LFSC3GA25E-5FFN1020CAAC

LFSC3GA25E-5FFN1020CAAC
Part Description

SC Field Programmable Gate Array (FPGA) IC 476 1966080 25000 1020-BBGA, FCBGA

Quantity 1,402 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time1 Weeks
Datasheet

Specifications & Environmental

Device Package1020-OFCBGA (33x33)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1020-BBGA, FCBGANumber of I/O476Voltage950 mV - 1.26 V
Mounting MethodSurface MountRoHS ComplianceN/AREACH ComplianceREACH not applicable
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs6250Number of Logic Elements/Cells25000
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits1966080

Overview of LFSC3GA25E-5FFN1020CAAC – SC FPGA, 25,000 logic elements, 476 I/Os, ~1.97 Mbits RAM, 1020-BBGA (FCBGA)

The LFSC3GA25E-5FFN1020CAAC is a Field Programmable Gate Array (FPGA) IC from Lattice Semiconductor Corporation designed for commercial embedded applications. It provides a balanced combination of programmable logic capacity, on-chip memory and a high I/O count in a compact 1020-BBGA FCBGA package.

Targets include embedded system designers and OEMs requiring mid-range logic integration, substantial I/O, and modest embedded memory, all operating within a commercial temperature range and low-voltage supply envelope.

Key Features

  • Core / Logic Capacity  Approximately 25,000 logic elements, providing programmable resources for custom logic, glue logic and mid-range FPGA functions.
  • Embedded Memory  Approximately 1.97 Mbits of on-chip RAM (1,966,080 bits) to support buffering, state storage and small data tables without external memory.
  • I/O Density  476 device I/Os to support wide bus interfaces, multiple peripheral connections and extensive signal routing within a single device.
  • Power  Operates from a low-voltage supply range of 0.95 V to 1.26 V, suitable for low-voltage system domains and modern power rails.
  • Package  1020-BBGA (FCBGA) package; supplier package listed as 1020-OFCBGA (33×33) for compact board-level integration where high I/O density is required.
  • Temperature & Mounting  Commercial-grade device rated for 0 °C to 85 °C, supplied in a surface-mount form factor for standard SMT assembly.
  • Compliance  RoHS compliant, meeting common environmental requirements for electronic assemblies.

Typical Applications

  • Embedded systems  Programmable logic and on-chip RAM enable custom control, signal processing and interface functions in embedded products.
  • Communications equipment  High I/O count supports complex peripheral interfacing and multi-channel signal routing in communications modules.
  • Consumer and industrial electronics (commercial use)  Useful for user interface controllers, peripheral aggregation and intermediate processing in commercial electronics.
  • Test & measurement  Flexible logic resources and embedded memory assist in creating custom measurement, data capture and control logic blocks.

Unique Advantages

  • High programmable capacity: 25,000 logic elements allow consolidation of multiple logic functions into a single device, reducing board-level BOM.
  • Substantial on-chip memory: Approximately 1.97 Mbits of embedded RAM supports buffering and local data storage without immediate need for external memory.
  • Extensive I/O availability: 476 I/Os provide flexibility for diverse peripheral connections and parallel interfaces in compact designs.
  • Compact FCBGA package: 1020-BBGA package delivers high pin density in a space-efficient footprint for modern PCB layouts.
  • Low-voltage operation: 0.95 V to 1.26 V supply range aligns with modern low-voltage system rails, helping reduce system power consumption.
  • RoHS compliant: Meets environmental compliance requirements for streamlined regulatory acceptance.

Why Choose LFSC3GA25E-5FFN1020CAAC?

The LFSC3GA25E-5FFN1020CAAC is positioned as a flexible, mid-range FPGA solution from Lattice Semiconductor Corporation that combines a significant logic element count, substantial embedded RAM and a very high I/O count in a compact ball-grid package. Its low-voltage operation and commercial temperature rating make it suitable for a wide range of commercial embedded designs where integration and I/O density are priorities.

Designers and system integrators looking to consolidate logic, reduce external components and maintain a compact PCB footprint will find this device suitable for scalable designs. The combination of on-chip resources and package density supports streamlined board-level integration and predictable performance within the specified supply and temperature ranges.

Request a quote or submit a sales inquiry to obtain pricing, availability and lead-time information for LFSC3GA25E-5FFN1020CAAC.

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