LFSCM3GA25EP1-6FN900I

The LFSCM3GA25EP1-6FN900I is an industrial‑grade SCM family FPGA featuring a high‑performance fabric, substantial embedded memory, and a large I/O count in a 900‑ball BGA package. It delivers 25,000 logic elements and approximately 1.97 Mbits of on‑chip RAM, making it suitable for complex control, communications, and system integration tasks where performance and integration density are required.

Built for systems requiring broad I/O connectivity and reliable operation over industrial temperature ranges, this device combines the SC/M family architecture with features such as extensive clocking resources and programmable I/O to address networking, embedded processing, and high‑bandwidth interface designs.

Key Features

• FPGA Core 25,000 logic elements for implementing custom digital logic, state machines and data processing pipelines.
• Embedded Memory Approximately 1.97 Mbits of total on‑chip RAM to support buffer, FIFO and frame storage requirements.
• I/O Capacity 378 user I/Os providing extensive external connectivity for peripherals, buses and sensors.
• High‑Performance Clocking SC/M family clocking includes multiple PLLs and DLLs and support for high‑speed edge clocks to facilitate precise timing and multi‑domain clock architectures.
• High‑speed Serial and I/O Options (family) The SC/M family offers high‑speed SERDES and flexiPCS options (4–32 per device) with documented performance ranges; these family features support a variety of serial interface standards and advanced I/O signaling.
• Package and Mounting 900‑BBGA (supplier package: 900‑FPBGA 31×31) surface‑mount package for high pin‑count board designs.
• Power Supply Core voltage operation between 0.950 V and 1.26 V to match system power rails and power‑management schemes.
• Industrial Temperature Grade Rated for operation from −40 °C to 105 °C for robust performance in industrial environments.
• RoHS Compliant Meets RoHS requirements for lead‑free manufacturing processes.

Typical Applications

• Network and Communications Equipment Implement protocol processing, packet buffering and interface bridging using the device’s logic capacity and embedded memory.
• Embedded System Integration Serve as a system controller or glue logic for SoC platforms, handling custom I/O, peripheral interfaces and timing control.
• Industrial Automation Drive sensor aggregation, real‑time control logic and fieldbus interfacing across industrial temperature ranges.
• High‑Density I/O Applications Ideal for designs that require many parallel signals or mixed signaling standards across a compact BGA footprint.

Unique Advantages

• High Logic Density: 25,000 logic elements enable complex functions and state machines without external glue logic, reducing BOM.
• Substantial On‑Chip Memory: Approximately 1.97 Mbits of embedded RAM supports frame buffering, FIFOs and memory‑intensive modules on‑chip.
• Large I/O Count: 378 I/Os simplify board routing and allow direct connection to many peripherals and buses, streamlining system design.
• Industrial‑Grade Operation: −40 °C to 105 °C rating ensures reliable operation in demanding environments and extended temperature deployments.
• Compact High‑Pin Package: 900‑BBGA (31×31 mm) provides high I/O density in a standardized surface‑mount form factor for space‑constrained boards.
• Family-Level High‑Speed Features: The SC/M family’s SERDES, PLL/DLL and advanced I/O capabilities offer flexible options for high‑bandwidth serial links and precision timing.

Why Choose LFSCM3GA25EP1-6FN900I?

This LFSCM3GA25EP1-6FN900I FPGA positions itself for designs that need a balance of logic capacity, embedded memory and abundant I/O in an industrial‑grade package. Its combination of 25,000 logic elements, approximately 1.97 Mbits of on‑chip RAM and 378 I/Os supports mid‑to‑high complexity applications where integration and reliability matter.

Engineers and procurement teams will find long‑term value in the device’s scalability within the SC/M family, robust clocking and I/O feature set, and a compact 900‑ball BGA footprint that helps reduce board complexity and BOM count while meeting industrial temperature requirements.

Request a quote or submit a pricing inquiry to evaluate LFSCM3GA25EP1-6FN900I for your next design and to discuss volume pricing and availability.