LFSC3GA25E-5FFA1020I

IC FPGA 476 I/O 1020BGA
Part Description

SC Field Programmable Gate Array (FPGA) IC 476 1966080 25000 1020-BBGA, FCBGA

Quantity 997 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package1020-OFcBGA Rev 2 (33x33)GradeIndustrialOperating Temperature-40°C – 105°C
Package / Case1020-BBGA, FCBGANumber of I/O476Voltage950 mV - 1.26 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs6250Number of Logic Elements/Cells25000
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits1966080

Overview of LFSC3GA25E-5FFA1020I – SC Field Programmable Gate Array, 25,000 Logic Elements, 476 I/Os

The LFSC3GA25E-5FFA1020I is an industrial-grade SC family FPGA from Lattice Semiconductor featuring a high-performance FPGA fabric with 25,000 logic elements. It pairs substantial on-chip memory and a high I/O count with advanced clocking and SERDES capabilities from the SC/M family to address communications, networking and embedded system designs that require dense I/O, flexible memory, and high-speed serial interfaces.

Key Features

  • FPGA Core  25,000 logic elements providing programmable logic capacity for mid-range system integration.
  • Embedded Memory  Approximately 1.97 Mbits of on-chip RAM (total RAM bits: 1,966,080) for data buffering, FIFOs and local storage.
  • I/O Density  476 I/Os to support high-pin-count designs and complex external interfacing.
  • High-Speed SERDES and Interfaces  SC/M family features include 4 to 32 high-speed SERDES with performance from 600 Mbps to 3.8 Gbps and embedded PCS options for common serial standards.
  • High-Performance I/O (PURESPEED)  Support for differential I/O up to 2 Gbps DDR and programmable Input Delay (144-tap INDEL) per I/O for precise data alignment.
  • Clocking and Timing  Family-level clocking features include multiple analog PLLs and DLLs, primary and secondary high-frequency clocks, and up to 1 GHz I/O edge clocks for tight timing control.
  • Power and Voltage  Nominal supply range 0.95 V to 1.26 V suitable for low-voltage core operation.
  • Package and Mounting  1020-BBGA FCBGA package (1020-OFcBGA Rev 2, 33×33), surface-mount for high-density board integration.
  • Industrial Temperature Range  Rated for operation from −40 °C to 105 °C for reliable performance in industrial environments.
  • Standards & System Support  Family-level features include IEEE 1149.1 boundary scan and IEEE 1532 in-system configuration for test and reconfiguration.
  • RoHS Compliance  Device is RoHS compliant.

Typical Applications

  • Communications & Networking  High-speed SERDES and dense I/O make the device suitable for packet processing, line cards and network interface subsystems.
  • High-Speed Data Transport  Use for bridging and protocol adaptation where multi-gigabit serial links and robust I/O timing are required.
  • Industrial Control & Automation  Industrial temperature rating and flexible I/O support motor control, deterministic I/O aggregation and complex sensor interfaces.
  • Embedded System Integration  On-chip memory and logic density enable local processing, protocol handling and hardware acceleration in compact designs.

Unique Advantages

  • High I/O Capacity: 476 I/Os let you connect numerous peripherals and interfaces without external I/O expanders, reducing board complexity.
  • Balanced Logic and Memory: 25,000 logic elements combined with approximately 1.97 Mbits of embedded RAM supports both control logic and data buffering on-chip.
  • High-Speed Serial Support: Family SERDES and PCS capabilities enable implementation of multi-gigabit links and common serial protocols with built-in pre-emphasis and equalization.
  • Robust Timing Infrastructure: Multiple PLLs/DLLs and high-frequency clocking options provide precise timing control for demanding interfaces and high-speed I/O.
  • Industrial Reliability: Specified −40 °C to 105 °C operation and a BGA surface-mount package support deployment in industrial environments.
  • Compact, High-Density Package: 1020-BBGA (33×33) package offers a small footprint for designs that demand high pin count in a compact board area.

Why Choose LFSC3GA25E-5FFA1020I?

The LFSC3GA25E-5FFA1020I delivers a balanced combination of mid-range logic capacity, substantial embedded memory and high I/O density in an industrial-grade package. It is positioned for designers who need a programmable platform that supports high-speed serial interfaces, precise timing control and reliable operation across a broad temperature range.

Choose this device when your design requires integrated memory for buffering, a high number of I/Os for complex external connectivity, and SC/M family clocking and SERDES capabilities to implement robust communications or embedded control functions with reduced external component count.

Request a quote or submit a procurement inquiry to obtain pricing and availability for the LFSC3GA25E-5FFA1020I.

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