LFSC3GA40E-5FF1020I

The LFSC3GA40E-5FF1020I is an industrial-grade SC family FPGA in a 1020-BBGA (FCBGA) package that delivers high-density logic, abundant on-chip memory, and a large I/O count for complex embedded designs. Built on the Lattice SC/M architecture, the device targets communications, networking, and memory‑intensive systems that require high integration, flexible I/O performance, and extended operating temperature range.

Key Features

• Logic Capacity  Approximately 40,000 logic elements to implement complex digital functions and custom accelerators.
• Embedded Memory  Approximately 4.08 Mbits of on-chip RAM (4,075,520 bits) suitable for buffers, FIFOs and local data storage.
• High I/O Count  562 user I/Os support dense board-level interfaces and multi‑lane connectivity options.
• Flexible I/O and High-Speed SerDes (series-level)  Lattice SC/M family features include PURESPEED™ I/O up to 2 Gbps and 4–32 high-speed SERDES with PCS options for common serial standards (series capability referenced from datasheet).
• Clocking and Timing (series-level)  Extensive sysCLOCK™ network with multiple PLLs and DLLs supporting high-frequency global and edge clocks (series capability referenced from datasheet).
• Package and Mounting  1020-BBGA (FCBGA) package, supplier package 1020-OFCBGA (33×33), surface-mount for compact, high-pin-count board designs.
• Voltage and Temperature  Core supply range 0.95 V to 1.26 V; industrial operating temperature from −40 °C to 105 °C.
• Compliance  RoHS compliant for environmental and manufacturing compatibility.

Typical Applications

• High-speed Networking  Implements multi‑lane serial interfaces and protocol processing using the series-level SERDES and PCS capabilities.
• Communication Systems  Supports memory‑intensive packet buffering and data plane processing with approximately 4.08 Mbits of embedded RAM and abundant logic resources.
• Industrial Control and Automation  Industrial-grade temperature range and high I/O count make it suitable for sensor aggregation, motor control front-ends and real-time system glue logic.
• Custom Embedded Systems  High logic density and flexible I/O enable implementation of application-specific accelerators and interface bridges in compact form factors.

Unique Advantages

• High integration density: Approximately 40,000 logic elements and ~4.08 Mbits of embedded RAM reduce external component count and simplify board design.
• Large I/O footprint: 562 I/Os provide the flexibility to support multiple parallel buses, interfaces and multi‑lane serial links without external multiplexing.
• Industrial reliability: Rated for −40 °C to 105 °C operation, suitable for demanding environmental conditions.
• Compact, high-pin-count package: 1020‑BBGA (33×33) FCBGA enables high density routing and small PCB area for space-constrained systems.
• Power-scalable core: 0.95 V to 1.26 V supply range allows design trade-offs between performance and power within supported board power architectures.

Why Choose LFSC3GA40E-5FF1020I?

The LFSC3GA40E-5FF1020I combines a high-density logic fabric, several megabits of embedded RAM, and an extensive I/O set in an industrial-grade, surface-mount 1020‑BBGA package. It is well suited for system designers building communication equipment, networking gear, industrial controllers, and other embedded applications that demand integrated memory, high I/O count, and robust thermal performance.

Choosing this device provides a compact, high‑integration platform that leverages the Lattice SC/M family capabilities for high‑speed I/O and sophisticated clocking, helping reduce BOM complexity while maintaining flexibility for future design iterations.

If you would like pricing, lead-time or a formal quote for LFSC3GA40E-5FF1020I, request a quote or submit an inquiry to obtain current availability and ordering information.