LFSC3GA25E-7FFN1020C
| Part Description |
SC Field Programmable Gate Array (FPGA) IC 476 1966080 25000 1020-BBGA, FCBGA |
|---|---|
| Quantity | 123 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 1020-OFCBGA (33x33) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1020-BBGA, FCBGA | Number of I/O | 476 | Voltage | 950 mV - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 6250 | Number of Logic Elements/Cells | 25000 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 1966080 |
Overview of LFSC3GA25E-7FFN1020C – SC Field Programmable Gate Array (FPGA) IC, 25,000 logic elements, 1020-BBGA
The LFSC3GA25E-7FFN1020C is a Lattice Semiconductor SC-family FPGA in a 1020-BBGA (FCBGA) package designed for high-density, memory-intensive embedded designs. It combines a high-performance FPGA fabric with large embedded RAM and extensive I/O to address communications, networking and system-level integration use cases.
With 25,000 logic elements, approximately 1.97 Mbits of on-chip RAM and 476 I/O pins, this device targets applications that require dense I/O, substantial on-chip memory and flexible high-speed interface support while operating in commercial temperature environments.
Key Features
- Logic Capacity 25,000 logic elements provide the programmable fabric required for complex logic, protocol handling and custom datapath implementations.
- Embedded Memory Approximately 1.97 Mbits of total on-chip RAM (1,966,080 bits) for packet buffering, FIFOs and memory-intensive logic structures.
- I/O Density 476 I/O pins support wide parallel interfaces and numerous peripheral connections for flexible board-level integration.
- High-Speed SERDES and I/O Family-level support includes multi-Gbps SERDES (600 Mbps to 3.8 Gbps) and high-performance PURESPEED I/O technology with programmable input delay and multiple supported electrical standards.
- Clocking Advanced clock resources (family-level) include multiple PLLs and DLLs for high-frequency global and I/O edge clocks to support precise timing and multi-domain designs.
- Power and Supply Core supply range from 0.950 V to 1.260 V, enabling modern low-voltage operation consistent with high-density FPGA fabrics.
- Package and Mounting 1020-BBGA (FCBGA) package, supplier package noted as 1020-OFCBGA (33×33), optimized for surface-mount assembly in compact board layouts.
- Commercial Grade & RoHS Commercial operating temperature range 0 °C to 85 °C and RoHS-compliant manufacturing.
Typical Applications
- Communications and Networking Implement protocol handling, packet processing and high-speed serial links using the device's SERDES capabilities and large I/O complement.
- High-Speed Interface Bridging Use abundant I/O and programmable timing to bridge between parallel buses and serial fabrics or to implement custom interface logic.
- Memory-Intensive Embedded Systems Leverage approximately 1.97 Mbits of embedded RAM for buffering, FIFOs and data staging in systems that require on-chip memory.
- System Integration and Prototyping Dense logic and I/O make the device suitable for proof-of-concept designs and integration of multiple peripherals on a single programmable device.
Unique Advantages
- High I/O Count: 476 I/Os enable broad peripheral and interface connectivity without external multiplexing.
- Substantial On‑Chip RAM: Approximately 1.97 Mbits of embedded memory reduces external memory dependence for buffering and FIFO needs.
- Flexible High-Speed Interfaces: Family-level SERDES and programmable I/O timing support a wide range of serial protocols and robust signal conditioning.
- Advanced Clocking Resources: Multiple PLLs and DLLs (as provided by the family architecture) allow accurate clock domain management and high-frequency operation.
- Compact FCBGA Package: 1020-BBGA (33×33) package provides a high pin-count solution in a compact footprint for space-constrained boards.
- Commercial-Grade Reliability: Rated for 0 °C to 85 °C operation and RoHS compliant to meet standard commercial design requirements.
Why Choose LFSC3GA25E-7FFN1020C?
The LFSC3GA25E-7FFN1020C delivers a balanced combination of logic capacity, embedded memory and high I/O density in a compact FCBGA package. It is well-suited for designers building communication-focused systems, memory-intensive applications and multifunction embedded platforms that require programmable logic, fast interfaces and robust clocking resources.
Supported by the Lattice SC-family architecture and system-level features from the datasheet, this device offers the integration and flexibility needed to simplify BOMs and accelerate design cycles while operating within commercial temperature and low-voltage supply parameters.
Request a quote or submit your pricing inquiry for LFSC3GA25E-7FFN1020C to receive availability and lead-time information tailored to your project needs.

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