LFSC3GA40E-5FFN1152I
| Part Description |
SC Field Programmable Gate Array (FPGA) IC 604 4075520 40000 1152-BBGA |
|---|---|
| Quantity | 525 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 1152-FPBGA (35x35) | Grade | Industrial | Operating Temperature | -40°C – 105°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1152-BBGA | Number of I/O | 604 | Voltage | 950 mV - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 10000 | Number of Logic Elements/Cells | 40000 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 4075520 |
Overview of LFSC3GA40E-5FFN1152I – SC Field Programmable Gate Array (FPGA) IC, 604 I/O, ~4.08 Mbit RAM, 40k Logic Elements, 1152-BBGA
The LFSC3GA40E-5FFN1152I is a Lattice Semiconductor SC-series FPGA featuring a high-performance programmable fabric, extensive I/O capability and large on-chip memory. Designed for system-level integration in communication, networking and industrial applications, this surface-mount device combines approximately 40,000 logic elements with roughly 4.08 Mbits of embedded RAM and 604 I/O pins in a 1152-BBGA package.
Its operating range and voltage flexibility support industrial deployments, while the SC/M family architecture provides advanced clocking, SERDES and memory features for demanding, timing-sensitive designs.
Key Features
- Logic Capacity Approximately 40,000 logic elements enabling complex digital designs and implementation of high-density logic functions.
- Embedded Memory Total RAM bits: 4,075,520 (approximately 4.08 Mbits) to support large on-chip data buffering, FIFOs and memory-intensive algorithms.
- High I/O Count 604 user I/Os providing extensive connectivity for parallel buses, high-pin-count interfaces and multi-channel systems.
- Package & Mounting 1152-BBGA supplied as 1152-FPBGA (35×35) for high-pin-density board designs; surface-mount device suitable for standard PCB assembly.
- Industrial Temperature Grade Rated for -40°C to 105°C operation for reliable performance in industrial environments.
- Supply Voltage Core voltage range 0.95 V to 1.26 V, supporting low-voltage system architectures.
- SC/M Family Architecture Series-level capabilities include high-performance FPGA fabric, high-speed SERDES, flexible clocking (700 MHz global clock, 1 GHz edge clocks) and extensive PLL/DLL resources for complex timing and protocol support.
- High-Speed I/O and Protocol Support Family features include multi-Gbps SERDES (600 Mbps to 3.8 Gbps), PURESPEED I/O with programmable input delay and broad electrical-standard support (LVCMOS, LVTTL, SSTL, HSTL, LVDS, PCI/PCI-X and others).
- System-Level Features Family provides sysMEM block RAM, dedicated FIFO logic, multiple PLLs and DLLs, and on-chip resources to aid dynamic clocking and system integration.
- RoHS Compliant Meets environmental requirements for lead-free assembly.
Typical Applications
- High‑Speed Networking & Telecom Use the device for protocol processing, line cards and packet handling where high I/O density and SERDES support are required.
- Industrial Control & Automation Deploy in industrial systems requiring wide temperature operation, deterministic logic and large I/O connectivity for sensors, actuators and field interfaces.
- Memory‑Intensive Embedded Systems Leverage approximately 4.08 Mbits of embedded RAM and dedicated FIFO logic for buffering, packet processing and high-throughput data paths.
- High‑Pin‑Count Interface Hubs Implement multi-channel interface aggregation and protocol bridging using the device’s 604 I/Os and flexible I/O standards.
Unique Advantages
- High Integration Combines 40,000 logic elements, substantial on-chip memory and 604 I/Os in a single 1152-BBGA package to reduce board-level BOM and simplify system design.
- Industrial Reliability Rated for -40°C to 105°C operation, enabling deployment in temperature-challenging industrial environments.
- Flexible Power Envelope Core supply range of 0.95 V to 1.26 V accommodates low-voltage system architectures and power-optimized designs.
- Advanced Clocking & Timing SC/M family clocking resources (high-frequency global and edge clocks, multiple PLLs/DLLs) facilitate precise timing for high-speed interfaces and memory control.
- Protocol & I/O Versatility Family-level support for multi-Gbps SERDES and a broad set of electrical standards enables reuse across diverse interface requirements.
- Production-Ready Packaging 1152-FPBGA (35×35) provides a high-pin-count, surface-mount solution compatible with standard assembly flows.
Why Choose LFSC3GA40E-5FFN1152I?
The LFSC3GA40E-5FFN1152I delivers a balanced combination of logic density, significant embedded memory and very high I/O count in a single industrial-grade FPGA package. It is well suited to designers building communications, networking and industrial systems that need integrated memory, advanced timing resources and broad interface support from the SC/M family architecture.
Choosing this device provides a platform that supports complex protocol handling, memory-rich processing and extensive external connectivity while maintaining the temperature and supply characteristics required for industrial deployments.
Request a quote or submit a sales inquiry to get pricing and availability for the LFSC3GA40E-5FFN1152I.

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