pinout requirements without external multiplexing.
• Low‑Voltage Core Operation: 0.95 V to 1.26 V supply range aligns with low‑power system designs and modern power rails.
• High‑Pin‑Count FCBGA Package: The 1020‑BBGA (33 × 33 mm) package delivers the pin density required for complex, multi‑interface boards in a surface‑mount form factor.
• RoHS Compliant Commercial Device: Suitable for standard commercial environments and compliant with common environmental requirements.

Why Choose LFSCM3GA40EP1-6FF1020C?

The LFSCM3GA40EP1-6FF1020C positions itself as a capable, commercial‑grade FPGA for designs that require a mix of high logic capacity, extensive I/O, and significant on‑chip RAM. Its LatticeSC/M family heritage brings advanced I/O and clocking capabilities useful for communication and high‑bandwidth interface applications.

This device is well suited to engineers building networking gear, interface bridges, and embedded systems where consolidating logic and memory on a single FPGA simplifies the bill of materials and reduces board complexity while maintaining flexible reprogrammability.

Request a quote or submit an inquiry to obtain pricing, availability, and support information for LFSCM3GA40EP1-6FF1020C.