LFSC3GA40E-5FFN1152I

IC FPGA 604 I/O 1152FBGA
Part Description

SC Field Programmable Gate Array (FPGA) IC 604 4075520 40000 1152-BBGA

Quantity 525 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package1152-FPBGA (35x35)GradeIndustrialOperating Temperature-40°C – 105°C
Package / Case1152-BBGANumber of I/O604Voltage950 mV - 1.26 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs10000Number of Logic Elements/Cells40000
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits4075520

Overview of LFSC3GA40E-5FFN1152I – SC Field Programmable Gate Array (FPGA) IC, 604 I/O, ~4.08 Mbit RAM, 40k Logic Elements, 1152-BBGA

The LFSC3GA40E-5FFN1152I is a Lattice Semiconductor SC-series FPGA featuring a high-performance programmable fabric, extensive I/O capability and large on-chip memory. Designed for system-level integration in communication, networking and industrial applications, this surface-mount device combines approximately 40,000 logic elements with roughly 4.08 Mbits of embedded RAM and 604 I/O pins in a 1152-BBGA package.

Its operating range and voltage flexibility support industrial deployments, while the SC/M family architecture provides advanced clocking, SERDES and memory features for demanding, timing-sensitive designs.

Key Features

  • Logic Capacity  Approximately 40,000 logic elements enabling complex digital designs and implementation of high-density logic functions.
  • Embedded Memory  Total RAM bits: 4,075,520 (approximately 4.08 Mbits) to support large on-chip data buffering, FIFOs and memory-intensive algorithms.
  • High I/O Count  604 user I/Os providing extensive connectivity for parallel buses, high-pin-count interfaces and multi-channel systems.
  • Package & Mounting  1152-BBGA supplied as 1152-FPBGA (35×35) for high-pin-density board designs; surface-mount device suitable for standard PCB assembly.
  • Industrial Temperature Grade  Rated for -40°C to 105°C operation for reliable performance in industrial environments.
  • Supply Voltage  Core voltage range 0.95 V to 1.26 V, supporting low-voltage system architectures.
  • SC/M Family Architecture  Series-level capabilities include high-performance FPGA fabric, high-speed SERDES, flexible clocking (700 MHz global clock, 1 GHz edge clocks) and extensive PLL/DLL resources for complex timing and protocol support.
  • High-Speed I/O and Protocol Support  Family features include multi-Gbps SERDES (600 Mbps to 3.8 Gbps), PURESPEED I/O with programmable input delay and broad electrical-standard support (LVCMOS, LVTTL, SSTL, HSTL, LVDS, PCI/PCI-X and others).
  • System-Level Features  Family provides sysMEM block RAM, dedicated FIFO logic, multiple PLLs and DLLs, and on-chip resources to aid dynamic clocking and system integration.
  • RoHS Compliant  Meets environmental requirements for lead-free assembly.

Typical Applications

  • High‑Speed Networking & Telecom  Use the device for protocol processing, line cards and packet handling where high I/O density and SERDES support are required.
  • Industrial Control & Automation  Deploy in industrial systems requiring wide temperature operation, deterministic logic and large I/O connectivity for sensors, actuators and field interfaces.
  • Memory‑Intensive Embedded Systems  Leverage approximately 4.08 Mbits of embedded RAM and dedicated FIFO logic for buffering, packet processing and high-throughput data paths.
  • High‑Pin‑Count Interface Hubs  Implement multi-channel interface aggregation and protocol bridging using the device’s 604 I/Os and flexible I/O standards.

Unique Advantages

  • High Integration  Combines 40,000 logic elements, substantial on-chip memory and 604 I/Os in a single 1152-BBGA package to reduce board-level BOM and simplify system design.
  • Industrial Reliability  Rated for -40°C to 105°C operation, enabling deployment in temperature-challenging industrial environments.
  • Flexible Power Envelope  Core supply range of 0.95 V to 1.26 V accommodates low-voltage system architectures and power-optimized designs.
  • Advanced Clocking & Timing  SC/M family clocking resources (high-frequency global and edge clocks, multiple PLLs/DLLs) facilitate precise timing for high-speed interfaces and memory control.
  • Protocol & I/O Versatility  Family-level support for multi-Gbps SERDES and a broad set of electrical standards enables reuse across diverse interface requirements.
  • Production-Ready Packaging  1152-FPBGA (35×35) provides a high-pin-count, surface-mount solution compatible with standard assembly flows.

Why Choose LFSC3GA40E-5FFN1152I?

The LFSC3GA40E-5FFN1152I delivers a balanced combination of logic density, significant embedded memory and very high I/O count in a single industrial-grade FPGA package. It is well suited to designers building communications, networking and industrial systems that need integrated memory, advanced timing resources and broad interface support from the SC/M family architecture.

Choosing this device provides a platform that supports complex protocol handling, memory-rich processing and extensive external connectivity while maintaining the temperature and supply characteristics required for industrial deployments.

Request a quote or submit a sales inquiry to get pricing and availability for the LFSC3GA40E-5FFN1152I.

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