LFSC3GA25E-6F900I

The LFSC3GA25E-6F900I is a Field Programmable Gate Array (FPGA) IC from Lattice Semiconductor Corporation’s LatticeSC family. It combines a high-performance FPGA fabric with substantial on-chip memory and a high I/O count in a 900-BBGA package for compact system integration.

This device targets industrial applications that require programmable logic, abundant I/O, and embedded memory within a low-voltage operating range, delivering design flexibility and high-density integration for communication, networking and embedded systems.

Key Features

• Programmable Logic: 25,000 logic elements provide the core programmable fabric for implementing custom digital logic and system functions.
• Embedded Memory: Approximately 1.97 Mbits of on-chip RAM (1,966,080 bits) for data buffering, FIFOs and state storage.
• I/O Capacity: 378 user I/Os to support wide parallel interfaces, multiple peripherals, and board-level integration in high-density designs.
• Package and Mounting: 900-BBGA (supplier package 900-FPBGA, 31×31) with surface-mount topology for high pin-count, area-efficient PCB layouts.
• Power and Voltage: Operates from 0.95 V to 1.26 V supply rails, enabling low-voltage system designs.
• Industrial Temperature Range: Rated for operation from −40 °C to 105 °C, suitable for industrial environments.
• Compliance: RoHS compliant for environmental regulatory adherence.
• LatticeSC Family Capabilities: Family-level features include high-performance FPGA fabric, high-speed SERDES and flexiPCS options (4–32 SERDES per device), advanced I/O standards, and extensive clocking resources such as analog PLLs and DLLs.

Typical Applications

• Industrial Control: Implement custom control logic, sensor interfacing and real-time processing using the device’s programmable fabric and robust operating temperature range.
• Networking & Communications: Use the device where high I/O density and the LatticeSC family’s high-speed SERDES and PCS capabilities support packet processing and protocol bridging.
• Embedded Systems: Consolidate glue logic, protocol conversion and memory buffering within a single FPGA to reduce system BOM and board area.
• High-density I/O Gateways: Leverage 378 I/Os and on-chip RAM for bridging multiple interfaces and implementing data aggregation or preprocessing tasks.

Unique Advantages

• High integration in a compact package: 900-BBGA package packs 378 I/Os and significant logic density into a space-efficient form factor for constrained board designs.
• Substantial on-chip memory: Approximately 1.97 Mbits of embedded RAM reduces reliance on external memory devices for buffering and FIFO functions.
• Industrial-grade thermal range: −40 °C to 105 °C rating supports reliable operation across a wide range of industrial environments.
• Low-voltage operation: 0.95 V to 1.26 V supply range enables integration into modern low-voltage power domains.
• Family-level serial and clocking capabilities: Access to LatticeSC family features such as high-speed SERDES and multi-PLL/DLL clocking architectures helps accelerate high-speed interface implementations.
• RoHS compliant: Meets environmental regulatory requirements for lead-free assembly and materials.

Why Choose LFSC3GA25E-6F900I?

The LFSC3GA25E-6F900I delivers a balanced combination of programmable logic capacity, on-chip memory and high I/O density in a 900-BBGA package, targeting industrial and embedded applications that require flexibility and integration. Its supported voltage range and industrial temperature rating make it suitable for robust system designs operating across varied environments.

Designed within the LatticeSC family, the device benefits from family-level features—such as high-speed serial options and comprehensive clocking resources—providing a platform that scales to complex communication and control designs while helping reduce external component count and overall BOM.

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