LFSCM3GA25EP1-6FFN1020I

The LFSCM3GA25EP1-6FFN1020I is an industrial-grade SCM Field Programmable Gate Array (FPGA) in a 1020-BBGA FCBGA package. It combines a high-density logic fabric with a substantial embedded memory footprint and a high I/O count for complex, I/O‑intensive systems.

Designed for applications that require dense logic, extensive on-chip RAM, and robust temperature and voltage ranges, this device delivers integration and flexibility for industrial and communication system designs.

Key Features

• Logic Capacity  25,000 logic elements, enabling implementation of sizable custom logic and control functions on a single device.
• Embedded Memory  Approximately 1.97 Mbits of total on-chip RAM (1,966,080 bits) for data buffering, FIFOs, and local storage.
• I/O Density  476 I/Os for high-pin-count interfaces, sensor arrays, and parallel bus connectivity.
• Voltage and Power  Core supply range of 0.95 V to 1.26 V, supporting low-voltage system architectures.
• Industrial Temperature Range  Rated for operation from −40 °C to 105 °C for deployment in industrial environments.
• Package  1020-BBGA FCBGA (supplier package: 1020-OFCBGA, 33×33) for compact, high-pin-count PCB designs.
• Family-Level High-Speed Capabilities  Lattice SC/M family features include high-performance FPGA fabric and high-speed SERDES/flexiPCS options (family-level performance up to 3.8 Gbps) and advanced I/O support as documented in the series datasheet.
• System-Level Support  Family-level features include precision clocking resources, PLLs/DLLs and system support such as IEEE 1149.1 boundary scan and IEEE 1532 in-system configuration (as described in the LatticeSC/M family datasheet).
• RoHS Compliant  Device is RoHS compliant.

Typical Applications

• Industrial Control and Automation  Use the device for complex control logic, high-channel I/O aggregation, and deterministic interfacing in harsh temperature environments.
• Communications and Networking  Leverage the family-level high-speed SERDES and large on-chip RAM to implement protocol interfaces, packet buffering, and PHY-level processing.
• Data Acquisition and Instrumentation  High I/O count and on-chip memory support multi-channel sensor readout, pre-processing, and local storage.
• Embedded System Integration  Consolidate glue logic, peripheral interfaces, and custom accelerators into a compact FCBGA package for space-constrained designs.

Unique Advantages

• High-density logic in a single device: 25,000 logic elements reduce external components and simplify board-level design.
• Substantial on-chip memory: Approximately 1.97 Mbits of embedded RAM enables local buffering and FIFO implementations without external memory.
• Extensive I/O capability: 476 I/Os provide flexibility for parallel interfaces, multiple peripherals, and high-channel-count systems.
• Industrial-grade robustness: Rated operation from −40 °C to 105 °C supports deployment in demanding environments.
• Compact, high-pin-count package: 1020-BBGA FCBGA (33×33) offers high routing density and reduced PCB footprint for complex systems.
• Low-voltage operation: Core supply range of 0.95 V to 1.26 V aligns with modern low-voltage power domains.

Why Choose LFSCM3GA25EP1-6FFN1020I?

The LFSCM3GA25EP1-6FFN1020I positions itself as a versatile, industrial-grade FPGA option where high logic density, significant embedded memory, and a large number of I/Os are required. Its package and voltage range support compact, low-voltage system designs while the device-level and family-level features described in the datasheet provide advanced timing, clocking, and high-speed I/O capabilities.

This device is well suited for engineers building scalable industrial, communications, and embedded solutions who need on-chip memory, broad I/O, and the system-level support offered by the Lattice SC/M family.

Request a quote or submit a procurement inquiry to evaluate LFSCM3GA25EP1-6FFN1020I for your next design.