LFSC3GA25E-6FFN1020C

The LFSC3GA25E-6FFN1020C is a commercial-grade SC-family FPGA from Lattice Semiconductor. It combines a high-performance FPGA fabric with a dense I/O count and substantial on-chip memory, delivered in a 1020-BBGA FCBGA package suitable for surface-mount assembly.

This device is designed for communications and system integration applications that require a balance of logic capacity, embedded RAM, and flexible high-speed I/O options while operating within a 0 °C to 85 °C ambient range and a 0.95 V to 1.26 V supply window.

Key Features

• Logic Capacity — 25,000 logic elements to implement mid-range FPGA designs and custom logic.
• Embedded Memory — 1,966,080 bits of on-chip RAM (approximately 1.97 Mbits) for data buffering, FIFOs, and memory-intensive functions.
• High I/O Count — 476 I/O pins to support wide parallel interfaces and complex board-level connectivity.
• Package & Mounting — 1020-BBGA (FCBGA) supplier package 1020-OFCBGA (33×33) in a surface-mount form factor for compact PCB integration.
• Power Supply — Rated for operation from 0.95 V to 1.26 V, supporting 1.0 V and 1.2 V system domains referenced in the family data.
• Operating Temperature — Commercial temperature range: 0 °C to 85 °C.
• Family-Level High-Speed I/O & SERDES — SC-family features include high-speed SERDES and flexiPCS functionality with channel performance ranging from 600 Mbps to 3.8 Gbps and built-in PCS support for standards such as GbE, XAUI, PCI Express and others (family-level capability described in the datasheet).
• Robust Clocking & Memory Support (Family Features) — Multiple PLLs and DLLs, precision clocking networks, and dedicated block RAM structures are part of the SC/M family architecture described in the datasheet.
• RoHS Compliant — Meets RoHS environmental requirements.

Typical Applications

• Networking & Communications — Implement PHY, MAC offload, packet processing or protocol bridging leveraging the family-level SERDES and PCS capabilities.
• High-density I/O Control — Support for wide parallel buses, memory interfaces and multi-channel I/O aggregation using 476 available I/Os.
• Embedded Memory-Intensive Logic — On-chip RAM is suited for buffering, FIFOs and other data-centric functions in mid-size FPGA designs.
• System Integration — Use as a programmable logic hub to consolidate multiple discrete functions and reduce BOM in commercial electronic systems.

Unique Advantages

• Balanced Logic-to-Memory Ratio: 25,000 logic elements paired with approximately 1.97 Mbits of embedded RAM supports designs that need both logic density and local storage.
• High I/O Density: 476 I/Os enable complex board-level interfaces and parallel connectivity without external multiplexing.
• Compact, Surface-Mount Package: 1020-BBGA (33×33) FCBGA provides a high pin-count solution in a space-efficient form factor for modern PCB layouts.
• Family-Proven High-Speed I/O: SC-family SERDES and flexiPCS options (600 Mbps–3.8 Gbps family range) provide flexibility for a variety of serial standards at the device-family level.
• Commercial Temperature Range: Rated for 0 °C to 85 °C operation for mainstream commercial applications.
• RoHS Compliant: Aligns with environmental regulatory requirements for commercial electronics.

Why Choose LFSC3GA25E-6FFN1020C?

The LFSC3GA25E-6FFN1020C targets designers who need a commercially graded FPGA with a well-rounded mix of logic capacity, embedded RAM, and extensive I/O in a compact BGA package. Its alignment with the SC-family architecture provides access to high-performance clocking, block RAM resources and family-level high-speed serial capabilities described in the datasheet.

This part is well suited to system-level integration tasks in communications, interface bridging, and mid-range programmable logic applications where moderate logic density, significant on-chip memory and a high I/O count are required. The device offers a predictable supply and temperature window and RoHS compliance for commercial electronic product development.

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