LFSCM3GA15EP1-6FN900C

The LFSCM3GA15EP1-6FN900C is a LatticeSC/M family FPGA from Lattice Semiconductor Corporation. It provides a programmable FPGA fabric with 15,000 logic elements, approximately 1.05 Mbits of embedded RAM, and 300 I/Os in a 900-ball BGA package.

Designed for applications that require dense logic, significant on-chip memory and a large I/O count, this commercial-grade device targets communication systems, high-speed interfaces and embedded designs that benefit from integrated memory and flexible I/O.

Key Features

• Logic Capacity  15,000 logic elements (3,750 LABs) for implementing complex digital logic and glue functions.
• Embedded Memory  Approximately 1.05 Mbits of total on-chip RAM for data buffering, FIFOs and memory-intensive logic.
• I/O Density  300 I/Os to support broad peripheral and high-pin-count interfaces from a single device.
• High-Speed SERDES (family-level)  LatticeSC/M family devices include 4 to 32 high-speed SERDES with performance ranging from 600 Mbps to 3.8 Gbps and built-in pre-emphasis and equalization.
• Clocking and Timing (family-level)  Family features include up to 700 MHz global clocks, 1 GHz edge clocks, multiple PLLs and DLLs for flexible clock management.
• Package and Mounting  900-ball BGA (900-FPBGA, 31 × 31 mm) package, surface-mountable for compact board designs.
• Power and Operating Range  Supported supply voltage range from 0.95 V to 1.26 V; commercial operating temperature range 0 °C to 85 °C.
• Regulatory  RoHS compliant.

Typical Applications

• Communication Systems  High I/O density and family-level SERDES capabilities make this device suitable for protocol bridging, packet processing, and interface adaptation within network equipment.
• High-Speed Interfaces  Use embedded RAM and the device's clocking resources to implement high-speed FIFOs, memory interfaces and timing-critical serialization/deserialization logic.
• Embedded Processing Glue Logic  Implement control logic, data path arbitration and peripheral bridging where medium-density programmable logic and on-chip memory are required.
• Prototyping and System Integration  Dense logic and abundant I/Os are useful for proof-of-concept designs and integrating multiple subsystems onto a single FPGA device.

Unique Advantages

• High logic density: 15,000 logic elements provide room to consolidate complex logic blocks and reduce external glue components.
• Substantial on-chip RAM: Approximately 1.05 Mbits of embedded memory reduces external memory needs for buffering and FIFOs.
• Large I/O count: 300 I/Os support multiple parallel interfaces and simplify routing of high-pin-count subsystems.
• Compact BGA package: 900-ball FPBGA (31 × 31 mm) enables high pin count in a board-friendly surface-mount package.
• Flexible clocking (family-level): Extensive PLL/DLL and high-frequency clocking options support timing-critical designs and diverse clock domains.
• Regulatory compliance: RoHS compliance supports environmentally conscious manufacturing requirements.

Why Choose LFSCM3GA15EP1-6FN900C?

This LFSCM3GA15EP1-6FN900C device balances logic capacity, on-chip memory and I/O density in a compact 900-BBGA package, making it well suited for communication-focused designs and embedded systems that require integrated memory and flexible interfacing. Its commercial operating range and RoHS compliance make it appropriate for standard commercial products and development platforms.

Designers seeking a mid-range LatticeSC/M family FPGA can leverage its logic elements, embedded RAM and family-level high-speed features to consolidate functions, reduce BOM and accelerate system integration while maintaining clear power and thermal requirements defined by the device’s supply and temperature specifications.

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