LFSC3GA40E-7FFN1152C

The LFSC3GA40E-7FFN1152C is a high-density SC-series FPGA from Lattice Semiconductor featuring 40,000 logic elements and extensive on-chip memory and I/O. Built for communication-focused and high-performance embedded designs, this device combines a large logic fabric with multi-gigabit-friendly I/O capabilities and flexible clocking resources.

This part targets applications that require dense logic, high I/O counts, and substantial embedded memory while operating from a low-voltage supply and within commercial temperature ranges.

Key Features

• Core Density: 40,000 logic elements (logic cells) to support complex custom logic and high-density designs.
• Embedded Memory: 4,075,520 total RAM bits—approximately 4.08 Mbits of embedded memory—suitable for buffering, FIFOs and on-chip data storage.
• High I/O Count: 604 I/Os for large, high-pin-count interfaces and multi-channel front-end connectivity.
• High-Speed SERDES and Protocol Support (Family-level): Family datasheet specifies 4 to 32 high-speed SERDES with embedded PCS IP for standards such as GbE, XAUI, PCI Express, SONET, RapidIO and Fibre Channel.
• High-Performance I/O (Family-level): PURESPEED™ I/O capability supporting differential I/O up to 2 Gbps DDR and single-ended memory interfaces—includes programmable input delay and on-die termination options.
• Clocking Resources (Family-level): Analog PLLs and DLLs with device-level support for high-frequency global and edge clocks (examples in family data: 700 MHz global clocks, 1 GHz edge clocks) and dynamic clock select features.
• Voltage & Power: Nominal supply range from 0.95 V to 1.26 V to meet low-voltage system requirements.
• Package: 1152-BBGA package; supplier device package listed as 1152-FPBGA (35×35).
• Temperature Grade: Commercial-grade operation from 0 °C to 85 °C.
• RoHS Compliant: Device meets RoHS environmental requirements.

Typical Applications

• High-Speed Networking: Implement line-rate interfaces and protocol handling for GbE, XAUI, PCI Express, SONET and Fibre Channel using the family’s SERDES and embedded PCS support.
• Telecommunications Equipment: Use the dense logic and substantial embedded memory for packet processing, framing, and protocol conversion tasks in communication systems.
• Embedded Systems & Appliances: Integrate complex control and data-path functions where high I/O counts and on-chip RAM reduce external component count and board complexity.
• Data Aggregation and Switching: Leverage many I/Os and block RAM for buffering, FIFOs and multi-port aggregation in switch, router or interface-bridging applications.

Unique Advantages

• High Logic Capacity: 40,000 logic elements provide headroom for complex state machines, datapaths and control logic without immediately resorting to larger families.
• Substantial On-Chip Memory: Approximately 4.08 Mbits of embedded RAM enables local buffering, packet queues and on-chip data structures that simplify board-level memory architectures.
• Large I/O Count: 604 I/Os support multiple parallel interfaces and dense external connectivity, reducing the need for additional I/O expanders.
• Low-Voltage Operation: 0.95 V to 1.26 V supply range supports integration into modern low-voltage power domains.
• Family-Level High-Speed Ecosystem: Family datasheet highlights integrated SERDES, PCS and I/O features that accelerate implementation of common communications standards and reduce development time.
• Commercial Temperature and RoHS Compliance: Designed for commercial environments and compliant with RoHS environmental regulations.

Why Choose LFSC3GA40E-7FFN1152C?

The LFSC3GA40E-7FFN1152C delivers a balanced combination of logic density, embedded memory and high I/O capacity in a single-package FPGA suitable for communication and performance-oriented embedded applications. With family-level support for high-speed SERDES, robust clocking resources and programmable I/O features, the device is positioned for designs that need integrated protocol handling and substantial on-chip storage.

Choose this FPGA when your design requires high-density logic, extensive I/O, and embedded RAM while operating within commercial temperature limits and low-voltage supply domains. The device benefits designs that target scalable implementations across the Lattice SC family and that leverage pre-engineered IP and system-level features described in the family datasheet.

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