LFSCM3GA40EP1-5FFAN1020C

IC FPGA 562 I/O 1020BGA
Part Description

SCM Field Programmable Gate Array (FPGA) IC 562 4075520 40000 1020-BBGA, FCBGA

Quantity 126 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package1020-OFcBGA Rev 2 (33x33)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1020-BBGA, FCBGANumber of I/O562Voltage950 mV - 1.26 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level4 (72 Hours)Number of LABs/CLBs10000Number of Logic Elements/Cells40000
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits4075520

Overview of LFSCM3GA40EP1-5FFAN1020C – SCM Field Programmable Gate Array (40,000 logic elements, 1020‑BBGA)

The LFSCM3GA40EP1-5FFAN1020C is a Lattice SCM field programmable gate array (FPGA) optimized for memory‑intensive and high‑I/O applications. It combines 40,000 logic elements, abundant embedded RAM and a large I/O count to address communication, networking and advanced system integration tasks.

Designed on the Lattice SC/M family architecture, the device targets applications that require high fabric density, wide I/O flexibility and low‑voltage operation while meeting commercial temperature and RoHS compliance requirements.

Key Features

  • Core Capacity  40,000 logic elements provide substantial programmable fabric for complex logic, control and signal processing functions.
  • Embedded Memory  Approximately 4.08 Mbits of on‑chip RAM (4,075,520 bits) for large buffering, FIFOs and data‑path storage.
  • High I/O Count  562 user I/Os enable dense peripheral interfacing and multi‑lane connections for system‑level designs.
  • High‑Speed SERDES and Protocol Support (Family Feature)  Lattice SC/M family devices include 4 to 32 high‑speed SERDES and flexiPCS options (family specification) with performance ranging from 600 Mbps to 3.8 Gbps and embedded PCS support for common networking standards.
  • Advanced I/O Performance (Family Feature)  PURESPEED™ I/O architecture supports differential and single‑ended interfaces and includes programmable input delay and adaptive input logic (family specification).
  • Clocking Resources (Family Feature)  Extensive sysCLOCK™ network with multiple PLLs and DLLs, high‑frequency edge clocks and dynamic clocking capabilities (family specification).
  • Package and Mounting  1020‑BBGA FCBGA package (1020‑OFcBGA Rev 2, 33×33) for high pin‑count surface‑mount system integration.
  • Supply and Temperature  Operates from 0.95 V to 1.26 V and is qualified for commercial operation from 0 °C to 85 °C.
  • Environmental Compliance  RoHS compliant for regulatory and environmental considerations.

Typical Applications

  • High‑Speed Networking: Implement protocol bridging, packet processing or PHY interface logic leveraging the device’s high I/O count and family SERDES capabilities.
  • Telecommunications Equipment: Use the abundant embedded RAM and fabric density for buffering, framing and timing functions in communication systems.
  • Data Path and Interface Bridging: Deploy as a glue/bridge device between multiple parallel and serial interfaces where large I/O and on‑chip memory simplify system design.
  • Embedded System Integration: Integrate control logic, peripheral interfaces and memory buffers in compact, surface‑mount BGA form factors for space‑constrained boards.

Unique Advantages

  • High Integration Density: 40,000 logic elements and approximately 4.08 Mbits of embedded RAM reduce external memory and discrete logic needs.
  • Large I/O Footprint: 562 I/Os support complex multi‑channel interfaces and high‑pin‑count system requirements without board redesign.
  • Flexible Clocking and Timing (Family Feature): Robust clocking resources in the SC/M family enable precise timing, clock multiplication/division and dynamic clock switching for complex designs.
  • Low‑Voltage Operation: 0.95 V to 1.26 V supply range supports modern low‑power system rails and power management strategies.
  • Commercial Grade Reliability: Rated for 0 °C to 85 °C operation to meet mainstream electronics and communications equipment requirements.
  • Regulatory Compliance: RoHS compliance supports environmental and manufacturing standards.

Why Choose LFSCM3GA40EP1-5FFAN1020C?

The LFSCM3GA40EP1-5FFAN1020C delivers a balanced combination of fabric capacity, embedded memory and extensive I/O in a compact 1020‑BBGA package, tailored for communication‑centric and memory‑intensive applications. Its alignment with the Lattice SC/M family architecture provides access to advanced I/O and SERDES features while maintaining straightforward integration into commercial temperature systems.

This device is suitable for engineering teams building mid‑to‑high complexity FPGA solutions that require on‑chip RAM, dense I/O and flexible clocking in a RoHS‑compliant, surface‑mount package.

If you would like pricing, availability or to request a quote for LFSCM3GA40EP1-5FFAN1020C, submit your request and a representative will respond with detailed purchasing information.

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