LFSC3GA80E-5FFN1152C

The LFSC3GA80E-5FFN1152C is a Lattice SC family field programmable gate array (FPGA) IC providing a high-performance programmable fabric for communication and data processing applications. It pairs a large logic capacity and extensive I/O with embedded memory and advanced clocking to address high-density, high-throughput designs.

Designed for commercial-grade systems, this device targets applications requiring dense logic, abundant I/O, on-chip RAM and robust low-voltage operation in a compact 1152-ball BGA package.

Key Features

• Logic Capacity  Approximately 80,000 logic elements (as specified) for complex digital designs and large-scale glue logic integration.
• On‑chip Memory  Approximately 5.8 Mbits of total embedded RAM (5,816,320 bits) to support large FIFOs, buffers and memory‑intensive logic.
• I/O Density  Up to 660 I/Os to accommodate wide data buses, multiple interfaces and high-pin-count system integration.
• High‑speed Serial Interfaces (series features)  SERDES capability (4 to 32 per device in the SC/M family) with performance from 600 Mbps to 3.8 Gbps, including built‑in pre‑emphasis and equalization and low transmit jitter (0.25 UI typical at 3.125 Gbps).
• High‑performance I/O Standards (series features)  Support for differential and single‑ended interfaces up to 2 Gbps DDR and a broad set of electrical standards including LVCMOS, LVTTL, SSTL, HSTL, PCI/PCI‑X, LVDS, Mini‑LVDS, Bus‑LVDS, MLVDS and LVPECL.
• Advanced Clocking (series features)  Extensive sysCLOCK network with up to eight analog PLLs, 12 DLLs, 700 MHz global clocks and 1 GHz edge clocks for demanding timing and multi‑clock domain designs.
• Package and Mounting  1152‑BBGA package (supplier package: 1152‑FPBGA, 35 × 35 mm) in a surface‑mount form factor for high pin count applications.
• Power and Supply  Core voltage operation from 0.95 V to 1.26 V to match modern low‑voltage system rails.
• Commercial Grade Temperature  Rated for 0 °C to 85 °C operation for commercial‑class deployments.
• System Support (series features)  Series includes IEEE 1149.1 boundary scan and IEEE 1532 in‑system configuration support for manufacturing test and in‑field updates.
• RoHS Compliant  Device is RoHS‑compliant.

Typical Applications

• Network and Telecommunication Equipment  High I/O density, embedded memory and high‑speed SERDES support enable packet processing, line cards and protocol bridging functions.
• High‑Speed Data Interfaces  Large logic capacity and up to 660 I/Os make the device suitable for aggregation, serializer/deserializer bridging and multi‑lane interface implementations.
• Embedded Processing & Offload  On‑chip RAM and extensive logic allow implementation of hardware accelerators, DMA engines and protocol offload functions.
• Prototyping and Complex Glue Logic  High logic element count and abundant I/O simplify system integration tasks and fast iteration for complex digital subsystems.

Unique Advantages

• High logic and memory integration: Combines approximately 80,000 logic elements with about 5.8 Mbits of embedded RAM to reduce external memory needs and simplify board design.
• Large I/O complement: Up to 660 I/Os supports wide parallel interfaces, multiple peripheral connections and high throughput system interconnects.
• Compact high‑pin package: 1152‑BBGA (1152‑FPBGA, 35 × 35 mm) delivers high pin count in a space‑efficient form factor for dense system layouts.
• Low‑voltage core operation: Core supply from 0.95 V to 1.26 V aligns with modern low‑power system rails.
• Advanced serial and I/O capabilities: Series SERDES and PURESPEED I/O technology (up to multi‑Gbps rates and multiple electrical standards) enable robust high‑speed link implementation.
• Robust clocking infrastructure: Multiple PLLs and DLLs with high‑frequency clocks support complex, high‑performance timing architectures across the design.

Why Choose LFSC3GA80E-5FFN1152C?

The LFSC3GA80E-5FFN1152C positions itself as a high‑capacity, commercially graded FPGA solution for systems that require large logic density, significant on‑chip memory and a high I/O count in a compact BGA package. Its combination of approximately 80,000 logic elements, roughly 5.8 Mbits of embedded RAM and up to 660 I/Os makes it suited for networking, high‑speed interface bridging and embedded acceleration tasks.

Engineers designing medium to large‑scale digital systems will find the LFSC3GA80E-5FFN1152C useful where integration, scalable performance and a broad set of I/O options are priorities. The device’s clocking and serial interface capabilities provide the deterministic timing and link performance needed for demanding applications.

Request a quote or submit an inquiry to our sales team to discuss availability, pricing and how LFSC3GA80E-5FFN1152C can fit your next design.