LFSC3GA40E-6FFN1152I

The LFSC3GA40E-6FFN1152I is an industrial-grade FPGA from the Lattice SC family designed for high-density, memory-rich applications. It combines a high-performance FPGA fabric with substantial embedded RAM and 604 user I/Os in a compact 1152-BBGA package for surface-mount assembly.

This device targets communication, industrial control and high-performance embedded systems that require a balance of logic capacity, I/O density and on-chip memory while operating across an industrial temperature range.

Key Features

• Core Logic  40,000 logic elements (cells) suitable for complex logic integration and mid-range FPGA designs.
• High I/O Density  604 I/Os provide broad external connectivity for parallel interfaces, multi-channel designs and high-pin-count subsystems.
• Embedded Memory  Approximately 4.08 Mbits of on-chip RAM (4,075,520 bits) to support frame buffers, FIFOs and memory-intensive functions.
• Package & Mounting  1152-BBGA (supplier package: 1152-FPBGA 35×35) in a surface-mount form factor for compact, high-density PCB designs.
• Voltage Supply  Core supply range from 950 mV to 1.26 V to match system power domains and regulator choices.
• Industrial Operating Range  Rated for operation from -40 °C to 105 °C, suitable for industrial operating environments.
• SC/M Family High‑Speed Features  The Lattice SC/M family (as documented in the device family datasheet) includes high-speed SERDES (4 to 32 per device) with performance from 600 Mbps to 3.8 Gbps, and a high-performance I/O architecture (PURESPEED™) supporting differential and single-ended interfaces up to multi‑Gbps rates.
• Advanced Clocking and System Support  Family-level features include multi‑PLL/DLL clock resources, high-frequency global and edge clocks, and system-level support such as IEEE 1149.1 boundary scan and in-system configuration options (per family datasheet).

Typical Applications

• Networking & Telecom  Use the device where mid-range FPGA logic and high-speed serial interfaces are required for packet processing, aggregation or protocol bridging (family SERDES and clocking features).
• Industrial Control  Industrial-rated temperature range and high I/O count enable motor control, machine I/O aggregation and real-time control tasks.
• Memory-Intensive Embedded Systems  Approximately 4.08 Mbits of embedded RAM supports buffering, FIFOs and other data-path memory needs in embedded applications.
• High-Density I/O Systems  604 I/Os and a compact 1152-BBGA package are suited to designs requiring many external interfaces in a small PCB footprint.

Unique Advantages

• Balanced Logic and Memory: 40,000 logic elements combined with ~4.08 Mbits of embedded RAM provides a strong mid-range platform for complex logic and data buffering without external memory dependencies.
• High I/O Integration: 604 I/Os reduce the need for external I/O expanders and simplify board-level routing for multi-channel systems.
• Industrial Reliability: Rated for -40 °C to 105 °C, enabling deployment in demanding industrial environments.
• Compact, High-Pin Package: 1152-BBGA (35×35) delivers high pin-count density in a space-efficient form factor for constrained PCBs.
• Family-Level High-Speed Capabilities: SC/M family SERDES and advanced clocking resources (as documented in the family datasheet) support multi‑Gbps links and precise timing requirements.
• Flexible Power Domains: Core supply range (950 mV–1.26 V) accommodates a variety of power architectures and regulator choices.

Why Choose LFSC3GA40E-6FFN1152I?

This FPGA offers a practical combination of logic capacity, substantial on-chip memory and very high I/O density in a surface-mount 1152-BBGA package. Its industrial temperature rating and supply range make it a dependable option for embedded and industrial designs that require both performance and operational robustness.

Engineers looking for a mid-range SC-family device with integrated memory, multiple I/Os and family-proven high-speed I/O and clocking resources will find this device aligns with use cases that demand integrated functionality and compact board-level implementation.

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