LFSC3GA25E-7FFN1020C

IC FPGA 476 I/O 1020BGA
Part Description

SC Field Programmable Gate Array (FPGA) IC 476 1966080 25000 1020-BBGA, FCBGA

Quantity 123 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package1020-OFCBGA (33x33)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1020-BBGA, FCBGANumber of I/O476Voltage950 mV - 1.26 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs6250Number of Logic Elements/Cells25000
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits1966080

Overview of LFSC3GA25E-7FFN1020C – SC Field Programmable Gate Array (FPGA) IC, 25,000 logic elements, 1020-BBGA

The LFSC3GA25E-7FFN1020C is a Lattice Semiconductor SC-family FPGA in a 1020-BBGA (FCBGA) package designed for high-density, memory-intensive embedded designs. It combines a high-performance FPGA fabric with large embedded RAM and extensive I/O to address communications, networking and system-level integration use cases.

With 25,000 logic elements, approximately 1.97 Mbits of on-chip RAM and 476 I/O pins, this device targets applications that require dense I/O, substantial on-chip memory and flexible high-speed interface support while operating in commercial temperature environments.

Key Features

  • Logic Capacity  25,000 logic elements provide the programmable fabric required for complex logic, protocol handling and custom datapath implementations.
  • Embedded Memory  Approximately 1.97 Mbits of total on-chip RAM (1,966,080 bits) for packet buffering, FIFOs and memory-intensive logic structures.
  • I/O Density  476 I/O pins support wide parallel interfaces and numerous peripheral connections for flexible board-level integration.
  • High-Speed SERDES and I/O  Family-level support includes multi-Gbps SERDES (600 Mbps to 3.8 Gbps) and high-performance PURESPEED I/O technology with programmable input delay and multiple supported electrical standards.
  • Clocking  Advanced clock resources (family-level) include multiple PLLs and DLLs for high-frequency global and I/O edge clocks to support precise timing and multi-domain designs.
  • Power and Supply  Core supply range from 0.950 V to 1.260 V, enabling modern low-voltage operation consistent with high-density FPGA fabrics.
  • Package and Mounting  1020-BBGA (FCBGA) package, supplier package noted as 1020-OFCBGA (33×33), optimized for surface-mount assembly in compact board layouts.
  • Commercial Grade & RoHS  Commercial operating temperature range 0 °C to 85 °C and RoHS-compliant manufacturing.

Typical Applications

  • Communications and Networking  Implement protocol handling, packet processing and high-speed serial links using the device's SERDES capabilities and large I/O complement.
  • High-Speed Interface Bridging  Use abundant I/O and programmable timing to bridge between parallel buses and serial fabrics or to implement custom interface logic.
  • Memory-Intensive Embedded Systems  Leverage approximately 1.97 Mbits of embedded RAM for buffering, FIFOs and data staging in systems that require on-chip memory.
  • System Integration and Prototyping  Dense logic and I/O make the device suitable for proof-of-concept designs and integration of multiple peripherals on a single programmable device.

Unique Advantages

  • High I/O Count: 476 I/Os enable broad peripheral and interface connectivity without external multiplexing.
  • Substantial On‑Chip RAM: Approximately 1.97 Mbits of embedded memory reduces external memory dependence for buffering and FIFO needs.
  • Flexible High-Speed Interfaces: Family-level SERDES and programmable I/O timing support a wide range of serial protocols and robust signal conditioning.
  • Advanced Clocking Resources: Multiple PLLs and DLLs (as provided by the family architecture) allow accurate clock domain management and high-frequency operation.
  • Compact FCBGA Package: 1020-BBGA (33×33) package provides a high pin-count solution in a compact footprint for space-constrained boards.
  • Commercial-Grade Reliability: Rated for 0 °C to 85 °C operation and RoHS compliant to meet standard commercial design requirements.

Why Choose LFSC3GA25E-7FFN1020C?

The LFSC3GA25E-7FFN1020C delivers a balanced combination of logic capacity, embedded memory and high I/O density in a compact FCBGA package. It is well-suited for designers building communication-focused systems, memory-intensive applications and multifunction embedded platforms that require programmable logic, fast interfaces and robust clocking resources.

Supported by the Lattice SC-family architecture and system-level features from the datasheet, this device offers the integration and flexibility needed to simplify BOMs and accelerate design cycles while operating within commercial temperature and low-voltage supply parameters.

Request a quote or submit your pricing inquiry for LFSC3GA25E-7FFN1020C to receive availability and lead-time information tailored to your project needs.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 1983


    Headquarters: Hillsboro, Oregon, USA


    Employees: 1,000+


    Revenue: $627.7 Million


    Certifications and Memberships: ISO9001:2015, ISO14001:2015, IATF16949:2016


    Featured Products
    Latest News
    keyboard_arrow_up