LFSCM3GA115EP1-6FCN1152C

The LFSCM3GA115EP1-6FCN1152C is a commercial-grade SCM family FPGA offering high logic density and extensive I/O in a 1152-FCBGA package. Built on the Lattice SC/M architecture, it combines a high-performance FPGA fabric with large embedded memory and high-speed transceivers for demanding communication and system-integration applications.

This device is suited for designs that require high logic capacity, substantial on-chip memory, and large I/O counts while operating at low core voltages (0.95–1.26 V) and standard commercial temperature ranges (0 °C to 85 °C).

Key Features

• Core and Capacity — Approximately 115,000 logic elements deliver high logic density for complex digital designs and system integration.
• Embedded Memory — Approximately 8 Mbits of on-chip RAM (sysMEM block RAM plus distributed RAM) to support memory-intensive functions, FIFOs, and buffering.
• I/O and Package — 660 I/Os in a 1152-FCBGA (35 × 35 mm) surface-mount package, enabling rich external interfacing and high pin-count implementations.
• High-Speed SERDES and flexiPCS™ — Family-level support for 4 to 32 high-speed SERDES per device with performance up to 3.8 Gbps and built-in PCS implementations for standards such as GbE, XAUI, PCI Express, SONET, Serial RapidIO, and Fibre Channel.
• High-Performance I/O — PURESPEED™ I/O capable of differential DDR up to 2 Gbps and single-ended memory interfaces up to 800 Mbps, with programmable input delay and per-pin adaptive monitoring for robust timing alignment.
• Clocking and Timing — Extensive sysCLOCK™ resources including multiple PLLs and DLLs, supporting primary clocking up to 700 MHz and I/O-connected edge clocks to 1 GHz for tight timing control.
• Low-Voltage Operation — Core supply range 0.95 V to 1.26 V for low-power system designs.
• Commercial Operating Range & Mounting — Surface-mount FCBGA package rated for 0 °C to 85 °C operation; RoHS compliant.

Typical Applications

• Network and Telecom Systems — Implement protocol engines, PHY interfaces, and packet processing using embedded SERDES and PCS cores for standards such as GbE and PCI Express.
• High-Bandwidth Interface Bridging — Use the high I/O count and PURESPEED™ interfaces for bridging between memory buses, high-speed serializers, and external peripherals.
• Embedded System Integration — Leverage ample logic elements and approximately 8 Mbits of embedded RAM to consolidate multiple functions and reduce BOM in complex embedded controllers.
• Custom IP and Accelerators — Deploy user-defined processing blocks and hardware accelerators that require high logic density and extensive on-chip memory.

Unique Advantages

• High Logic Density: 115,000 logic elements provide the capacity needed for complex state machines, datapaths, and system logic without external PLDs.
• Large On-Chip Memory: Approximately 8 Mbits of embedded memory reduces external memory dependence and simplifies board-level design.
• Advanced High-Speed SerDes: Integrated SERDES and flexiPCS™ ease implementation of serial protocols and reduce discrete PHY requirements.
• Comprehensive I/O Flexibility: 660 I/Os in a compact FCBGA package support diverse signaling standards and high-pin-count interfaces.
• Low-Voltage, Commercial Operation: 0.95–1.26 V core operation and 0 °C to 85 °C rating match mainstream commercial system requirements while enabling lower power designs.
• RoHS Compliant: Aligns with environmental and manufacturing standards for lead-free assembly.

Why Choose LFSCM3GA115EP1-6FCN1152C?

This FPGA delivers a balance of high logic capacity, substantial embedded memory, and extensive I/O in a single, surface-mount FCBGA package. It is positioned for engineers and system designers who need to integrate complex digital functions, high-speed serial interfaces, and large buffers into commercial-grade products while maintaining low-voltage operation and RoHS compliance.

The device is a practical choice for communication, interface, and embedded system designs that require scalability, robust clocking and timing resources, and integrated SERDES/PCS functionality backed by the SC/M family architecture.

Request a quote or submit a pricing inquiry to get lead-time and availability for LFSCM3GA115EP1-6FCN1152C. Our team will provide the information you need to move forward with your design.